An integrated circuit (IC) chip for providing a safety-critical value includes first and second processing paths. The first processing path includes a first processing element and is coupled to receive a first input signal on a first input pin and to provide a first output signal that provides the safety-critical value on an output pin. The second processing path includes a second processing element and is coupled to receive a second input signal and to provide a second output signal. The first processing path and the second processing path are independent of each other. A smart comparator on the IC chip receives the first output signal and the second output signal and initiates a remedial action responsive to a difference between the first output signal and the second output signal reaching a configurable threshold.

Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.