H10H20/831

Light emitting device for display and led display apparatus having the same
12205933 · 2025-01-21 · ·

A light emitting device including first, second, and third light emitting stacks each including first and second conductivity type semiconductor layers, a first lower contact electrode in ohmic contact with the first light emitting stack, and second and third lower contact electrodes respectively in ohmic contact with the second conductivity type semiconductor layers of the second and third light emitting stacks, in which the first lower contact electrode is disposed between the first and second light emitting stacks, the second and third lower contact electrodes are disposed between the second and third light emitting stacks, and the first, second, and third lower contact electrodes include transparent conductive oxide layers.

Display Panel and Display Apparatus Including Same

A display panel and a display apparatus including the display panel are presented herein. A display panel according to one or more embodiments includes a substrate; an insulating layer on the substrate; a bank pattern on the insulating layer; a first electrode on the bank pattern; a contact electrode on the insulating layer, the contact electrode spaced apart from the bank pattern; a light-emitting element on the first electrode; a first optical layer surrounding the light-emitting element, the first optical layer comprising an organic insulating material including metal particles; a second optical layer on the contact electrode; and a third optical layer on the first optical layer.

Light-emitting component comprising fluorine-containing region with improved current spread and light dispersion

A light-emitting component includes a light-emitting unit and an electrically insulating layer. The light-emitting unit includes a first semiconductor layer, an active layer, and a second semiconductor layer, which are stacked on one another along a stacking direction in such order. The second semiconductor has a lower surface distal from the active layer. The electrically insulating layer is disposed to cover a first portion and to expose a second portion of the lower surface of the second semiconductor layer. A fluorine-containing region is formed in the second semiconductor layer. Methods for making the light-emitting component are also disclosed.

Flip-chip light-emitting diode comprising multiple transparent dielectric layers and distributed Bragg reflector (DBR) structure

A flip-chip light-emitting diode includes a first conductivity type semiconductor layer, a light-emitting layer, a second conductivity type semiconductor layer, a first transparent dielectric layer, a second transparent dielectric layer, and a distributed Bragg reflector (DBR) structure which are sequentially stacked. The first transparent dielectric layer has a thickness greater than /2n.sub.1, and the second transparent dielectric layer has a thickness of m/4n.sub.2, wherein m is an odd number, is an emission wavelength of the light-emitting layer, n.sub.1 is a refractive index of the first transparent dielectric layer, and n.sub.2 is a refractive index of the second transparent dielectric layer and is greater than n.sub.1.

Micro LED display panel

A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.

Micro light emitting diode with high light extraction efficiency
12211970 · 2025-01-28 · ·

A micro light emitting diode (LED) having a high light extraction efficiency includes a bottom conductive layer, a light emitting layer on the bottom conductive layer, and a top conductive structure on the light emitting layer. The micro LED additionally includes a conductive side arm electrically connecting the sidewall of the light emitting layer with the bottom conductive layer, and a reflective bottom dielectric layer arranged under the light emitting layer and above the bottom conductive layer. In some embodiments, the micro LED further includes an ohmic contact between the top conductive structure and the light emitting layer that has a small area and is transparent, thereby increasing the light emergent area and improving the light extraction efficiency.

Micro-LED structure and micro-LED chip including same

A micro-LED structure includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer extrudes along a horizontal level away from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer. A profile of the second type conductive layer perpendicularly projected on a top surface of the first type conductive layer is surrounded by the top edge of the first type conductive layer.

DISPLAY PANEL AND DISPLAY DEVICE
20250040300 · 2025-01-30 ·

A display panel and a display device are provided. The display panel includes a display area, including a first display area and repeating units that including a first light-emitting element column, a second light-emitting element column, a third light-emitting element column and a fourth light-emitting element column. The second light-emitting element column and the fourth light-emitting element column each includes a third color light-emitting element, and third color light-emitting elements in the second light-emitting column and the fourth light-emitting element column are arranged in a staggered manner in the first direction. In a direction perpendicular to a plane of the display panel, a light-emitting element includes an anode, a light-emitting material layer and a cathode stacked in sequence; and in the first display area, in the direction perpendicular to the plane, in the third color light-emitting element, a shape of the anode includes an arc-shaped edge.

LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME

A light emitting device, includes: a substrate; a light emitting element on the substrate, the light emitting element having a first end portion and a second end portion arranged in a longitudinal direction; one or more partition walls disposed on the substrate, the one or more partition walls being spaced apart from the light emitting element; a first reflection electrode adjacent the first end portion of the light emitting element; a second reflection electrode adjacent the second end portion of the light emitting element; a first contact electrode connected to the first reflection electrode and the first end portion of the light emitting element; an insulating layer on the first contact electrode, the insulating layer having an opening exposing the second end portion of the light emitting element and the second reflection electrode to the outside; and a second contact electrode on the insulating layer.

LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE

A light emitting element includes a semiconductor core having at least a partial region extending in a direction and including a first end, a second end, and a main body part between the first end and the second end; a first electrode layer surrounding the second end of the semiconductor core; a second electrode layer surrounding at least the first end of the semiconductor core and spaced apart from the first electrode layer; and an insulating layer surrounding the semiconductor core, the first electrode layer and the second electrode layer. The second end of the semiconductor core has a diameter smaller than a diameter of the main body part.