A 3D semiconductor device including: a first level including a first single crystal layer and first transistors, which each include a single crystal channel; a first metal layer with an overlaying second metal layer; a second level including second transistors, overlaying the first level; a third level including third transistors, overlaying the second level; a fourth level including fourth transistors, overlaying the third level, where the second level includes first memory cells, where each of the first memory cells includes at least one of the second transistors, where the fourth level includes second memory cells, where each of the second memory cells includes at least one of the fourth transistors, where the first level includes memory control circuits, where second memory cells include at least four memory arrays, each of the four memory arrays are independently controlled, and at least one of the second transistors includes a metal gate.

Disclosed herein is a lead frame assembly including a frame and lead frame units each including a chip holder having first and second electrode pads; and a pin unit having a first pin, a second pin and third pins each extending from the chip holder. The pin unit extending from one of the lead frame units is connected to the pin unit of the adjacent one of the lead frame units. For the lead frame units disposed adjacent to the frame, the pin units extending towards the frame are connected to the frame such that the lead frame units are fixedly positioned within the frame. A chip packaging device including a lead frame body and a packaging structure is also disclosed.

A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

A light emitting device including first, second, and third light emitting stacks each including first and second conductivity type semiconductor layers, a first lower contact electrode in ohmic contact with the first light emitting stack, and second and third lower contact electrodes respectively in ohmic contact with the second conductivity type semiconductor layers of the second and third light emitting stacks, in which the first lower contact electrode is disposed between the first and second light emitting stacks, the second and third lower contact electrodes are disposed between the second and third light emitting stacks, and the first, second, and third lower contact electrodes include transparent conductive oxide layers.

A display apparatus includes a circuit substrate, light-emitting elements, a bonding pad and an encapsulation glue layer. The circuit substrate has a display area, an outer lead bonding area and a connection area connected between the display area and the outer lead bonding area. The light emitting elements are disposed on the display area of the circuit substrate. The bonding pad is disposed on the outer lead bonding area of the circuit substrate. The encapsulation glue layer is disposed on the circuit substrate and includes a flat portion and a thick wall portion connected with each other. The flat portion covers the light emitting elements. The thick wall portion extends to the connection area. The thick wall portion has a thickness which gradually increases toward the outer lead bonding area. In addition, an array substrate is also provided.

A light emitting device includes: a base substrate; a plurality of unit regions provided on the base substrate; a barrier disposed at a boundary of the unit regions to surround each of the unit regions; a dam disposed in each of the unit regions to be spaced apart from the barrier; a first electrode provided in each of unit light emitting regions surrounded by the dam; a second electrode disposed in each of the unit light emitting regions, the second electrode of which at least one region is provided opposite to the first electrode; and one or more LEDs provided in each of the unit light emitting regions, the one or more LEDs being electrically connected between the first electrode and the second electrode.

Light-emitting diode (LED) packages and more particularly anchored light mixing structures in LED packages and related methods are disclosed. LED packages include one or more LED chips and integrated light mixing structures, such as light collectors, that are placed over the LED chips to modify far field patterns. Light mixing structures are provided within recesses of LED package housings in positions over the LED chips. Sidewalls of recesses may include alignment features with shapes configured to receive corresponding shapes of light mixing structures. Alternative configurations, alone or in combination with the sidewall alignment features, may include alignment features on top surfaces of the LED packages outside of a recess. As disclosed herein, alignment features are arranged to effectively anchor a light mixing structure in place during package assembly. Additional package structures, such as encapsulants and/or epoxies, may further hold the light mixing structures in place.

A light emitting diode (LED) lighting device includes at least one LED assembly comprising a substrate and two or more LEDs configured to generate light spaced apart along the substrate. A cured structural coating is disposed on at least a portion of the LED assembly, wherein the cured structural coating is configured to maintain the LED assembly in a predetermined shape. The substrate of the LED assembly may comprise an elongated and/or flexible substrate.

A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).