Patent classifications
B29L31/34
Co-molded components of a redox flow battery stock
A cell plate assembly of a redox flow battery has a frame body and a cell plate in fluidic communication. Cell plates, electrolyte pathways and other components of the frame plate assembly may be overmolded inside a frame. Plates, frames and tubes may all be robustly sealed. One piece bonded plug and frames enable reduced use of O-rings and other wear items.
Cables with improved coverings to reduce shrinkback and methods of forming the same
A cable includes cable one or more conductors and a covering surrounding the one or more conductors. The covering is formed from a composition including polyethylene and a polyolefin elastomer, where the composition is crosslinked. A method of forming the cable is also provided.
Display protector attaching apparatus for smart device
Disclosed is a display protector attaching apparatus for a smart device. The display protector attaching apparatus for the smart device includes a base part provided with a body coupling hole to which a smart device is coupled and a smart device fixing protrusion; and a lifting support part which is detachably coupled to a lifting coupling part provided in the base part to support a display protector to be attached to the smart device, wherein when the lifting support part is separated from the lifting coupling part, the display protector is dropped on the display of the smart device provided with a liquid adhesive member to be attached to the display, and the lifting coupling part is provided to be position-adjusted in the base part so that the lifting support part adjusts a position supporting the display protector.
Method and apparatus for forming three-dimensional curved surface on laminated substrate, and three-dimensional curved laminated substrate
A method for forming a three-dimensional curved surface on a laminated substrate is provided. In the method, the laminated substrate is brought into close contact with an elastic sheet. Here, the laminated substrate comprises a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin. The elastic sheet is deformed while the laminated substrate is in close contact with the elastic sheet. The laminated substrate is brought into close contact with a temperature-controlled mold to soften the resin substrate.
System and method for continuous fabrication of graded structured units using additive manufacturing
A system and method of continuous fabrication of multi-material graded structures using additive manufacturing is disclosed. Using multi-material feedstocks and optimized processing parameters, the gradient on composition and structure are controlled to achieve smooth transition from one functional component to another functional component. A multi-material graded structure is produced as the feedstocks are transported from the feedstock reservoir system comprised of many different materials. Interface transition from one functional layer to the next is gradient, controlled by feedstock mixture ratios based on the flow rate control for the feedstock system. Composition includes chemical composition, physical composition, and porosity. Continuous automatic additive manufacturing method makes the fabrication more efficient and avoids joining problems. This method finds application in fabrication of a fuel cell, battery, reformer and other chemical reaction and process units, including structures made of multiple units, such as stacks, that incorporate multiple functional components.
Imprint method, imprint apparatus, and article manufacturing method
An imprint method of molding an imprint material on a shot region of a substrate using a mold, includes aligning the shot region and the mold in a state where the imprint material and a pattern region of the mold are in contact with each other; and curing the imprint material by irradiating the imprint material with curing light after the aligning. The aligning is controlled so as to include an overlap period during which a period during which deformation light used to deform the shot region is applied to the substrate through the imprint material and a period during which polymerization light used to increase a viscosity of the imprint material is applied to the imprint material overlap each other. The polymerization light to be applied to the imprint material is controlled in accordance with the deformation light to be applied to the imprint material during the overlap period.
Assembly and method for sealing a bundle of wires
A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
Graphite materials and devices with surface micro-texturing
Flexible graphite and other graphite materials with surface micro-texturing, and methods and apparatuses for micro-texturing the surface of flexible graphite and other graphite materials are provided. Micro-texturing can be used to modify wettability and/or adhesion characteristics of a flexible graphite surface. Micro-textured flexible graphite materials can be advantageously used in applications where the material is in contact with liquid water or other liquids.
Manufacturing method of mounting structure, and sheet therefor
A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.
Composite structure and housing for electronic device
A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.