A light emitting device having an enhanced surface property and an electrical property is provided. The light emitting device includes a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode disposed on one side of the light emitting structure and electrically connected to the first semiconductor layer, a second electrode disposed on one side of the light emitting structure and electrically connected to the second semiconductor layer, and an ohmic contact including a first layer disposed between the second electrode and the second semiconductor layer and having aluminum (Al), a second layer including at least one M.sub.xAl.sub.y alloy formed by a reaction with Al included in the first layer, and a third layer disposed on the second layer and having gold (Au) is provided.

A side light-emitting display device includes a case, a front display panel configured to display an image to the front of the case and one or more side light sources disposed to be spaced apart from the front display panel and configured to emit light to a side surface of the case.

The present disclosure relates to a wavelength conversion apparatus and a manufacturing method therefor. The wavelength conversion apparatus comprises a light-emitting layer, a reflective film, a sintering silver layer, and a substrate stacked successively. The light-emitting layer converts an excitation light into exit light having a different wavelength from the excitation light. The reflective film is plated on the light-emitting layer and used for reflecting the exit light emitted by the light-emitting layer. The sintering silver layer is connected to the light-emitting layer and the substrate; the sintering silver layer comprises flake silver particles connected with each other via surface contact; and the sintering silver layer is formed by sintering spherical silver nanoparticles and flake silver particles. The wavelength conversion apparatus is characterized by excellent thermal conductivity and high luminous efficiency.

A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.

A light emitter includes a planar supporting surface, a light source positioned on the spreader region, and an encapsulant positioned on the spreader region to surround the light source. Except where constrained by adhesion to the planar supporting surface, the encapsulant is capable of expanding and contracting in response to a change in temperature so that forces caused by differences in the coefficient of thermal expansion between the different components is minimized. One or more reflective elements can be positioned proximate to the light source to increase the light emitting efficiency of the light emitter. The reflective elements can include a reflective layer on the spreader region and/or a reflective layer on a portion of the encapsulant.

A narrow band red phosphor may have a general composition MS.sub.xSe.sub.yA.sub.z:Eu, wherein M is at least one of Mg, Ca, Sr and Ba, A is at least one of C, N, B, P and a monovalent combining group NCN (cyanamide), and may in some embodiments further include one or more of O, F, Cl, Br and I. In embodiments 0.8<x+y<1.25 and 0<z0.05, and in some embodiments x, y and z are determined strictly by charge balancing. A white light emitting device may comprise: a blue and/or UV excitation source; a narrow band red phosphor of the present invention; and phosphors with peak emission at shorter wavelengths, such as yellow, green, yellow/green and/or blue.

Object:

To provide a light emitting element mounting substrate capable of exhibiting high brightness and high light emission efficiency over an extended period of time, and a light emitting device constituted by mounting a light emitting element on this light emitting element mounting substrate.

Resolution means:

A light emitting element mounting substrate, including a substrate made from a ceramic; a metal layer provided on the substrate that includes gold or silver as a primary component; and a resin layer provided covering at least a portion of the metal layer. The resin layer includes platinum, and at least one type of oxide of magnesium, calcium, and copper is present on a surface of the metal layer.

The present invention relates to a method for providing a reflective coating (114) to a substrate (104) for a light-emitting device (112), comprising the steps of: providing (201) a substrate (104) having a first surface portion (116) with a first surface material and a second surface portion (106, 108) with a second surface material different from the first surface material; applying (202) a reflective compound (401) configured to attach to said first surface material to form a bond with the substrate (104) in the first surface portion (116) that is stronger than a bond between the reflective compound (401) and the substrate (104) in the second surface portion (106, 108); curing (203) said reflective compound (401) to form a reflective coating (114) having said bond between the reflective coating (114) and the substrate (104) in the first surface portion (116); and subjecting said substrate (104) to a mechanical treatment with such an intensity as to remove (205) said reflective coating (114) from said second surface portion (106, 108) while said reflective coating (114) remains on said first surface portion (116).

Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming contacts within a light emitting device based on their coefficient of thermal expansion and their relative cost, copper alloys being less expensive than gold, and providing a lower coefficient of thermal expansion than copper. Elements of the light emitting device may also be structured to distribute the stress during thermal cycling.

Provided is a wavelength conversion member capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD and providing a light emitting device using the wavelength conversion member. The wavelength conversion member (11) includes a laminate that includes: a phosphor layer (1); and light-transmissive heat dissipation layers (2) formed on both surfaces of the phosphor layer (1) and having a higher thermal conductivity than the phosphor layer (1).