Light-sensor array systems for capturing multiple-color images and light-fields using array of wavelength-selective optoelectronic elements (rather than wider-range photosensors prefaced with visible-band wavelength-selective optical elements such as color selective filters) as light-field or image sensors are presented. The light-sensor array can be one or more of transparent, bendable, and implemented on a curved surface. In some embodiments, the wavelength-selective light-sensing opto-electronic elements are arranged in a stacked array. In some embodiments, more than three wavelength-selective ranges can be employed in each light-sensing pixel. The invention can be used to implement one or more of a lensless imaging light-field camera, tactile gesture user interface, and/or proximate gesture user interface. In some embodiments, the light-sensor array system can be configured to emit light of one or more colors, and thus can additionally serve as an image display. In some embodiments, the wavelength-selective light-sensing opto-electronic elements are co-optimized for light sensing and emission.

Systems for reducing dark current in a photodiode include a heater configured to heat a photodiode above room temperature. A reverse bias voltage source is configured to apply a reverse bias voltage to the heated photodiode to reduce a dark current generated by the photodiode.

Methods and systems for reducing dark current in a photodiode include heating a photodiode above room temperature. A reverse bias voltage is applied to the heated photodiode to reduce a dark current generated by the photodiode.

Provided herein is a digital x-ray detector and a method for repairing a bad pixel thereof, the detector including a substrate; a gate line and a data line formed on the substrate such that the gate line and the data line intersect each other to form a pixel domain; a thin film transistor formed within the pixel domain such that the thin film transistor is adjacent to a portion where the gate line and the data line intersect each other, the thin film transistor including a gate electrode, an active layer, a source electrode and a drain electrode; a PIN diode which is formed within the pixel domain and which includes a lower electrode connected to the source electrode of the thin film transistor, a PIN layer formed on the lower electrode, and an upper electrode formed on the PIN layer; a bias line connected to the upper electrode of the PIN diode; and a scintillator arranged above the PIN diode, wherein on at least one of a surface of the drain electrode which faces the PIN diode and a surface of the PIN diode which faces the drain electrode, a groove is formed such that it expands a distance between the drain electrode and the PIN diode.

According to one embodiment, a semiconductor photo-receiving device includes a substrate, a light propagation layer and a semiconductor layer including a lowest layer and upper layers. The upper layers include an optical absorption layer. The light propagation layer includes a first light input layer, a first annular layer at a desired distance from the first light input layer, and a first optical waveguide connecting the first light input layer and annular layer. The lowest layer of the semiconductor layer includes a second light input layer, a second annular layer at a desired distance from the second light input layer, and a second optical waveguide connecting the second light input layer and annular layer.

A photodetector includes an insulating layer on a substrate, a first graphene layer on the insulating layer, a 2-dimensional (2D) material layer on the first graphene layer, a second graphene layer on the 2D material layer, a first electrode on the first graphene layer, and a second electrode on the second graphene layer. The 2D material layer includes a barrier layer and a light absorption layer. The barrier layer has a larger bandgap than the light absorption layer.

Techniques are disclosed for providing the weapon-mounted optical scope that provides for wind sensing and the display a ballistic solution without the need for a separate device. Embodiments may include various additional sensors housed within the weapon-mounted optical scope to provide data for the ballistic solution calculation. Embodiments may further include a display at the input aperture rather than internally at the first-focal-plane, enabling for simpler, more cost effective embodiments. Additionally or alternatively, embodiments may include a laser, separate from the wind sensing laser, to perform range-finding functions, and/or an enhanced-image assembly.

A light absorption apparatus includes a substrate, a light absorption layer above the substrate on a first selected area, a silicon layer above the light absorption layer, a spacer surrounding at least part of the sidewall of the light absorption layer, an isolation layer surrounding at least part of the spacer, wherein the light absorption apparatus can achieve high bandwidth and low dark current.

A Ge-on-Si photodetector constructed without doping or contacting Germanium by metal is described. Despite the simplified fabrication process, the device has responsivity of 1.24 A/W, corresponding to 99.2% quantum efficiency. Dark current is 40 nA at 4 V reverse bias. 3-dB bandwidth is 30 GHz.

In one example, a device includes a trench formed in a substrate. The trench includes a first end and a second end that are non-collinear. A first plurality of semiconductor pillars is positioned near the first end of the trench and includes integrated light sources. A second plurality of semiconductor pillars is positioned near the second end of the trench and includes integrated photodetectors.