The instant disclosure relates to contact grids for use in photovoltaic cells, wherein a cross-section of the contact grid fingers is shaped as a trapezoid, as well as a method of making photovoltaic cells comprising these contact grids. The contact grids of the instant disclosure are cost effective and, due to their thick metal grids, exhibit minimum resistance. Despite having thick metal grids, the unique shape of the contact grid fingers of the instant disclosure allow the photovoltaic cells in which they are employed to retain more solar energy than traditional solar cells by reflecting incoming solar energy back onto the surface of the solar cell instead of reflecting this energy away from the cell.

A solar cell using a printed circuit board (PCB) includes a substrate that is formed of an insulating material and in and through which a plurality of fixing holes and communication holes are alternately formed; a plurality of photoelectric effect generators that have ball or polyhedral shapes fixed to the substrate to be disposed over the plurality of fixing holes, and generate photoelectric effects by receiving light through light-receiving portions that are exposed to an upper portion of the substrate; a plurality of upper electrodes that are formed on a top surface of the substrate, and are connected to the respective light-receiving portions of the photoelectric effect generators; and a plurality of lower electrodes that are formed on a bottom surface of the substrate to be connected to respective non-light-receiving portions of the photoelectric effect generators, and communicate with the plurality of upper electrodes through the plurality of communication holes.

An organic light emitting diode device can be formed by imprinting a material layer to form an array of non-planar features selected from protrusions and via cavities. The array of non-planar features can be imprinted by moving the material layer under a rolling press or under a rolling die that transfers a pattern thereupon. A layer stack including a transparent electrode layer, an organic light emitting material layer, and a backside electrode layer is formed over the array of non-planar features such that convex sidewalls of the organic light emitting material layer contact concave sidewalls of the backside electrode layer. The layer stack can be encapsulated with a passivation substrate. Additionally or alternatively, an array of convex lenses can be imprinted on a transparent material layer to decrease total internal reflection of an organic light emitting diode device.

A method for manufacturing a passivation stack on a crystalline silicon solar cell device. The method includes providing a substrate comprising a crystalline silicone layer such as a crystalline silicon wafer or chip, cleaning a surface of the crystalline silicon layer by removing an oxide layer at least from a portion of one side of the crystalline silicon layer, depositing, on at least a part of the cleaned surface, a layer of silicon oxynitride, and depositing a capping layer comprising a hydrogenated dielectric material on top of the layer of silicon oxynitride, wherein the layer of silicon oxynitride is deposited at a temperature from 100 C. to 200 C., and the step of depositing the layer of silicon oxynitride includes using N.sub.2O and SiH.sub.4 as precursor gasses in an N.sub.2 ambient atmosphere and depositing silicon oxynitride with a gas flow ratio of N.sub.2O to SiH.sub.4 below 2.

Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.

A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.

What is proposed is a method of producing at least two differently heavily doped subzones (3, 5) predominantly doped with a first dopant type in a silicon substrate (1), in particular for a solar cell. The method comprises: covering at least a first subzone (3) of the silicon substrate (1) in which a heavier doping with the first dopant type is to be produced with a doping layer (7) of borosilicate glass, wherein at least a second subzone (5) of the silicon substrate (1) in which a lighter doping with the first dopant type is to be produced is not covered with the doping layer (7), and wherein boron as a dopant of a second dopant type differing from the first dopant type and oppositely polarized with respect to the same is included in the layer (7), and; heating the such prepared silicon substrate (1) to temperatures above 300 C., preferably above 900 C., in a furnace in an atmosphere containing significant quantities of the first dopant type. Additionally, at least a third doped subzone (15) doped with the second dopant type may be produced by the method additionally comprising, prior to the heating, a covering of the doping layer (7), above the third doped subzone (15) to be produced, with a further layer (17) acting as a diffusion barrier for the first dopant type.

The method uses the observation that a borosilicate glass layer seems to promote an in-diffusion of phosphorus from a gas atmosphere and may substantially facilitate a manufacturing for example of solar cells, in particular back contact solar cells.

A method of fabricating a passivated contact for a photovoltaic cell includes depositing a tunneling oxide layer on a first face of a substrate. An amorphous silicon layer is then deposited on top of the tunneling oxide layer. An aluminum layer is screen printed on top of the amorphous silicon layer. The aluminum layer is configured to serve as a crystallization catalyst for the amorphous silicon layer. The amorphous silicon layer and the aluminum layer are then heated to a crystallization temperature that is configured to cause the amorphous silicon to crystallize and to sinter the aluminum layer.

After forming an absorber layer containing cracks over a back contact layer, a passivation layer is formed over a top surface of the absorber layer and interior surfaces of the cracks. The passivation layer is deposited in a manner such that that the cracks in the absorber layer are fully passivated by the passivation layer. An emitter layer is then formed over the passivation layer to pinch off upper portions of the cracks, leaving voids in lower portions of the cracks.

A method for assembling a rapid elevation floor system in a pool, the method comprising the stages of: assembling a raisable floor inside said pool and adding sensors to said raisable floor, and connecting said raisable floor platform to auxiliary units. The method further comprises laying flooring tiles on said raisable floor and sinking said raisable floor to a bottom of said pool.