A display device may include: a base layer including a plurality of islands, at least one first bridge configured to connect the islands in a first direction, and at least one second bridge configured to connect the islands in a second direction; and at least one pixel including a plurality of sub-pixels in the base layer. Each of the sub-pixels may include: a first electrode and a second electrode in one island of the islands and spaced from each other; a third electrode and a fourth electrode in one bridge of the at least one first bridge and the at least one second bridge and spaced from each other; at least one first light emitting element between the first electrode and the second electrode; and at least one second light emitting element between the third electrode and the fourth electrode.

A semiconductor light emitting element (10) includes flat plate-shaped translucent element substrate (11) with two main surfaces (11A, 11B) facing each other, light emitting semiconductor layer (12) formed on one main surface (11A) of element substrate (11) and in which n-type semiconductor layer (13), light emitting layer (14), and p-type semiconductor layer (15) are laminated, n-electrode (16) connected to n-type semiconductor layer (13) through at least one hole portion (12A) leading to n-type semiconductor layer (13) and provided on p-type semiconductor layer (15) being electrically separated from p-type semiconductor layer (15) by insulating film (18), first element electrode (19) electrically connected to n-electrode (16) and provided to extend in first direction, and second element electrode (20) electrically connected to p-type semiconductor layer (15) and provided to extend in first direction while being spaced apart from first element electrode (19), where thickness of element substrate (11) is 100 m or less.

Provided are: a film for a wavelength conversion sheet having superior close adhesion to a phosphor layer when used for a wavelength conversion sheet, a wavelength conversion sheet having the film; and a backlight and a display device having the wavelength conversion sheet. A film (10) for a wavelength conversion sheet having: a base material (20); and a primer layer (30) on the base material (20), wherein the primer layer (30) includes a cured product of a resin composition including a polyurethane-based resin, and the cured product has a softening point of 250 C. or higher.

A display module is provided. The display module includes a light modulation layer, and the light modulation layer is located between a color film layer and a display substrate. The light modulation layer includes a plurality of modulation portions, and a modulation portion is correspondingly disposed between a light-emitting portion and a color film portion. The modulation portion includes a modulation structure and a transmission structure. The color film portion includes a first region and a second region. An orthogonal projection of the transmission structure on the corresponding color film portion is located within the first region. The second region is adjacent to another color film portion of a different color, and an orthogonal projection of the modulation structure on the corresponding color film portion is located in the second region. The modulation structure is used to converge exit light of the corresponding light-emitting portion.

In an embodiment an optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface, a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and including a stack of at least two conversion layers and a reflective element laterally surrounding the optoelectronic semiconductor chip, wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface, wherein the conversion element includes a part laterally extending beyond the radiation exit surface and being concavely curved, wherein the conversion element is partly arranged on the reflective element, and wherein the conversion element is arranged on a concavely curved surface of the reflective element.

A light emitting device package includes a package substrate, a semiconductor light emitting device on the package substrate, the semiconductor light emitting device including a substrate with a light emitting structure, a wavelength conversion portion on the semiconductor light emitting device, the wavelength conversion portion including a first region overlapping the light emitting structure, and a second region other than the first region, an adhesive layer between the semiconductor light emitting device and the wavelength conversion portion, and a reflective resin portion on the package substrate, the reflective resin portion surrounding the semiconductor light emitting device and the wavelength conversion portion, and the reflective resin portion extending to the second region.

A wavelength conversion element includes a substrate, reflection layer on the substrate, wavelength conversion layer in the reflection layer and converting a light in a first wavelength range into a light in a second wavelength range, structure in the wavelength conversion layer and scattering a part of the light in the first wavelength range, and optical layer in the structure, reflecting a part of the light in the first wavelength range, transmitting another part of the light in the first wavelength range, and transmitting the light in the second wavelength range. The structure includes a first structure portion, second structure portion, and planar portion between the first and second structure portions, the optical layers in the first and second structure portions have first reflectance for the light in the first wavelength range, and the optical layer in the planar portion has second reflectance.

An image display device includes a drive circuit substrate, micro LED elements, and a wavelength conversion layer that converts excitation light emitted from the micro LED elements and that emits converted long-wavelength light to a side opposite to the drive circuit substrate, the micro LED elements and the wavelength conversion layer being sequentially stacked on the drive circuit substrate. The micro LED elements include a first multilayer film that reflects the long-wavelength light converted by the wavelength conversion layer.

The present invention is applicable to display device-related technical fields and relates to, for example, a display device using a micro light-emitting diode (LED). The present invention may comprise: a substrate; partition walls which are arranged on the substrate to define a plurality of hexagonal unit pixel areas forming a honeycomb shape; semiconductor light-emitting elements each of which is disposed in each of the unit pixel areas to form each unit pixel; color conversion layers which convert light emitted from the semiconductor light-emitting elements into colors corresponding to the respective unit pixel areas; a porous layer which is disposed on the partition walls and in which a plurality of through-holes are formed; and color filter layers which are disposed on the porous layer.

The present disclosure discloses a display substrate, including a substrate, and a driver circuit, an insulation layer and a bonding electrode sequentially superposed on the substrate. The bonding electrode is configured to be connected to an anode and a cathode of a micro inorganic light-emitting diode chip to be bonded. The display substrate further includes an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate. The present disclosure provides a display panel, including the above display substrate, and further including a micro inorganic light-emitting diode chip having an anode and a cathode thereof connected to the bonding electrode on the display substrate.