A circuit board for a light emitting module, comprises a plurality of mounting positions for LEDs, wherein the mounting positions are distributed in a regular two-dimensional pattern on a first surface side of the circuit board. The circuit board is characterized by (i) a plurality of transparent domains, each transparent domain extending around one mounting position of the plurality of mounting positions, and (ii) a plurality of thermally conductive domains, each thermally conductive domain being electrically and thermally connected to at least one mounting position. An average area of the electrically conductive domains is at least 2% of an average area of the transparent domains. Each thermally conductive domain of the plurality of thermally conductive domains comprises at least a portion, which extends as a two-dimensional area on a surface of the circuit board.

High-brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion are provided. In one aspect, a high brightness package for a light emitter (e.g., a LED or LED chip) can include a body and a cavity disposed in the body. The cavity can include at least one cavity wall extending toward an intersection area of the body where the cavity wall intersects a cavity floor. The package can further include at least one electrical element having first and second surfaces, each of the first and second surfaces proximate the intersection area. The first surface can be disposed on a first plane and the second surface can be at least partially disposed on a second plane that is different than the first plane. The body can at least substantially cover the second surface.

A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on a portion of the first semiconductor layer, a second semiconductor layer disposed on the active layer, a first conductive layer disposed on a portion of the first semiconductor layer, a second conductive layer disposed on the second semiconductor layer, and an insulating layer overlapping the first semiconductor layer, the second semiconductor layer, and the reflection pattern, in which the insulating layer has a first region having different thicknesses and a second region having a substantially constant thickness.

A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).

A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member.

An optical device includes a semiconductor element configured to emit emission light or to receive incident light, including a first fitting part including a portion having a convex shape in a first region; an optical member arranged on an optical path of the emission light emitted from the semiconductor element or the incident light entering the semiconductor element, including a second fitting part fitted to at least a part of the portion having the convex shape, the first region being opposed to the optical member; and a joint part that joins the semiconductor element and the optical member, arranged between the first fitting part and the second fitting part.

A light emitting device includes: a package equipped with a lead that has an upper surface and a lower surface, and has a metal board and a plating layer formed on a surface of the metal board, the plating layer including a first plating layer provided to an upper surface of the metal board, and a second plating layer provided to a lower surface of the metal board, the first plating layer including nickel plating layer, gold plating layer and silver plating layer, and the second plating layer including no nickel plating layer and gold plating layer, and a molded resin that holds the lead; a light emitting element mounted in the package; and a sealing member that seals the light emitting element.

A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.

A method of making an LED device and an LED device using a high-silica, fully-sintered glass substrate is provided. The high-silica substrate is at least 99% silica and is thin, such as less than 200 m in thickness. A phosphor containing layer is deposited on to the substrate and is laser sintered on the substrate such that a portion of the sintered phosphor layer embeds in the material of the substrate.