Patent classifications
H10H20/8316
Transparent display
A transparent display includes a first transparent substrate, pixel structures, first electrodes, and second electrodes. The pixel structures are located on the first transparent substrate. Each pixel structure includes light-emitting elements. A pitch of adjacent light emitting elements in each pixel structure is 0.17 mm to 0.34 mm. A pitch of adjacent pixel structures is 3.4 mm to 15.4 mm. The first electrodes and the second electrodes are electrically connected to the pixel structures.
Light-emitting device and manufacturing method thereof
A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.
Display device
A display device includes pixel areas; and a pixel disposed in each of the pixel areas. The pixel includes a first electrode and a second electrode disposed on a substrate and disposed on a same layer, a light emitting element disposed on the first electrode and the second electrode, a third electrode electrically connecting the first electrode to a first end of the light emitting element, a fourth electrode electrically connecting the second electrode to a second end of the light emitting element, and an electrode pattern and the electrode pattern and one of the third electrode and the fourth electrode being disposed on a same layer.
SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor stack, an insulating structure, a metal oxide structure and a metal structure. The semiconductor stack includes a first semiconductor structure, a second semiconductor structure and an active structure located between the first semiconductor structure and the second semiconductor structure. The insulating structure is disposed below the first semiconductor structure and comprising a first opening and a second opening. The metal oxide structure is disposed below the insulating structure and located in the first opening, and contacts the semiconductor stack to form a first contact surface therebetween. The metal structure is located in the second opening, and contacts the semiconductor stack to form a second contact surface therebetween. The first contact surface is separated from the second contact surface.
LED DISPLAY APPARATUS
A display apparatus including a display substrate, light emitting devices disposed on the display substrate, circuit electrodes disposed between the light emitting devices and the display substrate, and a transparent layer covering the light emitting devices and the circuit electrodes, in which at least one of the light emitting devices includes a first LED sub-unit configured to emit light having a first wavelength, a second LED sub-unit adjacent to the first LED sub-unit and configured to emit light having a second wavelength, a third LED sub-unit adjacent to the second LED sub-unit and configured to emit light having a third wavelength, and a substrate disposed on the third LED sub-unit, in which a difference in refractive indices between the 10 transparent layer and air is less than a difference in refractive indices between the substrate and a semiconductor layer of the third LED sub-unit.
LIGHT EMITTING DEVICE HAVING WIDE BEAM ANGLE AND METHOD OF FABRICATING THE SAME
A light emitting device including a light emitting structure disposed on one surface of a substrate and a transflective portion disposed on the other surface of the substrate. The transflective portion and the substrate have different indexes of refraction from one another.
VERTICAL SOLID-STATE TRANSDUCERS HAVING BACKSIDE TERMINALS AND ASSOCIATED SYSTEMS AND METHODS
Vertical solid-state transducers (SSTs) having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the SST, a second semiconductor material at a second side of the SST opposite the first side, and an active region between the first and second semiconductor materials. The SST can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. A portion of the first contact can be covered by a dielectric material, and a portion can remain exposed through the dielectric material. A conductive carrier substrate can be disposed on the dielectric material. An isolating via can extend through the conductive carrier substrate to the dielectric material and surround the exposed portion of the first contact to define first and second terminals electrically accessible from the first side.
LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE INCLUDING THE SAME
Disclosed herein is a light emitting device. The light emitting device is provided to include a light emitting structure, a first electrode pad, a second electrode pad and a heat dissipation pad, and a substrate on which the light emitting diode is mounted. The substrate includes a base; an insulation pattern formed on the base; and a conductive pattern disposed on the insulation pattern. The base includes a post and a groove separating the post from the conductive pattern. An upper surface of the post is placed lower than an upper surface of the conductive pattern, the heat dissipation pad contacts the upper surface of the post, and the first electrode pad and the second electrode pad contact the conductive pattern. With this structure, the light emitting device has excellent properties in terms of electrical stability and heat dissipation efficiency.
Organic Light-Emitting Diode Having a Plurality of Light-Emitting Segments
An organic light-emitting diode is disclosed. In an embodiment, the diode includes a first light-emitting segment and at least a second light-emitting segment, wherein the first and second light-emitting segments include a common first electrode and a common second electrode, and are configured to emit radiation with different brightnesses, wherein the first electrode includes at least one separating line that does not completely cut through the first electrode, wherein an electric conductivity of the first electrode is reduced in a region of the separating line, wherein the separating line separates the first light-emitting segment from the second light-emitting segment, and wherein the second light-emitting segment has a lower brightness during operation than the first light-emitting segment.
Semiconductor light-emitting device and method of manufacturing the same
A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer.