Described are various embodiments of a flight management method and system using same. In one embodiment, a digital flight management system comprises: a digital processing environment comprising instructions to access: flight request data related to a flight plan; aircraft parameter data; a flight risk data source; and geographical data. The instructions are executable to: calculate a predicted flight path; digitally compare the predicted flight path with flight risk data from the flight risk data source to assess a flight risk associated with the predicted flight path; and display via a user interface the predicted fight path in accordance with the flight risk.

Systems and methods for dynamically adjusting a legend are provided. One system comprises a display unit; a user input device configured to receive a first input indicating a first altitude value; one or more processors; and a memory configured to store one or more programs, the one or more programs being configured for execution by the one or more processors and including instructions for: retrieving weather information corresponding to the first input; generating a command signal for displaying a legend having a color-code or shading-code associated with a plurality of attributes included in the retrieved weather information; and displaying the legend, on the display unit, in association with the retrieved weather information.

Methods and systems are provided for assisting operation of an aircraft when diverting from a flight plan using a comparative vertical profile display. A vertical profile display includes a first graphical representation of a first vertical profile corresponding to a first lateral route defined by a flight plan for the aircraft and a second graphical representation of a second vertical profile corresponding to a modified lateral route different from the first lateral route displayed concurrently on the vertical profile display. The first vertical profile corresponding to the first lateral route is depicted on the vertical profile display in a first plane and the second vertical profile corresponding to the modified lateral route is depicted on the vertical profile display in a second plane different from the first plane.

In some embodiments, a non-transitory computer-readable medium having logic stored thereon is provided. The logic, in response to execution by one or more processors of an unmanned aerial vehicle (UAV), causes the UAV to perform actions comprising receiving at least one ADS-B message from an intruder aircraft; generating a intruder location prediction based on the at least one ADS-B message; comparing the intruder location prediction to an ownship location prediction to detect conflicts; and in response to detecting a conflict between the intruder location prediction and the ownship location prediction, determining a safe landing location along a planned route for the UAV and descending to land at the safe landing location.

A method for fabricating epitaxial light control features, without reactive ion etching or wet etching, when active layers are included. The epitaxial light control features comprise light extraction or guiding structures integrated on an epitaxial layer of a light emitting device such as a light emitting diode. The light extraction or guiding structures are fabricated on the epitaxial layer using an epitaxial lateral overgrowth (ELO) technique. The epitaxial light control features can have many different shapes and can be fabricated with standard processing techniques, making them highly manufacturable at costs similar to standard processing techniques.

A display device includes a circuit substrate and at least one light emitting diode (LED) packaging structure electrically connected to the circuit substrate. Each of the at least one LED packaging structure includes a plurality of LEDs, a plurality of transparent packaging structures, a molding layer, a redistribution structure and a common electrode. Each LED includes a first electrode, a semiconductor stack structure and a second electrode stacked with each other. The transparent packaging structures respectively surround the LEDs. The molding layer surrounds the transparent packaging structures. The redistribution structure is located on a first side of the molding layer and is electrically connected to the first electrodes of the LEDs. The common electrode is located on a second side of the molding layer and is electrically connected to the second electrodes of the LEDs.

A display panel, a tiled display panel and a manufacturing method of display panel are provided. The display panel includes a substrate; a light-shielding layer disposed on the substrate and provided with a plurality of through-holes; a transparent insulation layer including transparent portions arranged in the through-holes respectively; a light-emitting layer disposed on the transparent insulation layer, wherein the light-emitting layer includes a plurality of light-emitting diode (LED) chips are disposed to the plurality of through-holes in a one-to-one correspondence, and a light-emitting surface the LED chip faces to the transparent portion; a device array layer disposed on the light-shielding layer and including a driver and a plurality of metal wirings used to connect the LED chips with the driver; and a sealing layer disposed on the substrate and encapsulating the light-shielding layer, the transparent insulation layer, the light-emitting layer, and the device array layer.

This application discloses a pixel unit for semiconductor device and a manufacturing method, a micro display screen, and a discrete device, the pixel unit includes a target drive circuit, a display unit, and a common cathode, the backplane is provided with a drive circuit, and the drive circuit is provided with at least one anode; the display unit is provided on the backplane, it includes a first device layer and a second device layer stacked vertically from bottom to top, the first device layer and the second device layer are respectively connected to the corresponding anodes of the backplane; the common cathode is respectively connected to each device layer in the display unit, and the common cathode is connected to the external cathode.

Disclosed are a semiconductor structure, a manufacturing method of a semiconductor structure, and a light-emitting device. The semiconductor structure includes: a light-emitting structure including a plurality of light-emitting units, where an insulating structure is disposed between adjacent two light-emitting units; and a light-control layer, disposed on a side of the light-emitting structure, including a plurality of light-control regions regularly disposed and a substrate structure disposed between adjacent two light-control regions, one light-control region corresponding to at least one light-emitting unit, where the substrate structure includes a growth substrate layer structure and an etching stop layer structure stacked along a direction away from the light-emitting structure.

Disclosed are a semiconductor structure and a manufacturing method for the semiconductor structure. The semiconductor structure includes a light-emitting structure; a light control layer disposed on a side of the light-emitting structure, including a plurality of light control regions regularly arranged and a substrate structure located between the plurality of light control regions; where the plurality of light control regions include a wavelength conversion structure, and the wavelength conversion structure includes a quantum dot and a porous structure adsorbed with the quantum dot. In the present disclosure, the plurality of light control regions and the substrate structure are provided to ensure uniform light output, good directionality, high light extraction rate, and avoidance of light crosstalk in each light control region. The porous structure is utilized to adsorb the quantum dot and achieve a full color display, thereby improving resolution, simplifying a manufacturing process and reducing costs.