Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.

A manufacturing process, and related products, for fabricating translucent articles in the form of tiles is disclosed. The manufacturing process includes holding together a stack of corrugated cardboard pieces and saturating the cardboard pieces with an impregnating agent. Additional steps may include machining the cardboard pieces to define a block of a desired shape, slicing the block into tile components, and/or coating one or more tile components with a coating material to produce the article. Articles include translucent tiles made of corrugated cardboard pieces saturated with an impregnating agent. The tiles may be arranged to define a surface, such as a floor, a wall, a roof, a lighting installation, an architectural construction element, an architectural aesthetic element, or a solar panel.

A solar battery module and manufacturing method for a solar battery module having improved output are provided. The solar battery module 1 is a transparent substrate 10, transparent resin layer 13b, solar battery cell 12, colored resin layer 13a and back sheet 11 laminated in this order. The light-receiving surface 12a of the solar battery cell 12 faces the transparent resin layer 13b side. The backside 12b of the solar battery cell faces the colored resin layer 13a. The MFR [melt flow rate] of the transparent resin layer 13b is lower than the MFR of the colored resin layer 13a.

A microchip structure and a method for manufacturing thereof are provided. The microchip structure comprises a target integrated circuit (TIC) comprising a first surface and a first power contact at a first location on the first surface of the TIC, the TIC further comprising a second power contact at a second location on the first surface of the TIC; a plurality of photovoltaic (PV) diodes deposited on a first surface of a transparent substrate, each of the PV diodes having an anode coupled to an anode contact and a cathode coupled to a cathode contact, the transparent substrate is transparent to an electromagnetic frequency to which the PV diodes are sensitive; the cathode contact of a first PV diode of the PV diodes is bonded to the first power contact and the anode contact of a second PV diode of the PV diodes is bonded to the second power contact.

A wearable power management system includes: a bottom coating layer; a bottom center layer disposed above the bottom coating layer; a circuit layer disposed above the bottom center layer; a top center layer disposed above the circuit layer, and a top coating layer disposed above the top center layer. The bottom center layer and the top center layer are made of an ultra-low Young's modulus material. The Young's modulus of the bottom coating layer and the top coating layer is greater than the Young's modulus of the bottom center layer and the top center layer. The circuit layer includes a device layer and a connection layer disposed above the device layer.

The present invention relates generally to the photovoltaic generation of electrical energy. The present invention relates more particularly to photovoltaic arrays for use in photovoltaically generating electrical energy. Aspects of the present invention provide a variety of photovoltaic roofing elements and systems that include, for example, interlocking geometries to provide for water handling and integration with conventional roofing materials; and wire management features that can protect wiring and associated electrical components from physical and/or environmental damage.

Provided is a polyvinyl acetal film which, when used as an intermediate film for a laminated glass, can provide a laminated glass that exhibits a low degree of yellowness and excellent surface appearance, and which is thus useful as a sealing material or intermediate film that can prolong the life of a laminated glass provided with a solar cell or a functional unit. Further, the content of corrosion-causing substance in the polyvinyl acetal film is low, so that the polyvinyl acetal film permits high-temperature lamination and thus ensures excellent productivity. Also provided are a solar cell module and a laminated glass prepared using the polyvinyl acetal film. A plasticized polyvinyl acetal film which comprises 15 to 60 parts by mass of a plasticizer having a total number of 28 or more of carbon atoms and oxygen atoms constituting a molecule based on 100 parts by mass of a polyvinyl acetal resin, and which has an acid value of 5.0 meq/kg or less.

An encapsulant film and an optoelectronic device are provided. The encapsulant film having improved thermal resistance, and excellent adhesion, especially, long-term adhesive properties, to a front substrate and a back sheet can be provided. Also, the optoelectronic device capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated by the encapsulant film can be provided.

An electrical and/or electronic device including at least two electrical and/or electronic components, each including two opposite faces, at least one electrical contact element arranged against at least one of the two opposite faces of each of the at least two electrical and/or electronic components, and each of them is mechanically protected by a mechanical protection system including at least one protective element, superimposed on one or plural electrical and/or electronic components that it protects such that at least one of the two opposite faces of the electrical and/or electronic components is arranged facing the at least one protective element, and at least one deformation absorption element is arranged in at least one space formed between the at least one protective element and at least one electrical and/or electronic component that it protects.

The present invention relates to fluorescent, benzotriazole-containing dye compounds, which possess a high workability, desirable optical properties, and a good light stability, while suppressing the formation of a precipitate. The invention further relates to a wavelength-converting encapsulant layer, which is formed using the wavelength-converting encapsulant composition comprising said fluorescent, benzotriazole dye compounds. The fluorescent, benzotriazole-containing dye compounds are represented by general formula (I).

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wherein the variables are defined in the specification.