H10F19/908

Solar cell module

A solar cell module includes a plurality of solar cells each including a substrate, an emitter region positioned at a back surface of the substrate, first electrodes electrically connected to the emitter region, second electrodes electrically connected to the substrate, a first current collector positioned at ends of the first electrodes, and a second current collector at ends of the second electrodes, and a first connector connecting a first current collector of a first solar cell of the plurality of solar cells to a second current collector of a second solar cell adjacent to the first solar cell. The first current collector of the first solar cell and the second current collector of the second solar cell each have a different polarity.

Flexible connectors of building integrable photovoltaic modules for enclosed jumper attachment

Provided are novel Building Integrable Photovoltaic (BIPV) modules having one or more connectors that are movable between extended and retracted positions. Connector adjustment may be performed in the field, for example, during installation of a module. In certain embodiments, a connector includes a connector body and extension body. The extension body flexibly attaches the connector body to the module and allows the connector body to move with respect to the module edge. In an extended position, the connector body is positioned closer to the edge and is configured to make electrical connections to a joiner connector for interconnecting with an adjacent module. In a retracted positioned, the connector body is positioned further from the edge and is configured to make electrical connections to a jumper for interconnecting the conductive elements of the connector. In certain embodiments, a jumper does not protrude beyond the edge when connected to the connector body.

PREVENTING HARMFUL POLARIZATION OF SOLAR CELLS

In one embodiment, harmful solar cell polarization is prevented or minimized by providing a conductive path that bleeds charge from a front side of a solar cell to the bulk of a wafer. The conductive path may include patterned holes in a dielectric passivation layer, a conductive anti-reflective coating, or layers of conductive material formed on the top or bottom surface of an anti-reflective coating, for example. Harmful solar cell polarization may also be prevented by biasing a region of a solar cell module on the front side of the solar cell.

SOLAR CELL MODULE
20250120188 · 2025-04-10 ·

Examples provide a solar cell module comprising a first solar cell string, wherein the first solar cell string includes a first solar cell and a second solar cell electrically connected in series, wherein the first solar cell and the second solar cell are electrically connected via a plurality of parallel connecting wires; and an interconnector crossing at least some of the connecting wires, in particular being arranged perpendicular to the connecting wires, and electrically connecting the at least some connecting wires; wherein the interconnector comprises an interconnector core having a first surface facing the connecting wires and a second surface; wherein the first surface is covered with a first coating and the second surface is covered with a second coating, wherein the first coating is thicker than the second coating.

SOLAR CELL AND SOLAR CELL ASSEMBLY
20170040482 · 2017-02-09 · ·

Solar cell assembly that includes at least first and second solar cells arranged adjacent each other to form a row. First electric contact pad of first solar cell is positioned adjacent to second electric contact pad of second solar cell and second electric contact pad of first solar cell is positioned adjacent to first electric contact pad of second solar cell. Interconnectors connect each first electric contact pad of first solar cell with adjacent second electric contact pad of second solar cell and each second electric contact pad of first solar cell with adjacent first electric contact pad of second solar cell. Each interconnector is sized so that, between adjacent cells, interconnector is below first electric contact pad. Cover glass is provided on a front surface of each solar cell, and each interconnector is provided with a cover member covering a front surface of interconnector.

Solar cell module and method of manufacturing the same
09564547 · 2017-02-07 · ·

A solar cell module and a method of manufacturing the same are discussed. The solar cell module includes a plurality of back contact solar cells, an interconnector that is positioned on back surfaces of the plurality of back contact solar cells and electrically connects adjacent back contact solar cells to one another, upper and lower protective layers for protecting the plurality of back contact solar cells, a transparent member that is positioned on the upper protective layer on light receiving surfaces of the plurality of back contact solar cells, and a back sheet that is positioned under the lower protective layer on surfaces opposite the light receiving surfaces of the plurality of back contact solar cells. The upper protective layer and the lower protective layer are formed of different materials.

PREVENTING HARMFUL POLARIZATION OF SOLAR CELLS

In one embodiment, harmful solar cell polarization is prevented or minimized by providing a conductive path that bleeds charge from a front side of a solar cell to the bulk of a wafer. The conductive path may include patterned holes in a dielectric passivation layer, a conductive anti-reflective coating, or layers of conductive material formed on the top or bottom surface of an anti-reflective coating, for example. Harmful solar cell polarization may also be prevented by biasing a region of a solar cell module on the front side of the solar cell.

SOLAR CELL
20170033242 · 2017-02-02 · ·

Disclosed is a solar cell including a semiconductor substrate, a conductive area including first and second conductive areas disposed on one surface of the semiconductor substrate, and an electrode including a first electrode connected to the first conductive area and a second electrode connected to the second conductive area. The electrode includes an adhesive layer disposed on the semiconductor substrate or the conductive area, an electrode layer disposed on the adhesive layer and including a metal as a main component, and a barrier layer disposed on the electrode layer and including a metal that is different from the metal of the electrode layer as a main component. The electrode layer has a thickness greater than a thickness of each of the adhesive layer and the barrier layer, and the barrier layer has a higher melting point than a melting point of the electrode layer.

Laser soldering systems and methods for joining crystalline silicon solar batteries
09559248 · 2017-01-31 · ·

The disclosure includes a laser soldering method of connecting crystalline silicon solar batteries. Methods can include placing conductive soldering strips and crystalline silicon solar batteries on a lower press plate and aligning the conductive soldering strips on metal electrodes of crystalline silicon solar batteries. Methods can also include placing an upper press plate on the conductive soldering strips and the crystalline silicon solar batteries and vacuuming between the upper and lower press plates such that absolute pressure between the upper and lower press plates is less than atmospheric pressure. Methods can also include laser soldering the conductive soldering strips and the crystalline silicon solar batteries.

Fast process flow, on-wafer interconnection and singulation for MEPV

A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.