A semiconductor device includes a chip having a principal surface, a trench insulating structure formed in the principal surface of the chip, a first conductivity type body region formed in a surface layer portion of the principal surface such that the body region is in contact with the trench insulating structure, a second conductivity type source region formed in a surface layer portion of the body region while being separated from the trench insulating structure, a first conductivity type butting region formed in a region between the trench insulating structure and the source region in the surface layer portion of the body region, and a planar gate structure that passes through a side of the butting region, covers the body region and the trench insulating structure, and is capable of controlling reversal and non-reversal of a channel in the body region.

High voltage three-dimensional devices having dielectric liners and methods of forming high voltage three-dimensional devices having dielectric liners are described. For example, a semiconductor structure includes a first fin active region and a second fin active region disposed above a substrate. A first gate structure is disposed above a top surface of, and along sidewalls of, the first fin active region. The first gate structure includes a first gate dielectric, a first gate electrode, and first spacers. The first gate dielectric is composed of a first dielectric layer disposed on the first fin active region and along sidewalls of the first spacers, and a second, different, dielectric layer disposed on the first dielectric layer and along sidewalls of the first spacers. The semiconductor structure also includes a second gate structure disposed above a top surface of, and along sidewalls of, the second fin active region. The second gate structure includes a second gate dielectric, a second gate electrode, and second spacers. The second gate dielectric is composed of the second dielectric layer disposed on the second fin active region and along sidewalls of the second spacers.

Novel semiconductors and fabrication techniques are provided. In various embodiments, a semiconductor includes a source, a drain, a first gate, a second gate, and a channel. The second gate is electrically coupled to the first gate. The first gate and the second gate are configured to control current between the source and the drain. The channel is in contact with the first gate and the second gate. The channel is configured such that the current flows through the channel. Other aspects, embodiments, and features are also claimed and described.

A semiconductor device includes a first buried gate configured to extend in a first direction, a bit-line contact disposed on one side of the first buried gate while being located outside the first buried gate, a storage node contact disposed on the other side of the first buried gate in a diagonal direction of the bit-line contact while being located outside the first buried gate, and active regions arranged spaced apart from each other in the first direction while overlapping with the first buried gate. Each active region includes a first extension region configured to extend in a second direction perpendicular to the first direction while overlapping with the bit-line contact, a second extension region configured to extend in the second direction while overlapping with the storage node contact, and a third extension region configured to extend in a diagonal direction while overlapping with the first buried gate.

A standard cell includes: a gate interconnect; a dummy gate interconnect formed to be adjacent to the gate interconnect on the right side of the gate interconnect in the figure in the X direction; a pad provided between the gate interconnect and the dummy gate interconnect; a nanosheet formed to overlap the gate interconnect as viewed in plan and connected with the pad; and a dummy nanosheet formed to overlap the dummy gate interconnect as viewed in plan and connected with the pad.

It is an object to provide a liquid crystal display device which has excellent viewing angle characteristics and higher quality. The present invention has a pixel including a first switch, a second switch, a third switch, a first resistor, a second resistor, a first liquid crystal element, and a second liquid crystal element. A pixel electrode of the first liquid crystal element is electrically connected to a signal line through the first switch. The pixel electrode of the first liquid crystal element is electrically connected to a pixel electrode of the second liquid crystal element through the second switch and the first resistor. The pixel electrode of the second liquid crystal element is electrically connected to a Cs line through the third switch and the second resistor. A common electrode of the first liquid crystal element is electrically connected to a common electrode of the second liquid crystal element.

A nitride semiconductor device including a substrate, a channel layer, a carbon-poor barrier layer having a recess, a carbon-rich barrier layer disposed over the recess and the carbon-poor barrier layer, and a gate electrode above the recess, wherein the carbon-poor and carbon-rich barrier layers have bandgaps larger than that of the channel layer, the upper surface of the carbon-rich barrier layer includes a first main surface including a source electrode and a drain electrode, and a bottom surface of a depression disposed along the recess, and side surfaces of the depression connecting the first main surface to the bottom surface of the depression, and among edges of the depression of the carbon-rich barrier layer which are boundaries between the first main surface and the side surfaces of the depression, the edge of the depression of the carbon-rich barrier layer closest to the drain electrode is covered with the gate electrode.

A method of making a field-effect transistor device includes providing a substrate with a fin stack having: a first sacrificial material layer on the substrate, a first semiconductive material layer on the first sacrificial material layer, and a second sacrificial material layer on the first semiconductive material layer. The method includes inserting a dummy gate having a second thickness, a dummy void, and an outer end that is coplanar to the second face. The method includes inserting a first spacer having a first thickness and a first void, and having an outer end that is coplanar to the first face. The method includes etching the first sacrificial material layer in the second plane and the second sacrificial material layer in the fourth plane. The method includes removing, at least partially, the first spacer. The method also includes inserting a second spacer having the first thickness.

An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes performing an implant process on a high-k dielectric sidewall of a gate structure. The method further includes performing an oxygen annealing process to grow an oxide region on a drain side of the gate structure, while inhibiting oxide growth on a source side of the gate structure adjacent to a source region.

The present invention relates to atomically-thin channel materials with crystallographically uniform interfaces to atomically-thin commensurate graphene electrodes and/or nanoribbons separated by nanogaps that allow for nanoelectronics based on quantum transport effects and having significantly improved contact resistances.