Patent classifications
H05K5/15
THIN THERMALLY AND CHEMICALLY STRENGTHENED GLASS-BASED ARTICLES
Embodiments of thermally and chemically strengthened glass-based articles are disclosed. In one or more embodiments, the glass-based articles may include a first surface and a second surface opposing the first surface defining a thickness (t), a first CS region comprising a concentration of a metal oxide that is both non-zero and varies along a portion of the thickness, and a second CS region being substantially free of the metal oxide of the first CS region, the second CS region extending from the first surface to a depth of compression of about 0.17.Math.t or greater. In one or more embodiments, the first surface is flat to 100 m total indicator run-out (TIR) along any 50 mm or less profile of the first surface. Methods of strengthening glass sheets are also disclosed, along with consumer electronic products, laminates and vehicles including the same are also disclosed.
COMPUTE CHASSIS HAVING A LID THAT SECURES AND REMOVES AIR BAFFLES
A chassis includes a base, a lid, and air baffles disposed within the base. The lid slidably engages opposing base side walls and slides between secured and unsecured positions. In one embodiment, a mechanical latch attaches to the lid and has a spring-biased latch arm for selectively locking the lid to the base and a latch hook for selectively locking the air baffle to the lid, wherein depressing the mechanical latch releases the lid from the base and physically separating the lid from the base causes the latch hook to secure the air baffle for removing the air baffle along with the lid. In another embodiment, a first magnet is attached to the lid and a second magnet is attached to the air baffle, wherein sliding the lid to the unsecured position aligns the first and second magnets and magnetically couples the air baffle to the lid.
Modular computer network system with modules having geometric shapes arranged into tessellated arrays
Scalable up and down nesting integrated electronic enclosures with form factors including asteroids and/or dumbbells and/or approximated tessellation(s)/tiling(s) or combinations thereof with thermal management, wiring, sliding fit, manual and/or automated full range vertical to horizontal positioning, access and structural systems for individual modules and intra- and inter-planar stacks, columns, rows, arrays and associated infrastructures.
Compute chassis having a lid that secures and removes air baffles
A chassis includes a base, a lid, and air baffles disposed within the base. The lid slidably engages opposing base side walls and slides between secured and unsecured positions. In one embodiment, a mechanical latch attaches to the lid and has a spring-biased latch arm for selectively locking the lid to the base and a latch hook for selectively locking the air baffle to the lid, wherein depressing the mechanical latch releases the lid from the base and physically separating the lid from the base causes the latch hook to secure the air baffle for removing the air baffle along with the lid. In another embodiment, a first magnet is attached to the lid and a second magnet is attached to the air baffle, wherein sliding the lid to the unsecured position aligns the first and second magnets and magnetically couples the air baffle to the lid.
HOUSING FOR RECEIVING ELECTRONIC COMPONENTS
A housing for receiving electronic components includes a housing body and a housing cover. The housing body and the housing cover are connected to one another at multiple fastening points. At least one of the fastening points is surrounded by recesses at least in part on the housing body or on the housing cover so that in the event of an internal pressure p.sub.in in the housing exceeding a predetermined threshold value p.sub.max the housing body or the housing cover deforms in the region of the at least one fastening point and a gap is formed between the housing body and the housing cover.
APPLYING PRESSURE TO ADHESIVE USING CTE MISMATCH BETWEEN COMPONENTS
Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
PROTECTIVE ENCLOSURE FOR A PORTABLE ELECTRONIC DEVICE
A protective enclosure for use with a portable electronic device includes a rigid shell and a cushion layer. The rigid shell is configured to removably cover at least a portion of the portable electronic device. The rigid shell includes openings and one of a tab and a groove on an external surface of the rigid shell. The cushion layer is removably disposable over the rigid shell and conforms to the external surface of the rigid shell to cushion the rigid shell. The cushion layer includes one of a groove and a tab that corresponds to and interfaces with the one of a tab and a groove of the rigid shell to retain the cushion layer to the rigid shell when the cushion layer is disposed over the rigid shell. The cushion layer further includes an opening that aligns with at least one of the openings of the rigid shell.
METHOD AND APPARATUS FOR BENDING A GLASS SHEET AND AN ELECTRONIC DEVICE CASING
A method of bending a glass sheet includes placing the glass sheet on a support and heating the entire glass sheet to a first viscosity. A band of heat is applied and translated along the selected region of the glass sheet in which a predetermined is to be formed over a time period to form the predetermined in the selected region. The band of heat sectionally heats the selected region to a second viscosity that is lower than the first viscosity. An actuated force is applied to the glass sheet to incrementally form the predetermined bend in the selected region according to the location of the band of heat in the selected region.
PROTECTIVE CUSHION COVER FOR AN ELECTRONIC DEVICE
A protective case for an electronic device may have two layers: an inner cushion cover that surrounds a portion of the electronic device, and an outer rigid shell that surround part of the cushion cover. The outer shell has side walls that engage and hold the cushion cover on the electronic device. The cushion cover has reduced thickness portions so that the side walls are embedded in the cushion cover and provide a protective case having a substantially smooth exterior. The cushion cover is capable of absorbing shocks from impacts on the rigid outer shell. Coring on the inner portion of the cushion cover provides additional softness and the ability of the cushion cover to absorb shocks while using a higher density material, which is able to conform to the electronic device.
PORTABLE DEVICE
A portable device includes a circuit board, a first member, and a second member. The circuit board is held and fastened between the first member and the second member. The first member includes a wall that extends toward the second member from the first member. The second member includes an engaging portion. The engaging portion includes an extension, which extends toward the first member from the second member, and a hook, which projects from the extension in a direction extending along an end surface of the circuit board. The portable device further includes an engaged portion located along an inner side of the wall. Engagement of the engaged portion with the hook of the engaging portion fastens the first member to the second member.