Patent classifications
H10F19/908
Method for manufacturing novel busbarless solar photovoltaic module
The present invention discloses a method for manufacturing a novel busbarless solar photovoltaic module and relates to the technical field of solar photovoltaic device manufacturing. The present invention uses a metal connecting ribbon to connect a cell and the front and back of the cell are designed to remove PAD points, which reduces optical occlusion on the surface of the cell and costs, and by using fixtures and manipulators to weld the metal connecting ribbon and the cell into a cell string and by applying and curing an adhesion point on the metal connecting ribbon of the cell string, the risk of unstable connection is completely eliminated. In addition, the requirement for alignment between the metal connecting ribbon and a finger of the cell is reduced, thereby simplifying the manufacturing process of the cell string.
Photovoltaic module assembly
A photovoltaic (PV) module (1) comprising a positive terminal (5), a negative terminal (6), and at least two sub-modules. Each of the at least two sub-modules (10a-c) comprises x parallel-connected sub-strings (13), wherein each of the x parallel-connected sub-strings (13) comprises y series-connected sub-cells (16), wherein the y series-connected sub-cells (16) are arranged in an array. The PV module (1) further comprises a back conductive sheet having a first connection pattern arranged for connecting the x parallel-connected sub-strings (13) of each of the at least two sub-modules (10a-c), wherein each of the at least two sub-modules (10a-c) is provided with a power optimizer circuit (21a-c), and the output of the power optimizer circuits (21a-c) are connected in series between the positive terminal (5) and the negative terminal (6).
Prefabricated conductors on a substrate to facilitate corner connections for a solar cell array
A substrate for solar cells is fabricated such that an area of the substrate remains exposed when at least one solar cell having at least one cropped corner that defines a corner region is attached to the substrate; the area of the substrate that remains exposed includes one or more conductors printed on the substrate; and electrical connections between the solar cell and the conductors are made in the corner region resulting from the cropped corner of the solar cell. The substrate may also include buried conductors for making series connections that determine a flow of power through a plurality of solar cells, including corner-to-corner and column-to-column connections for the plurality of solar cells that are attached to the substrate in a two-dimensional (2-D) grid of an array. The substrate may also be covered by a polyimide overlay for preventing electrostatic discharge (ESD).
Wire-based metallization and stringing for solar cells
Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.
Passivated contact structure and solar cell comprising the same, cell assembly, and photovoltaic system
A cell assembly includes a first doped region. The first doped region includes a first passivated contact region disposed on the silicon substrate, and a second passivated contact region disposed on the first passivated contact region. The first passivated contact region includes a first doped layer, a first passivation layer, and a second doped layer. The second passivated contact region includes a second passivation layer and a third doped layer. The second passivated contact region includes an opening for connecting a conductive layer of the solar cell to the first passivated contact region.
BACK CONTACT SOLAR CELL AND PHOTOVOLTAIC MODULE
The present application discloses a back contact solar cell and a photovoltaic module. An example back contact solar cell includes: a semiconductor substrate, a first doped region, a second doped region, and at least one conductive semiconductor structure. The first doped region and the second doped region are alternately spaced apart on a back surface of the semiconductor substrate. Each conductive semiconductor structure is at least partially located between the first doped region and the second doped region, and only a part of the first doped region and only a part of the second doped region are in electrical contact with at least one conductive semiconductor structure respectively. A width of a spacing region located between the first doped region and the second doped region is D1. A width of the conductive semiconductor structure along an extension direction of the spacing region is W, and 0.5D1W6D1.
SOLAR BATTERY MODULE
A solar battery module which eliminates a difference in electromotive force of a solar battery cell on a rear side caused by a wiring material of a solar battery cell on a front side. The solar battery module comprises a first solar battery cell; a first current collector member that is connected to the first solar battery cell and is disposed on a rear side of the first solar battery cell; and a plurality of second solar battery cells that are disposed on a rear side of the first solar battery cell and the first current collector member and are different in absorption wavelength from the first solar battery cell. The second solar battery cell that overlaps the first current collector member in a plan view is exposed from the first solar battery cell in the plan view.
SOLAR CELL, SOLAR CELL STRING, AND PHOTOVOLTAIC MODULE
The present application provides a solar cell, a solar cell string, and a photovoltaic module. The solar cell includes a first and a second doped region disposed on a surface of a substrate. Each of the first and the second doped region includes a main part and finger-shaped parts connected to the main part. An insulation layer is disposed at a position where a first finger-shaped part of the first doped region close to a second main part of the second doped region. A first sub-grid is disposed on and electrically connected to the first finger-shaped part. The insulation layer covers an end portion of the first sub-grid close to the second main part, covers at least an end portion of the first finger-shaped part close to the second main part, and extends to and fills a gap region between the first finger-shaped part and the second main part.
BACK CONTACT SOLAR CELL, PREPARATION METHOD THEREFOR, AND PHOTOVOLTAIC MODULE
The present application discloses a back contact solar cell, a preparation method therefor, and a photovoltaic module. In one example, a back contact solar cell includes a substrate, a first doped layer and a second doped layer alternately arranged on a first surface of the substrate. A doping type of the first doped layer is opposite to a doping type of the second doped layer. A first isolation region is provided between an edge of the substrate and a boundary of the first doped layer adjacent to the edge, a second isolation region is provided between the edge of the substrate and a boundary of the second doped layer adjacent to the edge. A width of at least a portion of the first isolation region is greater than a width of at least a portion of the second isolation region.
Method for Manufacturing Back Contact Cell Assembly
Disclosed is a method for manufacturing a back contact cell assembly, including: providing a plurality of cells, wherein each of the cells has a front surface and a back surface opposite to each other; the back surface has a first doped layer and a second doped layer having opposite doping polarities; and the first doped layer and the second doped layer extend in a first direction and are alternately distributed in a second direction, the first direction intersecting with the second direction; circumferentially arranging the cells multiple times at an outer periphery of a mandrel in a first peripheral placement direction, so as to obtain a first cell preform having multiple turns of cell groups, adjacent cell groups being distributed at intervals in a height direction of the mandrel; winding a solder ribbon at the outer periphery of the first cell preform, so that the solder ribbon is in contact with each cell, and the angle between the winding direction of the solder ribbon and the first peripheral placement direction is an acute angle; and segmenting the solder ribbon into a plurality of sub-solder ribbons along a target position, so that each sub-solder ribbon is connected to the first doped layer of a different one of the cells and the second doped layer of an adjacent one of the cells, and the plurality of cells are connected by means of the sub-solder ribbon to form a cell string.