B29L31/34

Loudspeaker membrane with spray-coated elastomer layer

A membrane for an electro-acoustic transducer comprised of at least one elastomer layer made using spray coating of a liquid elastomer solution is provided. The at least one layer of elastomer is made by spraying a liquid elastomer solution, which may comprise a silicone, onto a mold having the desired membrane geometry, allowing the solution to cure and remove the membrane from the mold. The mold can be configured to hold other components of an electro-acoustic transducer that will be attached to the membrane after the curing step.

Device and method for separating wires and sealing a conduit

An insert device for sealing a conduit, wherein at least one component of the insert device is configured to separate and position at least one wire in the conduit in order to create a space or inner volume for a sealant to be introduced thereinto. The insert device can have a nozzle configured to allow precise injection of the sealant into the inner volume. The insert device can be operated for quick and reliably repeatable sealing of conduits.

Thermoplastic resin sheet having hairlike bodies and molded product thereof
12036715 · 2024-07-16 · ·

A resin sheet having hairlike bodies arranged regularly on at least one surface of an underlayer can be manufactured by forming the bodies by: melt extruding, from a die with an extrusion molding method, a thermoplastic resin having, on a log-log graph having elongational viscosity ?(t) (unit: Pa.Math.S) as measured at a strain rate of 0.5 (unit: S?1) and at a temperature at which elongation is possible as the vertical axis and elongation time t (unit: S) as the horizontal axis, a region in which the slope (log ?/log t) in the interval 0.1<t<1.0 is no greater than 0.5 and by the temperature range wherein the adhesive force in probe tack measurement is 0.05-0.25 N/mm2 at least partially overlapping with the temperature at which elongation is possible; and casting using a transfer roll on which a relief process has been performed and a touch roll.

3D-printed, PCB composite structures, and formation methods

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

Welding process for sealing a battery module

The present disclosure relates to a battery module that includes a housing having a first protruding shelf along a first perimeter of the housing, a second protruding shelf along a second perimeter of the housing, where the first and second protruding shelves each include an absorptive material configured to absorb a first laser emission. The battery module also includes an electronics compartment cover configured to be coupled to the housing via a first laser weld, and a cell receptacle region cover configured to be coupled to the housing via a second laser weld. The electronics compartment cover has a first transparent material configured to transmit the first laser emission toward the first protruding shelf and the cell receptacle region cover has a second transparent material configured to transmit the first laser emission or a second laser emission toward the second protruding shelf.

Illumination display panel and method of manufacturing the same

An illumination display panel that forms part of a housing and has a display portion for illuminated display comprises a resin panel having a first molded portion made of an opaque resin at a portion excluding the display portion, and a second molded portion disposed on the back surface side of the first molded portion and made of a light-transmitting resin having a protrusion where the first molded portion is not present. The protrusion is fitted to the first molded portion. A light source mounting substrate is disposed on the back surface side of the resin panel. At least a light source of the light source mounting substrate is sealed by the second molded portion. An integrally molded product of the light source mounting substrate and the second molded portion is filled and solidified at a low pressure while compressing a cavity of a molding mold.

Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly

Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Display device and display device manufacturing method
12059849 · 2024-08-13 · ·

A display device includes a display panel including a main display surface and a first sub-display surface that protrudes from one side of the main display surface, an adhesive layer disposed below the display panel, and a thermoforming film disposed below the adhesive layer, and the first sub-display surface may include a first top surface and a first side surface that defines a predetermined angle with the first top surface.

Method for producing a multilayer body and a multilayer body

A method for producing a multilayer body and a multilayer body, wherein the method includes: providing a single-layered or multi-layered substrate with a first surface and a second surface, providing one or more sensor films which each have at least one sensor area and have a first surface and a second surface facing away from the first surface, applying the one or more sensor films to the second surface of the substrate such that the first surface of the respective sensor film rests on the second surface of the substrate at least in areas, thermoforming a series of layers comprising the substrate and the one or more sensor films applied to the second surface of the substrate such that, during the thermoforming, on the first surface of the substrate a surface relief is formed which is determined by the shaping, of one or more of the one or more sensor films.

Ultrasonic weld interconnection coaxial connector and interconnection with coaxial cable

A coaxial connector for interconnection with a coaxial cable with a solid outer conductor by ultrasonic welding is provided with a monolithic connector body with a bore. An annular flare seat is angled radially outward from the bore toward a connector end of the connector, the annular flare seat open to the connector end of the connector. An inner conductor cap is provided for interconnection with an inner conductor of the coaxial cable by ultrasonic welding. The ultrasonic welding of each of the inner and outer conductor interconnections may be performed via inner conductor and outer conductor sonotrodes which are coaxial with one another, without requiring the cable and or connector to be removed from their fixture.