An array substrate, an electro-static discharge method thereof and a display device are disclosed. The array substrate includes: a plurality of data lines, a plurality of gate lines, a power signal line, a charge release signal line, a plurality of electro-static discharge units and at least one short circuit ring unit. The charge release signal line and the power signal line are disposed in parallel, two electro-static discharge units are disposed between them to form an electro-static discharge circuit, each gate line and/or each data line is connected with the charge release signal line by one electro-static discharge unit; the short circuit ring unit is connected between the charge release signal line and the power signal line.

An ESD monitor device may take the form of an integrated circuit with a plurality of monitor components available at each I/O site of the ESD monitor device. Each monitor component has a physical structure which provides scalable ESD robustness. The monitor components are connected in parallel to an ESD bus. An integrated circuit may be formed by processing an ESD monitor device through one or more process steps of an integrated circuit manufacturing line, and subsequently measuring the ESD monitor device. Parameters of a process step of the manufacturing line may be adjusted to reduce ESD events at the process step, based on measurement results from the ESD monitor device. The integrated circuit may subsequently be processed through the adjusted process step.

Antenna switching circuitry comprises a plurality of communication ports, an antenna port, a plurality of switches, and an ESD protection device. The plurality of switches are adapted to selectively couple one or more of the communication ports to the antenna port in order to transmit or receive a signal. The ESD protection device is coupled between one of the plurality of communication ports and ground, and is adapted to form a substantially low impedance path to ground during an ESD event. Upon the occurrence of an ESD event, a received electrostatic charge passes through one or more of the plurality of switches to the ESD protection device, where it is safely diverted to ground. By using only one ESD protection device, desensitization of the antenna switching circuitry due to the parasitic loading of the ESD protection device is avoided. Further, the area of the antenna switching circuitry is minimized.

An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.

An ESD protection device for shunting an electrostatic discharge current from a first node to a second node, and an integrated circuit including the same. The device includes a first bipolar transistor having a collector and an emitter located in a first n-type region. The emitter of the first transistor is connected to the first node. The device also includes a second bipolar transistor having a collector and an emitter located in a second n-type region. The emitter of the second transistor is connected to the collector of the first bipolar transistor. The device further includes a pn junction diode including a p-type region located in a third n-type region. The p-type region of the diode is connected to the collector of the second bipolar transistor and the third n-type region is connected to the second node.

The present disclosure provides a method for fabricating an array substrate. The method includes providing a substrate; forming a first pattern on the substrate including a plurality of signal lines and a plurality of electrostatic discharge (ESD) lines, wherein an ESD line is configured to connect two signal lines; and removing a portion of each ESD line during a process for forming a second pattern over the first pattern to disconnect the two signal lines.

A display panel is provided. The display panel has an active area and a border area out of the active area. The display panel includes a plurality of pixels, a first gate driver portion, a plurality of scan lines and a multiplexer portion. The pixels are located in the active area. The first gate driver portion is located in the border area. The scan lines are located in the active area, and connected to the first gate driver portion. The multiplexer portion is located in the border area. The multiplexer portion and the first gate driver portion at least partially overlap along a direction parallel to one of the plurality of scan lines.

The present disclosure provides an organic light-emitting diode (OLED) array substrate. The OLED array substrate includes a display area with OLEDs arranged in arrays, electrostatic discharge lines, and peripheral electrostatic discharge areas with conductive areas electrically connected to a cathode of the OLEDs and electrically connected to the electrostatic discharge lines through switch modules.

A display panel structure includes a substrate, plural gate lines and data lines arranged on the substrate, plural pixel units, and plural dummy pixel units. The substrate has a display region and a peripheral region surrounding the display region. The gate lines and data lines are extended from the display region to the peripheral region. The pixel units are disposed at the display region. The dummy pixel units are disposed at the peripheral region, and include a first region, a second region, and a third region. The dummy pixel units of the first region and the second region are arranged along a first direction and a second direction, respectively. The dummy pixel units of the third region are arranged between the first and second regions. The dummy pixel units of the third region include one of the gate lines and one of the data lines.

A device having an electrostatic discharge structure includes a bulk substrate having a first dopant conductivity, first wells formed adjacent to a surface of the bulk substrate, including a second dopant conductivity, and second wells formed adjacent to the surface of the bulk substrate within the first wells, including the first dopant conductivity. A supply bus is formed in one of the first wells outside the second well. A ground bus has a first portion formed in another first well outside the second well, and a second portion is formed inside the second well such that a charge input to the second wells is dissipated without accumulating in the bulk substrate.