B29L31/34

ADHESION MOLD LOCKING FASTENER
20250353257 · 2025-11-20 ·

Techniques are provided herein for implementing an adhesion mold locking fastener that fasten two components together while optionally sealing the interface between the two components. In an implementation, an adhesive fastener includes a first bulge feature proximate to a first component having a first escape hole and a second bulge feature proximate to a second component having a second escape hole. In some implementations, the adhesive fastener extends from the first bulge feature through the first escape hole and the second escape hole to the second bulge feature. In some implementations, the first bulge feature corresponds to a first profile of a first mold applied to an exterior of the first component and the second bulge feature corresponds to a second profile of a second mold applied to the exterior of the second component.

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

A method of fabricating a display device includes: preparing a substrate including emission areas and a non-emission area between the emission areas; forming a bank on the non-emission area to a first height; forming light conversion patterns on the emission areas to a height equal to or less than the first height; polishing a surface of a light conversion layer including the bank and the light conversion patterns so that the surface of the light conversion layer is flat; and forming a filler layer on a surface of the substrate on which the light conversion layer is provided. The polishing of the light conversion layer includes planarizing the surface of the light conversion layer so that the bank and the light conversion patterns have a second height through chemical mechanical polishing utilizing a metallic slurry.

WIRE TRAP AND METHOD OF FORMING A WIRE TRAP
20250353249 · 2025-11-20 · ·

A method of forming a wire trap on a surface of a product for holding a wire is provided. The method comprises forming a wire trap by deposition onto the surface of the product such that the wire trap defines a channel for holding the wire. The channel comprises a channel opening and channel walls defining a channel width that varies as a function of channel depth from the channel opening to a channel base of the channel, the channel opening having an opening width that is smaller than a maximum channel width such that, when received in the wire trap, a wire having a diameter larger than the opening width can be held in the channel by an interference fit. A product comprising a wire trap is also provided.

Die-casting metal part-polymer resin composite and method for preparing same

The present invention relates to a metal-polymer resin composite in which a polymer resin is directly injection-molded to a zinc alloy, a magnesium alloy, or a die-casting part thereof, and thus an injection product is directly bonded to a metal surface, wherein in the case of a hard polymer resin, a tensile strength of the metal and the polymer resin is 30 MPa or greater, and in the case of a soft polymer resin, a tensile strength of the metal and the polymer resin is 20 MPa or greater, and an average helium leakage after 10 times of measurement is 10.sup.8 Pa.Math.m.sup.3/s or less, and a novel method for preparing the same.

Multilayer fluidic devices and methods for their fabrication

A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.

Anisotropic film and method for manufacturing anisotropic film

An anisotropic electro-conductive film having high reliability, which electrically connects circuit electrodes having a fine pattern. The anisotropic film contains an insulating resin and particle groups. The particle groups are groups of particles in which a plurality of particles are bound together with a binder. The particle groups are regularly arranged with an interval of 1 m to 1,000 m.

Heatable plastics component and method for producing

A method for manufacturing a heatable plastic component for a motor vehicle, which includes: providing a planar heating film, which has a first surface and a second surface that faces away from and is opposite the first surface, including at least one heating wire and connecting elements; introducing the planar heating film into an injection mold; mounting a connector housing onto the connecting elements; and back-molding the first surface with a plastic for manufacturing a first partial element of the heatable plastic component in the injection mold. In order to provide an improved method for manufacturing a heatable plastic component, it is proposed that a back-molding of the second surface with a plastic for manufacturing a second partial element of the heatable plastic component in the injection mold takes place such that a composite is formed from the first partial element, the planar heating film and the second partial element.

Production method and production device for three-dimensionally fabricated object
12565006 · 2026-03-03 · ·

To provide a production method and a production device for a three-dimensionally fabricated object that can alleviate a limitation on a curable resin to be used, in a case where the three-dimensionally fabricated object having an electronic device is produced using an additive manufacturing method. A production method for a three-dimensionally fabricated object of the present disclosure includes a first fabricating step of fabricating the attached object including an attachment section, to which the electronic device is attachable, with a first curable resin, using an additive manufacturing method, a second fabricating step of fabricating a resin layer with a second curable resin, fabricating a conductor with a fluid containing a metal particle, and fabricating the electronic device having the conductor in the resin layer, using the additive manufacturing method, and an attaching step of attaching the electronic device to the attachment section of the attached object.

System and method for continuous fabrication of graded structured units using additive manufacturing

A system and method of continuous fabrication of multi-material graded structures using additive manufacturing is disclosed. Using multi-material feedstocks and optimized processing parameters, the gradient on composition and structure are controlled to achieve smooth transition from one functional component to another functional component. A multi-material graded structure is produced as the feedstocks are transported from the feedstock reservoir system comprised of many different materials. Interface transition from one functional layer to the next is gradient, controlled by feedstock mixture ratios based on the flow rate control for the feedstock system. Composition includes chemical composition, physical composition, and porosity. Continuous automatic additive manufacturing method makes the fabrication more efficient and avoids joining problems. This method finds application in fabrication of a fuel cell, battery, reformer and other chemical reaction and process units, including structures made of multiple units, such as stacks, that incorporate multiple functional components.

Substrate-fastening device and substrate-assembling structure using same
12583190 · 2026-03-24 · ·

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.