An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a SiRNH.sub.2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

A method for producing an optoelectronic device comprises steps for providing a package with a first surface and a second surface, wherein an electrically conductive chip carrier is embedded in the package and is accessible at the first surface and at the second surface, and for applying an insulation layer on the second surface of the package by means of aerosol deposition.

Described herein are devices, systems, and methods for delivering phototherapy to a subject. A phototherapy light engine is combined with other components to form a phototherapy system that provides phototherapy treatment to a subject. A phototherapy system may be implemented as a hand held system comprising the light engine that is configured to communicate with a remote computing device.

An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

A substrate includes a first member having a through hole extending from an upper surface to a lower surface thereof, and a second member disposed inside the through hole. The second member includes a first region containing graphite, a second region located outward of the first region in a top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

An element substrate includes an insulating substrate, electrode wiring located on the insulating substrate, a heat-dissipating member in contact with the insulating substrate, a flexible substrate electrically connected to the electrode wiring, a temperature detecting element located on the flexible substrate, and an adhesive layer. The adhesive layer is located between the temperature detecting element and an extending portion in the heat-dissipating member and between a facing surface of the flexible substrate and the extending portion in the heat-dissipating member.

A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.

A bonded substrate includes a metal plate; a first ceramic; and a first metal body disposed between a first surface of the metal plate and a first surface of the first ceramic and disposed on 80% or more of a lateral surface continuous with the first surface of the first ceramic.

A ceramic substrate including a base having a first surface, a second surface opposite to the first surface, and a through hole having a first opening diameter at the first surface and a second opening diameter at the second surface. The first opening diameter is larger than the second opening diameter. The ceramic substrate also includes at least one solid particle disposed in the through hole, and an electrically-conductive member disposed in the through hole. A thermal conductivity of the at least one solid particle is higher than a thermal conductivity of the electrically-conductive member. The electrically-conductive member is continuous between the first surface and the second surface.

Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.