A light emitting device including a transparent board elongated in a first direction and having a first surface and an opposite second surface. Light emitting elements are arranged in the first direction on the first surface side of the board. A transparent bulb houses the board and the elements. A base is connected to the bulb, and leads electrically connect the elements to the base. The leads have a first end portion connected to the base, and an opposite second end portion. Conductive members are respectively connected to the second end portions of the leads, and the conductive members are arranged at both side of the elements on the board in the first direction. A first wavelength converting member is provided on the first surface and seals the elements. The first wavelength converting member is elongated in the first direction. The second surface of the board faces the base.

The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

A chip substrate includes at least one insulation portion interposed between conductive portions. A cavity formed in a recessed shape from a region of an upper surface of the chip substrate exposes a top surface of a part of the at least one insulation portion. An insulation layer is coated on the upper surface of the chip substrate excluding the region of the cavity. A bump may be formed at a predetermined height within the cavity.

First and second multi-LED packages are installed on a carrier. Each package includes its own emitting diodes that are series coupled to each other and that are encased within a single, internally reflective package having two external terminals. Each package has a light output face from which light, produced by all of the emitting diodes contained therein is emitted in response to a forward current passing through the two terminals. Each package also has phosphor mediums each positioned to be stimulated by primary light of a respective one of its contained emitting diodes, and in response emit secondary wavelength-converted light that emerges from the light output face and is combined with some of the primary light to yield white light. Other embodiments are also described and claimed.

A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 410.sup.5/K and at most 810.sup.5/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30 C. and at most 50 C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 m and at most 15 m.

A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

A light emitting device includes a resin package including a first lead and a second lead. A light emitting element includes a first electrode disposed to face the first lead and having a first post electrode projecting toward the first lead in a first projecting direction with a height equal to or larger than 50 m and equal to or smaller than 150 m in the first projecting direction and a second electrode disposed to face the second lead and having a second post electrode projecting toward the second lead in a second projecting direction with a height equal to or larger than 50 m and equal to or smaller than 150 m in the second projecting direction. A first electrically conductive bonding member connects the first lead and the first post electrode. A second electrically conductive bonding member connects the second lead and the second post electrode.

A light emitting device includes a substrate; a first frame located on the substrate; a second frame located on the substrate, the second frame being located inward of and spaced apart from the first frame; at least one first light emitting element located on the substrate in a first region located between the first frame and the second frame; at least one second light emitting element located on the substrate in a second region located inward of the second frame; and a sealing member covering the at least one first light emitting element and the at least one second light emitting element. The second frame includes a light-transmissive portion. A highest portion of the second frame is higher than a highest portion of the first frame.

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

A light emitting device includes a substrate, a light emitting element mounted on the substrate, a phosphor plate for covering an upper surface of the light emitting element, a white reflecting resin placed on the substrate to surround side surfaces of the light emitting element and the phosphor plate, and a reflecting frame, including a reflecting film formed by plating and a bonding portion, and placed on the substrate to surround the light emitting element, the phosphor plate, and the white reflecting resin. The reflecting frame is directly bonded to the substrate by the bonding portion in a portion where the white reflecting resin is not located.