A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness R.sub.a in a range from 0.1 m to 10 m, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 m to 100 m, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.

In accordance with one or more embodiments, a method includes injection molding of a dielectric material in a pre-distorted antenna mold; and curing the dielectric material. The pre-distorted dielectric mold has a shape that compensates for shape distortion of the dielectric material during the curing.

The present invention provides an imprint apparatus that performs a process of forming an imprint material on a substrate using a mold, with respect to each of a plurality of shot regions on the substrate, the apparatus comprising: a detector configured to detect positions of marks provided in the substrate; and a controller configured to control, in the process, alignment between the substrate and the mold based on a detection result by the detector, wherein each of the plurality of shot regions includes two or more transfer regions where a pattern of an original has been individually transferred in a pre-process, and in the process on a specific shot region, the controller controls the alignment based on the detection result of the marks provided in the transfer region other than the smallest transfer region among the two or more transfer regions.

A chuck assembly for holding a plate comprises a member configured to hold the plate, the member including a flexible portion configured to have a central opening, and a first cavity formed by the flexible portion, wherein the plate is held by the flexible portion by reducing pressure in the first cavity, a light-transmitting member covering the central opening of the member, and a fluid path in communication with a second cavity defined by the member, the plate held by the member and the light-transmitting member for pressurizing the second cavity.

According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.

A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.

A substrate processing apparatus that can radiate light on a composition in an optimum radiation amount based on acquired spectral sensitivity characteristics can be provided. A substrate processing apparatus configured to perform pattern formation processing on a composition on a substrate includes a first radiation unit configured to radiate first light onto the substrate, a dispenser configured to apply the composition to a first position inside the substrate processing apparatus, a template holding unit configured to hold a template to be brought in contact with the composition on the substrate, and a controller configured to control a radiation amount of the first light to be radiated by the first radiation unit based on spectral sensitivity characteristics of the composition that are measured in advance.

Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

The invention relates to a method for manufacturing a coated plastic part (1) intended to be integrated into a passenger compartment of a motor vehicle, the coated plastic part including a base part comprising a raised section (6), and a sheet (3) comprising a useful surface (11), the method comprising a step of creating (102, 201) at least one flap (12) in the useful surface, a positioning step (103, 202) in which the sheet is positioned opposite a shaping tool (15) comprising a raised area (14) of a complementary shape to the raised section (6), a shaping step (104, 203), in which the sheet is pressed against the shaping tool (15), and a joining step (105, 204) in which the sheet and the base part are held against each other so as to facilitate the rigid connection of the sheet and the base part.