A lighting device disclosed in an embodiment of the invention includes a substrate; a reflective layer disposed on the substrate; a light source passing through the reflective layer and disposed on the substrate; a resin layer disposed on the reflective layer; and an optical pattern disposed on the resin layer, wherein the light source includes a first light emitting device and a second light emitting device spaced apart from the first light emitting device, wherein the optical pattern may include a first optical pattern disposed on an upper portion of the first light emitting device and a second optical pattern disposed on an upper portion of the second light emitting device, and the first optical pattern and the second optical pattern may have different areas.

A light source device includes a substrate and a light source. The light source includes a first light emission unit, a plurality of second light emission units, and a plurality of third light emission units arranged two-dimensionally on the substrate. The first light emission unit is arranged at a center among the light emission units, and includes a first light emission element having a first light emission face. The second light emission units surround the first light emission unit, and include a plurality of second light emission elements, respectively, each having a second light emission face. The third light emission units surround the second light emission units, and include a plurality of third light emission elements, respectively, each having a third light emission faces. The first light emission face and the second light emission faces all have the same areas. The third light emission faces have different areas.

A light source device includes a substrate and a light source. The light source includes a first light emission unit, a plurality of second light emission units, and a plurality of third light emission units arranged two-dimensionally on the substrate. The first light emission unit is arranged at a center among the light emission units, and includes a first light emission element having a first light emission face. The second light emission units surround the first light emission unit, and include a plurality of second light emission elements, respectively, each having a second light emission face. The third light emission units surround the second light emission units, and include a plurality of third light emission elements, respectively, each having a third light emission faces. The first light emission face and the second light emission faces all have the same areas. The third light emission faces have different areas.

An embodiment provides a light-emitting device package comprising: a first lead frame; a second lead frame; a light-emitting device electrically connected to the first lead frame and the second lead frame; a molding unit arranged to surround the light-emitting device; and an oxynitride-based phosphor represented by chemical formula LXMYOaNbAcBd:zR (1X3, 3Y7, 0.001Z1.0, 0a5, 0.1b9, 0.001c0.3, 0.001d0.3), and the light-emitting device package of the present embodiment can implement a white color light having excellent luminance and color rendering index.

A light-emitting device includes a substrate, a first light emitter that is disposed on the substrate and emits light, and a second light emitter that is disposed on the substrate and emits light of a color different from a color of the light emitted by the first light emitter. The first light emitter and the second light emitter are disposed along a periphery of the substrate.

A method for manufacturing an electronic component package comprises: (i) preparing a metal foil having opposed principal surface A for placement of an electronic component and principal surface B, and a through-hole located in an electronic component-placement region of surface A; (ii) placing the electronic component on the metal foil such that the electronic component is positioned in the electronic component-placement region, and an opening of the through-hole is capped with an electrode of the electronic component; (iii) forming a sealing resin layer on surface A such that the electronic component is covered with the sealing resin layer; and (iv) forming a metal plating layer on surface B. A dry plating process and a wet plating process are performed to form the metal plating layer in step (iv) such that the through-hole is filled with the metal plating layer, and the metal foil and the metal plating layer are integrated.

A light-emitting apparatus includes a plurality of light-emitting element columns sealed with a sealing member, each including a plurality of light-emitting elements. In at least one of the plurality of light-emitting element columns, the plurality of light-emitting elements are all positioned or a virtual straight line. At least one of the plurality of light-emitting element columns includes at least one set of a first light-emitting element and a second light-emitting element that are positioned adjacent to each other. The first light-emitting element is disposed to form a first angle between the virtual straight line and a longitudinal direction of the first light-emitting element. The second light-emitting element is disposed to form a second angle different from the first angle between the virtual straight line and a longitudinal direction of the second light-emitting element.

To provide a light emitting device that has a structure in which a light emitting element is sandwiched by two substrates to prevent moisture from penetrating into the light emitting element, and a method for manufacturing thereof. In addition, a gap between the two substrates can be controlled precisely. In the light emitting device according to the present invention, an airtight space surrounded by a sealing material with a closed pattern is kept under reduced pressure by attaching the pair of substrates under reduced pressure. A columnar or wall-shaped structure is formed between light emitting regions inside of the sealing material, in a region overlapping with the scaling material, or in a region outside of the scaling material so that the gap between the pair of substrates can be maintained precisely.

A light-emitting diode (LED) display panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits, a micro lens array including a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies, and an optical spacer formed between the LED array and the micro lens array.

A light-emitting diode (LED) projector includes an LED display panel and a projection lens arranged in front of LED display panel and configured to collect and project light emitted by the LED display panel. The LED display panel includes an LED panel and a micro lens array arranged over the LED panel. The LED panel includes a substrate, a driver circuit array on the substrate and including a plurality of pixel driver circuits arranged in an array, and an LED array including a plurality of LED dies each being coupled to one of the pixel driver circuits. The micro lens array includes a plurality of micro lenses each corresponding to and being arranged over at least one of the LED dies.