A method of manufacturing a display device includes: forming a plurality of photoresist columns at an upper edge region of a glass substrate by a photo patterning process; coating a plastic chemical liquid on an entire upper surface of the glass substrate to cover the photoresist columns; evaporating a solvent of the plastic chemical liquid to semi-harden a plastic substrate and to expose an upper portion of the photoresist columns; forming a plurality of through-holes at an edge region of the surface of the semi-hardened plastic substrate by removing the photoresist columns; firing and curing the plastic chemical liquid to form the plastic substrate; and coating a metal layer on an edge region of the surface of the plastic substrate with the through-holes.

In various embodiments, light-emitting devices incorporate smooth contact layers and polarization doping (i.e., underlying layers substantially free of dopant impurities) and exhibit high photon extraction efficiencies.

A light emitting diode includes an active region configured to emit light, a composite electrical contact layer, and a transparent electron blocking hole transport layer (TEBHTL). The composite electrical contact layer includes tow materials. At least one of the two materials is a metal configured to reflect a portion of the emitted light. The TEBHTL is arranged between the composite electrical contact layer and the active region. The TEBHTL has a thickness that extends at least a majority of a distance between the active region and the composite electrical contact layer. The TEBHTL has a band-gap greater than a band-gap of light emitting portions of the active region. The band-gap of the TEBHTL decreases as a function of distance from the active region to the composite electrical contact layer over a majority of the thickness of the TEBHTL.

An optoelectronic semiconductor chip which is a light emitting diode includes a semiconductor layer sequence having an n-conducting layer sequence, a p-conducting layer sequence, an active zone, at least one etching signal layer, and an etching structure, wherein the etching structure extends at least right into the etching signal layer, the etching signal layer has a signal constituent, the active zone generates radiation and is based on InAlGaP or on InAlGaAs, the etching signal layer is situated in the p-conducting layer sequence and is based on In.sub.1xyAl.sub.yGa.sub.xP or on In.sub.1xyAl.sub.yGa.sub.xAs where x+y<1, the signal constituent is Ga and 0.005x0.2, the signal constituent is not present in the layer adjoining the etching signal layer in a direction toward the etching structure, a thickness of the etching signal layer is 50 nm to 800 nm.

A light-emitting diode includes at least two light emitting cells disposed on a substrate and spaced apart from each other, wherein each of the at least two light emitting cells includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. Each of the at least two light emitting cells includes a cathode disposed on the first conductivity-type semiconductor layer, an anode disposed on the second conductivity-type semiconductor layer, and the cathode of a first light emitting cell of the at least two light emitting cells is electrically connected in series to the anode of a second light emitting cell of the at least two light emitting cells adjacent to the first light emitting cell by an interconnecting section.

Disclosed is a light emitting device comprising a plurality of light emitting cells, and a bridge electrode electrically connecting two adjacent light emitting cells, and the plurality of light emitting cells comprise a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer, a first electrode on the first conductive semiconductor layer and a second electrode on the second conductive semiconductor layer, wherein the bridge electrode has a part thicker than the first electrode and the second electrode.

Disclosed is a light emitting device including a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer, a first electrode electrically connected with the first conductive semiconductor layer, a mirror layer under the light emitting structure, a window semiconductor layer between the mirror layer and the light emitting structure, a reflective layer under the mirror layer, a conductive contact layer between the reflective layer and the window semiconductor layer and in contact with the second conductive semiconductor layer, and a conductive support substrate under the reflective layer. The window semiconductor layer includes a C-doped P-based semiconductor doped with a higher dopant concentration. The conductive contact layer includes material different from that of the mirror layer with a thickness thinner than that of the window semiconductor layer.

A light emitting device according to an embodiment comprises: a light emitting structure including a first conductive semiconductor layer, an active layer disposed under the first conductive semiconductor layer, and a second conductive semiconductor layer disposed under the active layer; a protective layer disposed above the light emitting structure and including a through region; a first electrode disposed in the through region and electrically connected to the first conductive semiconductor layer; an electrode pad electrically connected to the first electrode, and having a first region disposed on the first electrode and a second region disposed on the protective layer; and a second electrode electrically connected to the second conductive semiconductor layer.

The present invention relates to a light-emitting diode (LED) which comprises multiple point-like transparent conductive electrodes, a dielectric layer, and an epitaxial composite layer. The dielectric layer is disposed around each point-like transparent conductive electrode. The epitaxial composite layer comprises a carbon-doped gallium arsenide epitaxial layer. The carbon-doped gallium arsenide epitaxial layer is disposed both on each point-like transparent conductive electrode and the dielectric layer and electrically connected to each point-like transparent conductive electrode.

A pixel device is provided to include: a first light emitting source including a first light emitting structure including a first-1 semiconductor layer, a first active layer, and a first-2 semiconductor layer on a first base; a second light emitting source including a second light emitting structure including a second-1 semiconductor layer, a second active layer, and a second-2 semiconductor layer on the first light emitting source; a third light emitting source including a third light emitting structure including a third-1 semiconductor layer, a third active layer, and a third-2 semiconductor layer on the second light emitting source; a common electrode electrically connected to the first-1 semiconductor layer, the second-1 semiconductor layer, and the third-1 semiconductor layer; a first electrode electrically connected to the first-2 semiconductor layer; a second electrode electrically connected to the second-2 semiconductor layer; and a third electrode electrically connected to the third-2 semiconductor layer.