Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device includes a body, a first electrode installed in the body and a second electrode separated from the first electrode, a light emitting chip formed on one of the first and second electrodes, and electrically connected to the first and second electrodes, and a protective cap projecting between the first and second electrodes.

A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

A light emitting device package can include a base including a flat top surface; first and second electrical circuit layers on the flat top surface; a light emitting diode on a region of the flat top surface; an optical member to pass light; and a guiding member having a closed loop shape surrounding the region for guiding the optical member, in which the first and second electrical circuit layers respectively include first and second portions disposed between the flat top surface and a bottom surface of the guiding member, in which the first and second electrical circuit layers respectively include first and second extension portions that respectively extend from the first and second portions to locations outside of an outer edge of the guiding member in different directions.

A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for mounting on a mounting substrate, and includes a semiconductor layered structure including a first semiconductor layer, an active layer and a second semiconductor layer; a first connecting electrode exposed from the first lateral surface and electrically connected to the first semiconductor layer; a first electrode disposed between the first semiconductor layer and the first connecting electrode; a second connecting electrode exposed from the first lateral surface; a metal wire electrically connecting an upper surface of the second semiconductor layer to the second connecting electrode; and a resin layer. In a direction perpendicular to the light emission surface, the active layer does not overlap with the first connecting electrode, and the active layer does not overlap with the second connecting electrode.

This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

Provided are a light source package and a display device including the light source package. The light source package includes a substrate; a light-emitting device mounted on the substrate; a red phosphor layer formed adjacent to a surface of the light-emitting device; and an encapsulation layer for encapsulating the light-emitting device and the red phosphor layer, wherein a phosphor of the red phosphor layer is a fluoride-based red phosphor or a sulfide-based red phosphor. The light source package and the display device including the light source package display excellent color reproduction, without discoloration due to moisture after a long period of time.

A light emitting device includes: a light emitting element that includes a light extracting surface, an electrode formed surface opposite to the light extracting surface, one or more lateral surfaces, and a pair of electrodes positioned on the electrode formed surface; a light-transmissive member that includes a light entering surface, a light exiting surface opposite to the light entering surface, and one or more lateral surfaces, the light entering surface being disposed on the light extracting surface; an insulating member that covers the lateral surfaces and the electrode formed surface of the light emitting element, and is disposed to expose at least part of the pair of electrodes; a first metal layer that covers the lateral surfaces of the light-transmissive member; and a second metal layer that covers the lateral surfaces of the light emitting element interposing the insulating member.

A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction.

A light emitting device comprises an LED die, a dome lens encapsulating the LED die, the dome lens having a first outer curved surface, and a photopolymerizable composition disposed on the dome lens. The photopolymerizable composition forms a meniscus lens defined by a second outer curved surface and an inner curved surface, the inner curved surface being in contact with only a portion of the first outer curved surface. The dome lens and the meniscus lens in combination form an elongated dome lens.