Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the substrate, and a first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and is spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and is spaced apart from the first and second conductive pads. A fourth conductive pad is disposed over the interconnect structure and is spaced apart from the first, second, and third conductive pads. A first ESD protection element is electrically coupled between the first and second pads; and a second ESD protection element is electrically coupled between the third and fourth pads. A first device under test is electrically coupled between the first and third conductive pads; and a second device under test is electrically coupled between the second and fourth pads.

A display device comprising a display panel that includes an active area, the active area including a data line positioned on a substrate in a first direction and transferring a data signal, a gate line positioned on the substrate in a second direction and transferring a gate signal, a thin film transistor connected to the gate line and the data line, and a plurality of pixels driven by the thin film transistor, a first pad coupled to a first signal line disposed in a data signal area wherein the first signal line is connected to the data line, and a first non-signal line disposed in a first non-signal area wherein the first non-signal line is disconnected from the data line, the first non-signal area being disposed outside the data signal area, a second pad coupled to a second signal line disposed in a gate signal area wherein the second signal line is connected to the gate line, and a second non-signal line disposed in a second non-signal area wherein the second non-signal line is disconnected from the gate line, the second non-signal area being disposed outside the gate signal area; and a dummy pattern disposed between the data signal area and the first non-signal area, or disposed between the gate signal area and the second non-signal area.

Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.

An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.

A semiconductor device includes a first circuit 1 and a second circuit 2 that are connected in series, a first terminal T1 that applies a first potential to a first power supply line DL1 of the first circuit 1, a second terminal T2 that applies a second potential to a second power supply line DL2 of the second circuit 2, a third terminal T3 that is connected to a signal transfer line of the first circuit 1, and a protection circuit that is connected to the third terminal T3, and discharges a current from the third terminal T3 to a fourth terminal T4 when a potential of the third terminal T3 becomes higher than a first threshold value. The first power supply line DL1 and the second power supply line DL2 are separated, and the fourth terminal T4 is not directly connected to the first power supply line DL1 and is electrically connected to a lead.

An electro-static discharge (ESD) protection unit, an array substrate, a liquid crystal display panel and a display device. The ESD protection unit includes: a thin-film transistor (TFT); a first trace; and a second trace. A gate electrode of the TFT is exposed in a region that is formed by the first trace and the second trace and corresponds to a pixel unit, and the gate electrode of the TFT is configured to collect electric charges generated between the first trace and the second trace. A source electrode of the TFT is connected to the first trace and a drain electrode of the TFT is connected to the second trace.

A robust electrostatic (ESD) protection device is provided. In one example, the ESD protection device is configured to accommodate three nodes. When used with a differential signal device, the first and second nodes may be coupled with the differential signal device's BP and BM signal lines, respectively, and the third node may be coupled to a voltage source. This allows for a single ESD protection device to be used to protect the signal lines of the differential signal device, thus providing significant substrate area savings as compared to the conventional means of using three dual-node ESD protection devices to accomplish substantially the same protection mechanism. Moreover, the ESD protection device may be structurally designed to handle high voltage ESD events, as required by the FlexRay standard.

In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.

A touch device including an array substrate, at least one gate driving circuit, an opposite substrate and a shielding pattern is provided. The array substrate has a display region and a peripheral region connecting to the display region. The gate driving circuit is disposed on the array substrate and located in the peripheral region. The opposite substrate is disposed opposite to the array substrate. The shielding pattern is disposed between the array substrate and the opposite substrate. The shielding pattern projected on the array substrate is formed a first projection, the gate driving circuit projected on the array substrate is formed a second projection, the first projection at least partially overlaps with the second projection.

An integrated circuit includes a data processing circuit, an electrostatic discharge (ESD) protection circuit which is connected between a voltage rail and a ground rail and protects the data processing circuit from an ESD event on the voltage rail, and a switch circuit for controlling a connection between the voltage rail and the data processing circuit in response to a control signal.