Back side connection layer for a photo-voltaic module comprising a plurality of PV-cells (i,j), the plurality PV-cells (i,j) being of a type having one or more back side contacts and divided in a preset number of strings (3) of series connected PV-cells (i. j). By-pass diodes are connectable in parallel to each of the preset number of strings (3), and three or more strings (3) are provided. The plurality of PV-cells (i,j) are positioned such that electrical connections to the first PV-cell and last PV-cell of each of the preset number of strings (3) are provided in a part of the back side connection layer overlapping a part of a two-by-two arrangement of PV-cells (i,j).

Back side connection layer for a photo-voltaic module with a plurality of PV-cells (1, 2). The PV-cells (1, 2) are of a type having a plurality of back side contacts (11, 12). A by-pass diode connection path (6) is formed in the back side connection layer (3) along an edge direction of two adjacent cells (1, 2) with a straight or meandering pattern around outer contacts (4, 5) of the plurality of back side contacts (11, 12) of the two adjacent cells (1, 2).

Photovoltaic module with a negative terminal (5) and a positive terminal (6), and a parallel connection (3, 4) of m sub-modules (2) connected to the negative and the positive terminal (5, 6) of the photovoltaic module (1). Each of the m sub-modules (2) has a string of n series-connected back-contact cells (9), wherein the n cells (9) of each sub-module (2) are arranged in an array. The parallel connection (3, 4) and connections (8) for each string of n series-connected back contact cells (9) are provided in a back conductive sheet, and the back conductive sheet comprises designated areas (7) for the parallel connection (3, 4), corresponding to edge parts of each corresponding sub-module (2).

A solar cell module is disclosed. The solar cell module includes a plurality of solar cells, a front transparent substrate located in a front surface of the plurality of solar cells, a back transparent substrate located on a back surface of the plurality of solar cells, a front protection unit located between the front transparent substrate and the plurality of solar cells, and a back protection unit located between the back transparent substrate and the plurality of solar cells. The back transparent substrate includes an anti-reflection layer.

Solar cells having a plurality of sub-cells coupled by metallization structures having a metal bridge, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, the metal bridge can provide structural support and provide for an electrical connection between a first contact pad and a first busbar. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between and where the metal bridge can be perpendicular to the groove. The solar cell can include a first contact pad adjacent to a second contact pad.

Solar cell interconnects with multiple current paths. A solar cell interconnect may include a plurality of in-plane slits arranged in several rows. The in-plane slits may be spaced to provide strain relief without unduly increasing the electrical path resistance through the solar cell interconnect. The in-plane slits may be staggered, for example.

A solar cell and a solar cell module including a plurality of solar cells are discussed. The solar cell according to an embodiment includes a substrate of a first conductive type, an emitter layer of a second conductive type opposite the first conductive type disposed on the substrate, a plurality of first electrodes electrically connected to the emitter layer, a second electrode electrically connected to the substrate, a first current collector electrically connected to the plurality of first electrodes, and a second current collector electrically connected to the second electrode. The second current collector includes a plurality of second electrode current collectors electrically connected to the second electrode, and a current collector connector for connecting the plurality of second electrode current collectors to one another.

Light receiving elements of a back connection type including first and second electrodes on their back sides are connected by an inter-element connecting body including a tabular main body section and an inter-element connecting section to form a light receiving element module. The main body section is selectively directly connected to the first electrode and arranged on the second electrode via an insulating layer. The main body section covers substantially the entire back side of each of the light receiving elements excluding a part of the second electrode. The second electrode is connected to the inter-element connecting section of an adjacent light receiving element. The main body section forms a reflecting section between the main body section and the light receiving element to enable reflected light to be made incident on the light receiving element from a gap between the first and second electrodes.

Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.

Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.