F21Y105/18

Electronics housing assembly with improved heat dissipation

Embodiments of the present invention provide electronics housings that house drivers and other electronics for powering/controlling light sources within a light fixture. The electronics housings are designed to physically isolate the electronics housed within and improve contact between the housing and the electronics to create direct thermal paths for heat dissipation. Heat sink fins may be provided on the electronics housings to create air passageways through which air can move to remove heat from the electronics housings and the light fixtures to which they are attached.

Light-emitting substrate, light-emitting apparatus and lighting apparatus

The present disclosure provides a light-emitting substrate, a light-emitting apparatus and a lighting apparatus. The light-emitting substrate includes: a base substrate including a plurality of light-emitting regions and a plurality of non-light-emitting regions, where the plurality of light-emitting regions are arranged in an array; a plurality of light-emitting units located in the plurality of light-emitting regions, respectively, where in each light-emitting region, more than one light-emitting unit is arranged in an array; a covering layer covering the light-emitting region and the non-light-emitting region; and a plurality of support structures arranged in an array and evenly distributed in the plurality of non-light-emitting regions and/or between the plurality of light-emitting units, where the support structures are used to support the covering layer.

Light-emitting element and light source module
12584598 · 2026-03-24 · ·

Alight source module comprises the light-emitting element, a heat radiator and a diffusion lens. The light-emitting element comprises a substrate and a chip module arranged on the substrate. RGB light mixing units and cold and warm light mixing units of the light-emitting element are concentrically arranged, a plurality of RGB light mixing units and a plurality of cold and warm light mixing units are alternately arranged at intervals, and the plurality of RGB light mixing units and the plurality of cold and warm light mixing units are rotationally symmetrical about the center of the chip module.