An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

The optical receptacle of the invention includes plural first optical surfaces al lowing light emitted from plural light emitting elements to be incident thereon, plural second optical surfaces emitting the light incident on the first optical surfaces toward plural optical transmission members, and a third optical surface reflecting the light incident on the first optical surfaces toward the second optical surfaces. The distances between the center of the first optical surface and the light-emitting surface of the light emitting element and between the center of the second optical surface and the light-emitting surface of the light emitting element is longer toward the center from both ends of the row. The center-to-center distances of the first optical surfaces and of the second optical surfaces are shorter, respectively, than the distance between optical axes of light emitted from the light emitting elements and the center-to-center distance of light-receiving surfaces of optical transmission members.

A filter member includes a first lead terminal, an optical filter, and a first mold member, and a light incidence surface and a light emission surface of the optical filter is exposed from the first mold member. A sensor member includes an IR sensor element, a second lead terminal and a second mold member. A light-receiving surface of the IR sensor element is exposed from the second mole member. The filter member is disposed on the sensor member so that the light emission surface of the optical filter faces the light-receiving surface of the IR sensor element in the sensor member.

This optical module comprises a substrate, light-emitting elements, a ferrule, an optical receptacle, through-holes and an adhesive. The optical receptacle includes two support units, and an optical receptacle body that has a first optical surface and a second optical surface. The through-holes include two first through-holes surrounded by the leading ends of the support units and the ferrule, and two second through-holes which are surrounded by the optical receptacle body, the support units and the ferrule. Thus, even using the adhesive to fix the optical receptacle and the ferrule to the substrate, it is possible to optically connect multiple optical transmission bodies with multiple light-emitting elements or multiple light-receiving elements in a suitable manner.

This optical receptacle has first optical surfaces via which light outputted by respective light-emitting elements is inputted, a second optical surface whereby light inputted via said first optical surfaces is outputted towards an end face of a light-transporting body, a third optical surface whereby light inputted via the first optical surfaces is reflected towards the second optical surface, a plurality of first concavities formed in the surface where the second optical surface is located, and a plurality of second concavities formed in the surface where the first optical surfaces are located or a surface opposite the surface where the first concavities are located. The first concavities and the second concavities are laid out opposite each other so that the central axes thereof coincide.

Semiconductor devices, such as photonics devices, employ substantially curved-shaped Silicon-Germanium (SiGe) structures and are fabricated using zero-change CMOS fabrication process technologies. In one example, a closed-loop resonator waveguide-coupled photodetector includes a silicon resonator structure formed in a silicon substrate, interdigitated n-doped well-implant regions and p-doped well-implant regions forming multiple silicon p-n junctions around the silicon resonator structure, and a closed-loop SiGe photocarrier generation region formed in a pocket within the interdigitated n-doped and p-doped well implant regions. The closed-loop SiGe region is located so as to substantially overlap with an optical mode of radiation when present in the silicon resonator structure, and traverses the multiple silicon p-n junctions around the silicon resonator structure. Electric fields arising from the respective p-n silicon junctions significantly facilitate a flow of the generated photocarriers between electric contact regions of the photodetector.

A solid-state imaging device which includes, a photoelectric conversion film provided on a second surface side which is the opposite side to a first surface on which a wiring layer of a semiconductor substrate is formed, performs photoelectric conversion with respect to light in a predetermined wavelength region, and transmits light in other wavelength regions; and a photoelectric conversion layer which is provided in the semiconductor substrate, and performs the photoelectric conversion with respect to light in other wavelength regions which has transmitted the photoelectric conversion film, in which input light is incident from the second surface side with respect to the photoelectric conversion film and the photoelectric conversion layer.

The present invention provides a photoelectric conversion device. Specifically, the photoelectric conversion device has a structure in which a substrate including a photoelectric conversion element provided at the bottom and a substrate including a photoelectric conversion element provided at the side are secured in a brace form by a light-dividing device. This structure divides incident light using the light-dividing device into a plurality of wavelength bands, and causes the divided light to fall onto the photoelectric conversion elements provided at the bottom and side, thereby making it possible to provide a photoelectric conversion device which is capable of generating a lame amount of electric power. In addition, the light-dividing device distributes pressures and impacts applied to the substrates at the bottom and side, thus making it possible to provide a photoelectric conversion device which has resistance to pressures and impacts.

The present disclosure relates to OLED and PV devices including transparent electrodes that are formed of conductive nanostructures and methods of improving light out-coupling in OLED and input-coupling in PV devices.

The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a;5b;5b); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.