A method for manufacturing a solar cell module that includes a solar cell based on a semiconductor substrate with front and rear surfaces, includesfabricating a solar cell from the substrate, anddepositing on at least the rear surface a coating layer.

The deposition step includes applying a coating powder on at least the rear surface, forming an adhered powder layer on said surface.

The method includes after the deposition step: performing a first annealing process on the solar cell module for transforming the adhered powder layer in a pre-annealed coating layer.

Further the method includescreating open contacting areas on the solar cell by removal of the adhered powder layer at locations of contacting areas on the solar cell , wherein the removal precedes the first annealing process, or by masking contacting areas on the solar cell 1, wherein the masking precedes the deposition step.

A string of shingled solar cells is disclosed. The string of shingled solar cells has flexible joints connecting the solar cells made from cured liquid polymeric adhesive. An electrically conductive interconnect passes through the flexible joint. The string of shingled solar cells also has interconnect reinforcements made from cured liquid polymeric adhesive to improve interconnect adhesion to the front surface of the solar cells.

The present disclosure provides a non-solder pad ultrafine main busbar back-contact solar cell, a back-contact solar cell module, and a preparation method, wherein the back-contact cell includes a first finger and a second finger, a first main busbar line, a second finger, a first insulation layer, and a second insulation layer, wherein the widths of the first main busbar line and the second main busbar line in the X-axis direction are each independently 10-100 m; the first main busbar lines or the second main busbar lines are respectively provided in an extending manner or at intervals along the same axis perpendicular to the corresponding fingers connected thereto, and when spaced apart, the distance L between two adjacent corresponding main busbar lines in the Y-axis direction is 5-100 mm.

A conductive interconnection member includes: a conductive layer (1), and an insulating layer (4) and electrical connectors (2) located on one side of the conductive layer (1). The conductive layer (1) is provided with a conductive circuit; the insulating layer (4) is provided with openings (41), and the electrical connectors (2) are located in the openings (41) of the insulating layer (4); the electrical connectors (2) include a first electrical connector (21) and a second electrical connector (22); the first electrical connector (21) is used to be electrically connected to a first electrode (31) of a back contact solar cell (3) and the conductive circuit; the second electrical connector (22) is used to be electrically connected to a second electrode (32) of a back contact solar cell (3) and the conductive circuit; and the polarities of the first electrode (31) and the second electrode (32) are opposite.

A method for manufacturing a solar cell module includes a cell forming operation of forming a plurality of first and second electrodes on a back surface of a semiconductor substrate to form each a plurality of solar cells, and a tabbing operation including at least one of a connection operation of performing a thermal process to respectively connect a first conductive line and a second conductive line to the first electrodes and the second electrodes of each solar cell using a conductive adhesive and an optional string forming operation of performing a thermal process to connect the first conductive line included in one solar cell and the second conductive line included in other solar cell adjacent to the one solar cell to an interconnect. The tabbing operation includes at least two thermal processes each having a different maximum temperature.

Photovoltaic module with a back side conductive substrate (10) and a plurality of PV-cells (2) having back contacts and being arranged in an array on a top surface of the back side conductive substrate (10). A circuit of series and/or parallel connected PV-cells (2) is formed by connections (8) between the back contacts and the back side conductive substrate (10). A plurality of by-pass diodes (5) are present having back contacts (6a, 6b) in electrical contact with the circuit of series and/or parallel connected PV-cells (2), wherein the by-pass diodes (5) are positioned on empty parts (4) of the top surface of the back side conductive substrate (10). Each by-pass diode is a wafer based diode and is connected in parallel with one or more PV-cells (2).

A balloon comprises an envelope containing a lifting gas and a concentrated solar radiation solar generator. The solar generator includes a reflector, one or two arrays of photovoltaic solar cells forming a first active face directed towards the reflector and a second active face directed towards the exterior of the envelope of the balloon. The reflector, the first active face and the second active face of the array of photovoltaic cells are configured so as to ensure the first active face and the second active face of the array both generate electrical power provided that the rollwise solar misalignment of the reflector is smaller than or equal to 10 degrees in absolute value.

A solar cell and a solar cell module are disclosed. The solar cell includes a semiconductor substrate, an emitter region extending in a first direction, a back surface field region extending in the first direction in parallel with the emitter region, a first electrode connected to the emitter region and extending in the first direction, and a second electrode connected to the back surface field region and extending in the first direction. The first electrode has different linewidths at two positions that are separated from each other in the first direction. The second electrode has different linewidths at two positions that are separated from each other in the first direction. A linewidth of the first electrode and a linewidth of the second electrode are different from each other at two positions that are separated from each other in a second direction crossing the first direction.

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

A solar cell includes: a first bus bar electrode disposed on a first end portion of the solar cell, and to which the wiring member is connected; a second bus bar electrode disposed on a second end portion of the solar cell, and to which the wiring member is connected; first finger electrodes disposed on the solar cell, electrically connected to the first bus bar electrode, and extending in a first direction toward the second bus bar electrode; second finger electrodes disposed on the solar cell, electrically connected to the second bus bar electrode, and extending in a second direction toward the first bus bar electrode. Each first finger electrode has a thickness which decreases as a distance to the second bus bar electrode decreases, and each second finger electrode has a thickness which decreases as a distance to the first bus bar electrode decreases.