A solar cell can include a first plurality of metal contact fingers, and a second plurality of metal contact fingers interdigitated with the first plurality of metal contact fingers, wherein at least one of the first plurality of metal contact fingers comprises a wrap-around metal finger that passes between a first edge of the solar cell and at least one contact pads. A photovoltaic (PV) string including a solar cell with a wrap-around metal contact finger. A method of coupling an electrically conductive connector to a solar cell with a wrap-around metal contact finger.

Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.

Disclosed is a photovoltaic module (1,2) comprising several serially connected IBC solar cells (100,200,300), wherein each IBC solar cell (100,200,300) has an electrode structure (110,210,310) comprising both a P-type contact electrode structure including at least one P-busbar (112,114,212, 214,312,314) and an N-type electrode structure including at least one N-busbar (116,118,216,218,316,318), wherein at least two of the IBC solar cells (100,200,300) are arranged relative to each other in a partly overlapping manner so that a first region of a back side of a first IBC solar cell (100) is arranged on top of a first region of a front side of a second IBC solar cell (200) and thus creates an overlap region (10,20), wherein at least sections of both the at least one P-busbar (112,114,212,214,312,314) and the at least one N-busbar (116,118,216,218,316,318) of the electrode structure of said first IBC solar cell (100) are located outside of the overlap region (10,30).

The present disclosure relates to a solar cell, a preparation method thereof, and a photovoltaic module. The solar cell includes a semiconductor substrate, passivating contact structures, a dielectric layer, and first electrodes. The semiconductor substrate includes a first surface and a second surface opposite to each other. The semiconductor substrate includes passivation regions and passivated contact regions, which are alternately arranged along a first direction. The first direction is perpendicular to a thickness direction of the semiconductor substrate. The passivating contact structures are disposed on the second surface and correspondingly disposed on the passivated contact regions. Each passivating contact structure includes an electrically conductive passivation layer. The dielectric layer at least covers the second surface in the passivation regions. The first electrodes are disposed on the passivating contact structures at a side away from the semiconductor substrate. Each passivating contact structure is provided with at least one first electrode.

A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. A trench structure separates the P-type doped region from the N-type doped region. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. The trench structure may include a textured surface for increased solar radiation collection. Among other advantages, the resulting structure increases efficiency by providing isolation between adjacent P-type and N-type doped regions, thereby preventing recombination in a space charge region where the doped regions would have touched.

A solar cell using a printed circuit board (PCB) includes a substrate that is formed of an insulating material and in and through which a plurality of fixing holes and communication holes are alternately formed; a plurality of photoelectric effect generators that have ball or polyhedral shapes fixed to the substrate to be disposed over the plurality of fixing holes, and generate photoelectric effects by receiving light through light-receiving portions that are exposed to an upper portion of the substrate; a plurality of upper electrodes that are formed on a top surface of the substrate, and are connected to the respective light-receiving portions of the photoelectric effect generators; and a plurality of lower electrodes that are formed on a bottom surface of the substrate to be connected to respective non-light-receiving portions of the photoelectric effect generators, and communicate with the plurality of upper electrodes through the plurality of communication holes.

A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a paste, a first metal, and a first conductive portion that includes a conductive alloy formed from the first metal at an interface of the substrate and the semiconductor region.

In the solar cell module including a plurality of solar cells interconnected with wiring members, each of the solar cells includes a plurality of front-side finger electrodes that are disposed on a light-receiving surface of the solar cell and connected with tabs and a plurality of rear-side finger electrodes that are disposed on a rear surface of the solar cell and connected with tabs. Rear-side auxiliary electrode sections are arranged in regions, which is wider than the front-side finger electrodes, on the rear surface opposite to regions where the front-side finger electrodes are present.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

The invention discloses an all-aluminum back surface field aluminum paste for a crystalline silicon solar cell and a preparation method thereof. The all-aluminum back surface field paste mainly comprises 60-70% aluminum powder, 5-10% nanometer metal oily solution, 1-10% inorganic binder, 10-20% organic binder, 5-30% organic solvent and 1-5% accessory ingredient. According to the aluminum paste prepared by the present invention, the back surface preparing process of an all-aluminum back surface field can be implemented preferably; moreover, the paste has great adhesive force, is easy to be better adhered to silver paste printed afterwards; meanwhile, the paste can be in good contact with a silicon chip through the nanometer metal oily solution added into the paste, the aluminum back surface is prevented from falling off, and good ohm contact can be formed, so that the photoelectric conversion efficiency is increased, and the economic benefits of enterprises are increased.