A method of manufacturing a thin film transistor is disclosed. The method of manufacturing the thin film transistor includes: manufacturing a substrate; forming an oxide semiconductor layer on the substrate; forming a pattern including an active layer through a patterning process; forming a source and drain metal layer on the active layer; and forming a pattern including a source electrode and a drain electrode through a patterning process, an opening being formed between the source electrode and the drain electrode at a position corresponding to a region of the active layer used as a channel, wherein the step of forming the pattern including the source electrode and the drain electrode through a patterning process includes: removing a portion of the source and drain metal layer corresponding to the position of the opening through dry etching. The method may also be used to manufacturing a thin film transistor.

A semiconductor device includes a first barrier layer having a barrier property against oxygen and hydrogen over a substrate, a first insulator over the first barrier layer, a second insulator over the first insulator, a third insulator over the second insulator, a transistor including an oxide semiconductor over the third insulator, a fourth insulator including an oxygen-excess region over the transistor, and a second barrier layer having a barrier property against oxygen and hydrogen over the fourth insulator. The transistor includes a first conductor with oxidation resistance, a second conductor with oxidation resistance, and a third conductor with oxidation resistance, the second insulator includes a high-k material, the first barrier layer and the second barrier layer are in contact with each other in an outer edge of a region where the transistor is provided, and the transistor is surrounded by the first barrier layer and the second barrier layer.

A display apparatus includes: a light emitting device in which a first electrode, a light emitting layer, and a second electrode are laminated; a pixel circuit, which is arranged on a lower side of the light emitting device, having a drive transistor including a source electrode connected to the first electrode and controlling a current supplied to the light emitting device; a first metal plate and a second metal plate arranged to face the light emitting layer across the first electrode; and a first insulating layer arranged between the first electrode and both the first metal plate and the second metal plate. The first metal plate is connected to a gate electrode of the drive transistor, the second metal plate is connected to a first voltage line, and the first metal plate and the second metal plate are arranged on the same plane face.

A flexible device is manufactured at low temperatures. A second substrate is bonded to a first substrate by a first adhesive layer. A first insulating layer, a transistor, and a second insulating layer are formed over the second substrate. Then, the first substrate and the second substrate are separated from each other while being heated at a first temperature. The heat resistant temperatures of the first substrate, the second substrate, and the first adhesive layer are a second temperature, a third temperature, and a fourth temperature, respectively. Each of the first insulating layer, the second insulating layer, and the transistor is formed at a temperature higher than or equal to room temperature and lower than the fourth temperature. The third temperature is higher than the fourth temperature and lower than the second temperature. The first temperature is higher than the fourth temperature and lower than the third temperature.

An embodiment of the present invention provides an array substrate, its manufacturing method and a display device. The method for manufacturing the array substrate comprises forming a common electrode with a slit structure on a substrate, and a pixel electrode with a slit structure not overlapping the common electrode. According to the present invention, it is able to reduce storage capacitance between the common electrode and the pixel electrode, thereby to ensure the image quality.

The present application discloses a conductive layer in a semiconductor apparatus, comprising a metal sub-layer and an anti-reflective coating over the metal sub-layer for reducing light reflection on the metal sub-layer; wherein the anti-reflective coating comprises a light absorption sub-layer on the metal sub-layer for reducing light reflection by absorption and a light destructive interference sub-layer on a side of the light absorption layer distal to the metal sub-layer for reducing light reflection by destructive interference; and the metal sub-layer is made of a material comprising M1, wherein M1 is a single metal or a combination of metals; the light absorption sub-layer is made of a material comprising M2O.sub.aN.sub.b, wherein M2 is a single metal or a combination of metals, a>0, and b0; the light destructive interference sub-layer is made of a material comprising M3O.sub.c, wherein M3 is a single metal or a combination of metals, and c>0; the light absorption sub-layer has a refractive index larger than that of the light destructive interference sub-layer.

Provided is a semiconductor device which has low power consumption and can operate at high speed. The semiconductor device includes a memory element including a first transistor including crystalline silicon in a channel formation region, a capacitor for storing data of the memory element, and a second transistor which is a switching element for controlling supply, storage, and release of charge in the capacitor. The second transistor is provided over an insulating film covering the first transistor. The first and second transistors have a source electrode or a drain electrode in common.

The present invention provides a BOA liquid crystal panel and a manufacturing method thereof. The BOA liquid crystal panel includes a first substrate, a second substrate opposite to the first substrate, a black matrix arranged in the first substrate, a thin-film transistor arranged on the black matrix, a color resist layer arranged on the second substrate, a common electrode layer arranged on the second substrate and the color resist layer, a photoresist spacer arranged on the common electrode layer and located between the first substrate and the second substrate, and a liquid crystal layer arranged between the first substrate and the second substrate. The present invention arranges the black matrix of the liquid crystal panel in a channel that is pre-formed in a substrate to make the film thickness of the liquid crystal panel uniform and improve the display performance of the liquid crystal panel.

A display may have an array of pixels controlled by display driver circuitry. The pixels may have pixel circuits. In liquid crystal display configurations, each pixel circuit may have an electrode that applies electric fields to an associated portion of a liquid crystal layer. In organic light-emitting diode displays, each pixel circuit may have a drive transistor that applies current to an organic light-emitting diode in the pixel circuit. The pixel circuits and display driver circuitry may have thin-film transistor circuitry that includes transistor such as silicon transistors and semiconducting-oxide transistors. Semiconducting-oxide transistors and silicon transistors may be formed on a common substrate. Semiconducting-oxide transistors may have polysilicon layers with doped regions that serve as gates. Semiconducting-oxide channel regions overlap the gates. Transparent conductive oxide and metal may be used to form source-drain terminals that are coupled to opposing edges of the semiconducting oxide channel regions.

As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an IC chip including a driver circuit for driving of the gate and signal lines by bonding or the like. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. Therefore, when the pixel portion and the driver portion are provided over the same substrate, manufacturing cost can be reduced.