A light-emitting substrate and a display device. The light-emitting substrate includes a base substrate, an electrode layer and a definition pattern layer; the electrode layer is at a side of the base substrate, and the definition pattern layer is at a side of the electrode layer away from the base substrate; the electrode layer includes a first electrode, and the definition pattern layer covers at least a part of the first electrode; the definition pattern layer includes a plurality of first openings, the plurality of first openings expose a same first electrode. Therefore, the light-emitting substrate can ensure the bonding success rate of the light-emitting substrate, and thus can further improve the product yield of the light-emitting substrate.

A light-emitting substrate and a display device. The light-emitting substrate includes a base substrate, an electrode layer and a definition pattern layer; the electrode layer is at a side of the base substrate, and the definition pattern layer is at a side of the electrode layer away from the base substrate; the electrode layer includes a first electrode, and the definition pattern layer covers at least a part of the first electrode; the definition pattern layer includes a plurality of first openings, the plurality of first openings expose a same first electrode. Therefore, the light-emitting substrate can ensure the bonding success rate of the light-emitting substrate, and thus can further improve the product yield of the light-emitting substrate.

A light-emitting element includes a first semiconductor layer doped to a first conductivity type, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, the second semiconductor layer doped to a second conductivity type, and a passivation layer surrounding surfaces of the active layer, the passivation layer including a side surface of the active layer, and the passivation layer includes a semiconductor material that matches a lattice of a semiconductor material contained in the active layer, the semiconductor material has a band gap energy higher than that of the semiconductor material contained in the active layer.

A semiconductor nanoparticle, a method of preparing the semiconductor nanoparticle, and an electroluminescent device including the semiconductor nanoparticle. The method of preparing the semiconductor nanoparticle includes contacting a zinc precursor and a sulfur precursor in the presence of a first particle at a predetermined temperature to form a semiconductor nanocrystal layer containing zinc sulfide on the first particle, wherein the first particle includes a Group II-VI compound including zinc, selenium, and, optionally, tellurium, or the first particle includes a Group III-V compound including indium and phosphorus. The predetermined temperature includes (e.g., is) a temperature (e.g., a reaction temperature) of greater than 300 C. and less than or equal to about 380 C., and the sulfur precursor includes a thiol compound of C3 (e.g. C9) to C50 or a combination thereof.

A semiconductor device is provided, which includes an active structure, a first semiconductor layer, a second semiconductor layer, an insulating layer, and a conductive layer. The active region has two sides and includes an active region. The first semiconductor layer and the second semiconductor layer respectively located on the two sides of the active structure. The insulating layer covers a portion of the first semiconductor layer. The conductive layer covers the insulating layer and physically contacts the first semiconductor layer. The second semiconductor layer includes a first dopant and the first semiconductor layer includes a second dopant different from the first dopant. The first semiconductor layer includes a quaternary III-V semiconductor material, and the active region includes a quaternary semiconductor material, and the semiconductor device emits a radiation having a peak wavelength between 800 nm and 2000 nm.

A method of forming a semiconductor structure includes forming an opening in a dielectric layer, forming a recess in an exposed part of a substrate, and forming a lattice-mismatched crystalline semiconductor material in the recess and opening.

The present disclosure provides a light-emitting device. The light-emitting device comprises a substrate; a light-emitting stack which emits infrared (IR) light on the substrate; and a semiconductor window layer comprising AlGaInP series material disposed between the substrate and the light-emitting stack.

Diode includes first metal layer, coupled to p-type III-N layer and to first terminal, has a substantially equal lateral size to the p-type III-N layer. Central portion of light emitting region on first side and first metal layer includes first via that is etched through p-type portion, light emitting region and first part of n-type III-N portion. Second side of central portion of light emitting region that is opposite to first side includes second via connected to first via. Second via is etched through second part of n-type portion. First via includes second metal layer coupled to intersection between first and second vias. Electrically-insulating layer is coupled to first metal layer, first via, and second metal layer. First terminals are exposed from electrically-insulating layer. Third metal layer including second terminal is coupled to n-type portion on second side of light emitting region and to second metal layer through second via.

A contact to a semiconductor heterostructure is described. In one embodiment, there is an n-type semiconductor contact layer. A light generating structure formed over the n-type semiconductor contact layer has a set of quantum wells and barriers configured to emit or absorb target radiation. An ultraviolet transparent semiconductor layer having a non-uniform thickness is formed over the light generating structure. A p-type contact semiconductor layer having a non-uniform thickness is formed over the ultraviolet transparent semiconductor layer.

A device comprising a semiconductor layer including a plurality of compositional inhomogeneous regions is provided. The difference between an average band gap for the plurality of compositional inhomogeneous regions and an average band gap for a remaining portion of the semiconductor layer can be at least thermal energy. Additionally, a characteristic size of the plurality of compositional inhomogeneous regions can be smaller than an inverse of a dislocation density for the semiconductor layer.