A method of fabricating the gate structure in a semiconductor device includes forming a gate dielectric layer over a semiconductor substrate. A capping layer is formed over the gate dielectric layer. The capping layer is treated with a first hydrogen plasma to form a first-treated capping layer. A gate electrode is formed over the first-treated capping layer. The method may further includes treating the first-treated capping layer with a nitrogen plasma.

Roughly described, a field effect transistor has a first piezoelectric layer supporting a channel, a second piezoelectric layer over the first piezoelectric layer, a dielectric layer having a plurality of dielectric segments separated by a plurality of gaps, the dielectric layer over the second piezoelectric layer, and a gate having a main body and a plurality of tines. The main body of the gate covers at least one dielectric segment of the plurality of dielectric segments and at least two gaps of the plurality of gaps. The plurality of tines have proximal ends connected to the main body of the gate, middle portions projecting through the plurality of gaps, and distal ends separated from the first piezoelectric layer by at least the second piezoelectric layer. The dielectric layer exerts stress, creating a piezoelectric charge in the first piezoelectric layer, changing the threshold voltage of the transistor.

Metal-oxide-semiconductor (MOS) transistors with reduced subthreshold conduction, and methods of fabricating the same. Transistor gate structures are fabricated in these transistors of a shape and dimension as to overlap onto the active region from the interface between isolation dielectric structures and the transistor active areas. Minimum channel length conduction is therefore not available at the isolation-to-active interface, but rather the channel length along that interface is substantially lengthened, reducing off-state conduction.

A semiconductor device according to example embodiments of inventive concepts may include a substrate, source/drain regions extending perpendicular to an upper surface of the substrate, a plurality of nanosheets on the substrate and separated from each other, and a gate electrode and a gate insulating layer on the substrate. The nanosheets define channel regions that extend in a first direction between the source/drain regions. The gate electrode surrounds the nanosheets and extends in a second direction intersecting the first direction. The gate insulating layer is between the nanosheets and the gate electrode. A length of the gate electrode in the first direction may be greater than a space between adjacent nanosheets among the nanosheets.

A memory system includes a first memory bank, a first path selector, a second memory bank, a second path selector, and a sensing device. The first memory bank includes a plurality of first memory cells. The second memory bank includes a plurality of second memory cells. The first path selector includes a plurality of input terminals coupled to the first memory cells through a plurality of first bit lines, and two output terminals. The second path selector includes a plurality of input terminals coupled to the second memory cells through a plurality of second bit lines, and two output terminals. The sensing device is coupled to the output terminals of the first bank selector and the second bank selector, and senses the difference between currents outputted from two of the reference current source, and the terminals of the two bank selectors according to the required operations.

A non-volatile memory (NVM) includes a fin structure, a first fin field effect transistor (FinFET), a second FinFET, an antifuse structure, a third FinFET, and a fourth FinFET. The antifuse structure is formed on the fin structure and has a sharing gate, a single diffusion break (SDB) isolation structure, a first source/drain region, and a second source/drain region. The SDB isolation structure isolates the first source/drain region and the second source/drain region. The first FinFET, the second FinFET and the first antifuse element compose a first one time programmable (OTP) memory cell, and the third FinFET, the fourth FinFET and the second antifuse element compose a second OTP memory cell. The first OTP memory cell and the second OTP memory cell share the antifuse structure.

A charge pump circuit includes a voltage input port, a voltage output port, a plurality of charge pump units cascaded between the voltage input port and the voltage output port, a clock signal source, and N clock delay elements. The clock signal source generates a main clock signal and the N clock delay elements generate clock signals received by the charge pump units by delaying the main clock signal. The main clock signal received by the first charge pump unit has a rising edge leading a rising edge of the last clock signal received by the last charge pump unit, and a falling edge lagging the rising edge of the last clock signal. Each of the charge pump units includes two sets of inverters with delay elements for generating two complementary clock signals.

A fin includes a first region and a second region arranged on a positive side in an X-axis direction with respect to the first region. A control gate electrode covers an upper surface of the first region, and a side surface of the first region on the positive side in a Y-axis direction. A memory gate electrode covers an upper surface of the second region, and a side surface of the second region on the positive side in the Y-axis direction. The upper surface of the second region is lower than the upper surface of the first region. The side surface of the second region is arranged on the negative side in the Y-axis direction with respect to the side surface of the first region in the Y-axis direction.

Semiconductor devices and methods for manufacturing the same are provided. An example method may include: forming a sacrificial gate stack on a substrate; forming a gate spacer on sidewalls of the sacrificial gate stack; forming an interlayer dielectric layer on the substrate and planarizing it to expose the sacrificial gate stack; partially etching back the sacrificial gate stack to form an opening; expanding the resultant opening so that the opening is in a shape whose size gradually increases from a side adjacent to the substrate towards an opposite side away from the substrate; and removing a remaining portion of the sacrificial gate stack and forming a gate stack in a space defined by the gate spacer.

The present invention generally relates to a structure and manufacturing of a power field effect transistor (FET). The present invention provides a planar power metal oxide semiconductor field effect transistor (MOSFET) structure and an insulated gate bipolar transistor (IGBT) structure comprising a split gate and a semi-insulating field plate. The present invention also provides manufacturing methods of the structures.