According to some embodiments, a device is provided. The device comprises at least one semiconductor structure, comprising: a base portion and an elongated portion extending from the base portion, the elongated portion comprising a non-conducting material, and a plurality of P-type-N-type (P-N) junction branches positioned at different sections of the elongated portion. Each P-N junction branch comprises a photoactive diode having a photoactive area, and a conductor. Each P-N junction branch has a width, where the widths of the plurality of P-N junction branches decrease with increasing distance from the base portion, and where the semiconductor structure is configured to absorb photons over a range of wavelengths to which each P-N junction branch is photoactive.

According to some embodiments, a device is provided. The device comprises at least one semiconductor structure, comprising: a base portion and an elongated portion extending from the base portion, the elongated portion comprising a non-conducting material, and a plurality of P-type-N-type (P-N) junction branches positioned at different sections of the elongated portion. Each P-N junction branch comprises a photoactive diode having a photoactive area, and a conductor. Each P-N junction branch has a width, where the widths of the plurality of P-N junction branches decrease with increasing distance from the base portion, and where the semiconductor structure is configured to absorb photons over a range of wavelengths to which each P-N junction branch is photoactive.

A device is provided. The device includes mechanically stacked layers. The mechanically stacked layers include a bottom layer and upper layers. Each upper layer includes a transmissive solar cell that converts light energy into electricity. Each upper layer transmits unconverted portions of the light energy towards the bottom layer. The bottom layer includes a solar cell that converts the unconverted portions of the light energy into electricity.

A device is provided. The device includes mechanically stacked layers. The mechanically stacked layers include a bottom layer and upper layers. Each upper layer includes a transmissive solar cell that converts light energy into electricity. Each upper layer transmits unconverted portions of the light energy towards the bottom layer. The bottom layer includes a solar cell that converts the unconverted portions of the light energy into electricity.

A semiconductor device includes a base, a semiconductor stack, a bonding structure, a contact structure, a conductive structure and a first through hole. The semiconductor stack includes a first semiconductor structure and a second semiconductor structure, and the first semiconductor structure locates between the second semiconductor structure and the base. The bonding structure is disposed between the base and the first semiconductor structure. The contact structure is disposed between the bonding structure and the first semiconductor structure, and is covered the contact structure. The first through hole penetrates the semiconductor stack and the contact structure to contact the conductive structure.

A semiconductor device includes a base, a semiconductor stack, a bonding structure, a contact structure, a conductive structure and a first through hole. The semiconductor stack includes a first semiconductor structure and a second semiconductor structure, and the first semiconductor structure locates between the second semiconductor structure and the base. The bonding structure is disposed between the base and the first semiconductor structure. The contact structure is disposed between the bonding structure and the first semiconductor structure, and is covered the contact structure. The first through hole penetrates the semiconductor stack and the contact structure to contact the conductive structure.

In accordance with one or more embodiments herein, a method of manufacturing a photovoltaic (PV) top module, to be used together with a PV bottom module, e.g an SI-based PV bottom module, is provided. The method may include monolithically interconnecting a plurality of thin film based PV sub-cells, manufactured using a perovskite material and/or a CIGS material as solar absorbing material, in series on a substrate in order to create a PV top module including at least one first PV top sub-module, and arranging metal grid lines on top and bottom contact layers of the PV top module. The metal grid lines may be arranged either above or below the top and bottom contact layers of the PV top module.

In accordance with one or more embodiments herein, a method of manufacturing a photovoltaic (PV) top module, to be used together with a PV bottom module, e.g an SI-based PV bottom module, is provided. The method may include monolithically interconnecting a plurality of thin film based PV sub-cells, manufactured using a perovskite material and/or a CIGS material as solar absorbing material, in series on a substrate in order to create a PV top module including at least one first PV top sub-module, and arranging metal grid lines on top and bottom contact layers of the PV top module. The metal grid lines may be arranged either above or below the top and bottom contact layers of the PV top module.

A tandem solar cell according to an embodiment includes a top cell string, a bottom cell string, a top cell module, a first string connection, a bottom cell module, and a second string connection. The top cell string is formed by electrically connecting a plurality of top cells. The bottom cell string is formed by electrically connecting a plurality of bottom cells. The bottom cell string is arranged so as to overlap the top cell string in a plan view in a thickness direction of the top cell. The first string connection includes a first extending portion extending to an outside of the top cell module in the plan view. A plurality of bottom cell strings are electrically connected to the bottom cell module. The first extending portion and the second extending portion are arranged apart from each other in the plan view.

A tandem solar cell according to an embodiment includes a top cell string, a bottom cell string, a top cell module, a first string connection, a bottom cell module, and a second string connection. The top cell string is formed by electrically connecting a plurality of top cells. The bottom cell string is formed by electrically connecting a plurality of bottom cells. The bottom cell string is arranged so as to overlap the top cell string in a plan view in a thickness direction of the top cell. The first string connection includes a first extending portion extending to an outside of the top cell module in the plan view. A plurality of bottom cell strings are electrically connected to the bottom cell module. The first extending portion and the second extending portion are arranged apart from each other in the plan view.