A light-deflection three-dimensional imaging device and a projection device, and the application thereof are provided. The light-deflection three-dimensional imaging device includes a projection device, a receiving device and a processor. The projection device includes a light source, a grating, a condensing lens group, a light deflection element and an emission lens, wherein after the modulation by the grating, the aggregation by the condensing lens group and the deflection by the light deflection element, the projection light transmitted by the light source penetrates the emission lens and is emitted from a side surface of the projection device. The light deflection element is provided to change a projection path of light emitted from the light source, thereby changing an installation manner of the projection device, so that the thickness thereof is significantly reduced, thereby facilitating the installation in lighter and thinner electronic mobile devices, such as a mobile phone, a laptop, a tablet computer, etc.

In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.

A wiring board includes a low CTE (coefficient of thermal expansion) and high thermal conductivity isolator incorporated in a resin laminate by an adhesive and a bridging element disposed over the isolator and the resin laminate and electrically coupled to a first routing circuitry on the isolator and a second routing circuitry on the resin laminate. The isolator provides CTE-compensated contact interface for a semiconductor chip to be assembled thereon, and also provides primary heat conduction for the chip. The bridging element offers a reliable connecting channel for interconnecting contact pads on the isolator to terminal pads on the resin laminate.

An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.

A method of fabricating a flip-chip photonic-crystal light-emitting diode (LED) is disclosed. The method includes the steps of: providing an initial substrate including an epitaxial-growth surface and a light-output surface; performing a nanoimprint process on the epitaxial-growth surface of the initial substrate to form a nano-level patterned substrate; forming a flip-chip LED structure on the epitaxial-growth surface of the nano-level patterned substrate; and performing a nanoimprint process on the light-output surface of the nano-level patterned substrate to form the flip-chip photonic-crystal LED. The formation of the photonic-crystal structure on the light-output surface results in enhanced LED light extraction and emission efficiency.

A light emitting device to be mounted on a mount surface of a vehicular compartment includes a housing including a first section having an air intake hole and a second section having an air discharge hole, a cooling fan device arranged in the first section, and a light emitter arranged in the second section. The housing further includes a discharge cavity having the discharge hole. The light emitter and the cooling fan device are arranged in a first arrangement direction laterally along the mount surface. The light emitter includes a board member and a light emitting element. The board member has a first surface that is opposite the mount surface and a second surface that is an opposite surface of the first surface and on which the light emitting element is mounted. The first surface of the board member is defined as a portion of the discharge cavity.

A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

A light emitting device including a light emitting element having a light emitting surface and an optical component comprising an optical material comprising quantum dots sealed within an optically transparent structural member, the optical component being coupled to the light emitting element by a thermally conductive member is disclosed. A light emitting device including a light emitting element having a light emitting surface and an optical component comprising an optical material comprising quantum dots sealed within a structural member comprising single crystal sapphire, the optical component being coupled to the light emitting element by a thermally conductive member, is also disclosed.

An optoelectronic device includes a substrate having a first side, a second side opposite to the first side; a first optoelectronic unit formed on the first side of the substrate; a second optoelectronic unit formed on the first side of the substrate; a third optoelectronic unit formed on the first side of the substrate; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad formed on the first side of the substrate and electrically insulated from the third optoelectronic unit; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.

Described herein are devices, systems, and methods for delivering phototherapy to a subject. A phototherapy light engine is combined with other components to form a phototherapy system that provides phototherapy treatment to a subject. A phototherapy system may be implemented as a hand held system comprising the light engine that is configured to communicate with a remote computing device.