A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a resin layer surrounding the light emitting device, a PSR (photo solder resist) layer disposed between the first and second lead frames and the second lead frame and a sidewall disposed at the peripheral area of the light emitting device and including an inclined plane formed on at least one side surface thereof.

Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

The present invention provides a light-emitting diode (LED) chip. The LED chip includes a LED structure and an electrostatic discharge (ESD) protection structure. The ESD protection structure is in a corner of the LED chip and connects with the LED structure in anti-parallel. An interface between the LED structure and the ESD protection structure is a straight line from a top view.

A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member.

A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) an adhesion promoter represented by the average unit formula; and (D) a hydrosilylation reaction catalyst. Provided is a curable silicone composition for forming a transparent cured product having high adhesion to a substrate, and an optical semiconductor device having excellent reliability made using the composition.

A process for synthesizing a color stable Mn.sup.4+ doped phosphor includes contacting a precursor of formula I, in gaseous form at an elevated temperature with a fluorine-containing oxidizing agent to form the color stable Mn.sup.4+ doped phosphor
A.sub.x[MF.sub.y]:Mn.sup.4+I
wherein A is Li, Na, K, Rb, Cs, NR.sub.4 or a combination thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; R is H, lower alkyl, or a combination thereof; x is the absolute value of the charge of the [MF.sub.y] ion; and y is 5, 6 or 7.

A light emitting device includes a base member, a light emitting element, and a sealing member. The substrate includes a wiring portion. The element is arranged on or above the substrate. The sealing member covers the element, and at least a part of the substrate. The sealing member includes a wavelength conversion member. The part of the substrate is divided into first and second sections by a straight line that passes through the center of the part as viewed in plan view. The wiring portion is arranged so that its area on the first section side is larger than on the second section side. The element is arranged so that its area in the second section is larger than the first section. The height of the sealing member on the second section side is greater than on the first section side.

A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

A LED lamp filament, comprising: a long strip-shaped substrate, a plurality of light-emitting units arranged on a first surface of the substrate and distributed along the extending direction of the substrate, and a light-transmittable fluorescent glue layer covering the first surface and the plurality of light-emitting units. A plurality of bulges are provided on at least one side of the substrate, and the bulges are distributed along the extending direction of the substrate; one part of light excited by the fluorescent glue layer and emitted from the light-emitting units emits out in a direction towards a second surface, opposite to the first surface, of the substrate from a space between adjacent bulges.

Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.