An embodiment discloses a display apparatus. The display apparatus includes a plurality of first electrodes and a contact electrode disposed on a substrate. The display apparatus includes a plurality of light-emitting elements disposed on the plurality of first electrodes. The display apparatus includes a first optical layer disposed between the plurality of light-emitting elements. The display apparatus includes a second electrode disposed on the plurality of light-emitting elements. The second electrode includes a first area disposed on the plurality of light-emitting elements and a second area extending outward from the first optical layer and electrically connected to the contact electrode. A plurality of signal wires connected to the plurality of first electrodes are provided, the second area of the second electrode comprises protruding portions extending to at least one of areas between the plurality of signal wires, and one of the protruding portions is connected to the contact electrode.

A lens for distribution of light predominantly toward a preferential side from a light emitter having an emitter axis. The lens has a faceted output region, a smooth output surface and at least one reflective surface which reflects light through total-internal-reflection (TIR) toward the faceted output region. The faceted output region is formed by pairs of transverse surfaces each surface of which redirects the received light to provide a composite illuminance pattern. The lens may further have faceted input surfaces at least partially defining a light-input cavity about the emitter axis. The faceted input region are formed by pairs of transverse surfaces each surface of which redirects the received light.

A unit pixel and a displaying apparatus including the unit pixel are provided. The unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, a light blocking layer disposed between the transparent substrate and the light emitting devices, and having at least one window, and a semi-transmissive layer disposed between at least one of the plurality of light emitting devices and the transparent substrate to overlap with the window at least partially.

A semiconductor package includes a first die comprising an optical coupler, a second die bonded to the first die, and a substrate over the first die. The substrate includes a first portion, a second portion at least partially overlapped with the optical coupler from a top view, and a third portion between the first portion and the second portion. A first top surface of the first portion, a second top surface of the second portion and a third top surface of the third portion are at different surface levels.

Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

A display panel, a display module and a display device. The display panel includes: a substrate in a stacked arrangement, a light-emitting device layer, a light extraction layer assembly, and a barrier layer; wherein the light extraction layer assembly includes at least two light extraction layers in a stacked arrangement, the at least two light extraction layers including a primary extraction layer and at least one secondary extraction layer disposed on one side of the primary extraction layer or on two opposite sides of the primary extraction layer, and the primary extraction layer has a refractive index greater than that of the secondary extraction layer; and the secondary extraction layer has a refractive index greater than that of the barrier layer.

A display device includes a substrate provided on a driving circuit, an adhesive layer covering the substrate, a first LED chip provided on the adhesive layer, a pixel circuit provided on the adhesive layer, separated from the first LED chip, a light shielding layer provided on the adhesive layer, and a first opening of the same shape as that of the first LED chip when viewed in a plan view and a second opening of the same shape as that of the pixel circuit when viewed in a plan view, an insulating layer covering the driving circuit and the pixel circuit, and a first wiring provided on the insulating layer, connected to the first LED chip and the pixel circuit, wherein the first wiring overlaps the light shielding layer.

A light emitting device including: a substrate; a light emitting element on the substrate, and having a first end and a second end in a longitudinal direction; first and second banks on the substrate and spaced apart from each other with the light emitting element interposed therebetween; a first electrode on the first bank and adjacent to the first end of the light emitting element; a second electrode on the second bank and adjacent to the second end of the light emitting element; a first contact electrode coupling the first electrode and the first end of the light emitting element, and a second contact electrode coupling the second electrode and the second end of the light emitting element. When viewed on a plane, the first electrode partially overlaps the first bank, and the second electrode partially overlaps the second bank.

A display module includes a substrate including a mounting surface on which a plurality of inorganic LEDs are mounted and a side surface orthogonal to the mounting surface; a cover which is disposed on the mounting surface, and is configured to cover the mounting surface and extend to an area outside the mounting surface; and a side surface member provided on the side surface, and configured to be bonded to a lower surface of a region of the cover that corresponds to the area outside the mounting surface and to at least a part of the side surface.