An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface; a wavelength converting material covering a plurality of lateral surfaces; and a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.

An LED lighting module includes a substrate and multiple divergent types of LED light sources that have different wavelengths and are housed on the substrate. The multiple LED light sources include: a phosphor-converted amber source; a phosphor-converted green source; a direct emission red source; a direct emission green source; a direct emission blue source; and a direct emission cyan source. The module can further include a controllable power source unit configured to supply the LED light sources and a control unit to control the power supply unit.

A light emitting device includes a substrate; a first frame located on the substrate; a second frame located on the substrate, the second frame being located inward of and spaced apart from the first frame; at least one first light emitting element located on the substrate in a first region located between the first frame and the second frame; at least one second light emitting element located on the substrate in a second region located inward of the second frame; and a sealing member covering the at least one first light emitting element and the at least one second light emitting element. The second frame includes a light-transmissive portion. A highest portion of the second frame is higher than a highest portion of the first frame.

A light emitting device includes a light emitting chip which generates a first light having a first color, a first cavity layer disposed on the light emitting chip and which generates a second light having a second color and has a first refractive index, a second cavity layer disposed on the first cavity layer and which generates a third light having a third color and has a second refractive index, a first half mirror layer disposed between the first cavity layer and the light emitting chip and which reflects at least a portion of the second light, a second half mirror layer disposed between the first cavity layer and the second cavity layer and which reflects at least a portion of the third light, and a third half mirror layer disposed on the second cavity layer and which transmits the first light.

A compound is provided containing silicon, aluminum, strontium, europium, nitrogen, and oxygen is used that enables a red phosphor having strong luminous intensity and high luminance to be obtained, and that enables the color gamut of a white LED to be increased with the use of red phosphor. The red phosphor contains element A, europium, silicon, aluminum, oxygen, and nitrogen at the atom number ratio of the following formula: [A.sub.mx)Eu.sub.x]Si.sub.9Al.sub.yO.sub.nN .sub.[12+y2(nm)/3]. The element A in the formula is at least one of magnesium, calcium, strontium, and barium, and m, x, y, and n in the formula satisfy the relations 3<m<5, 0<x<1, 0<y<2, and 0<n<10.

A light emitting diode package includes a light emitting diode chip disposed in a housing, a first phosphor configured to emit green light, and a second phosphor configured to emit red light. White light is configured to be formed by a synthesis of light emitted from the light emitting diode chip, the first phosphor, and the second phosphor. The second phosphor has a chemical formula of A.sub.2MF.sub.6:Mn.sup.4+, A is one of Li, Na, K, Rb, Ce, and NH.sub.4, and M is one of Si, Ti, Nb, and Ta, and the Mn.sup.4+ of the second phosphor has a mole range of about 0.02 to about 0.035 times the M.

Combinations of solid state light emitters, optionally arranged to stimulate one or more lumiphoric materials, are used to illuminate surfaces (e.g., upright surfaces) including printed material produced with CMY or CMYK inks. Vibrancy and/or efficacy may be enhanced by increasing the effective steepness of printed ink reflectance wavelength boundaries by illuminating printed material with solid state light emitters of multiple colors having tailored boundaries (e.g., increased separation between colors and/or increased energy in spectral areas highly reflected by CMY inks, or reducing energy of emissions at wavelengths to which the human eye is less sensitive). Lighting devices may include multiple operating modes having different gamut properties (e.g., relative gamut values). One or more subregions of an upright surface bearing printed material may be preferentially illuminated with an array of solid state light emitters including multiple emitters having different peak wavelengths.

A light emitting device can include a light emitting structure including a p-GaN based layer, an active layer having multiple quantum wells, and an n-GaN based layer; a p-electrode and an n-electrode electrically connecting with the light emitting structure, respectively, in which the n-electrode has a plurality of layers; a phosphor layer disposed on a top surface of the light emitting structure; and a passivation layer disposed between the phosphor layer and the top surface of the light emitting structure, and disposed on outermost side surfaces of the light emitting structure, in which the p-electrode and the n-electrode are disposed on opposite sides of the light emitting structure. Also, the phosphor layer has a two-digit micrometer thickness, and includes a pattern to bond an n-electrode pad on a portion of the n-electrode by a wire, and comprises different phosphor materials configured to emit light of different colors.

Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in center portion. It is possible to avoid direct or indirect excitation for generating red light in edge portion of the LED chip by adjusting the amount of red phosphor in edge portion to be lower, so that the color temperature in edge portion may be adjusted toward to high color temperature, and thus the phenomenon of yellow halo may be alleviated.