A method of manufacturing a solar cell is discussed. The method includes forming a textured structure on a front surface of a silicon substrate; forming a front passivation layer on the front surface of the silicon substrate; forming an anti-reflection layer on the front passivation layer; forming a first layer having a dopant of a first conductive type on a first portion of a rear surface of the silicon substrate; forming a second layer having a dopant of a second conductive type on the first layer and a second portion of the rear surface of the silicon substrate; diffusing the dopant of the first layer and the dopant of the second layer into the silicon substrate to form a n-doped region and a p-doped region, respectively, wherein the n-doped region and the p-doped region are disposed at about a same depth from the rear surface of the silicon substrate.

Provided are a photoelectric conversion element capable of enhancing characteristics and reliability more than ever before and a method for manufacturing the photoelectric conversion element. The photoelectric conversion element includes a base including a semiconductor substrate, a first i-type semiconductor film placed on a portion of a surface of the semiconductor substrate, a first conductivity-type semiconductor film 3 placed on the first i-type semiconductor film, a second i-type semiconductor film placed on another portion of the surface thereof, and a second conductivity-type semiconductor film placed on the second i-type semiconductor film; an electrode section including a first electrode layer placed on the first conductivity-type semiconductor film and a second electrode layer placed on the second conductivity-type semiconductor film; and a reflective section placed in a gap region A interposed between the first electrode layer and the second electrode layer.

Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

Disclosed is a solar cell that comprises a photoelectric conversion body, a first electrode including a first finger portion that is placed on one main surface of the photoelectric conversion body and extends in first direction, a second electrode including a second finger portion which is placed on the one main surface of the photoelectric conversion body to be adjacent to the first finger portion in second direction intersecting the first direction and extends in the first direction, a first insulating layer covering at least part of a tip end portion of the first finger portion, which tip end portion is located on first side in the first direction, and a second insulating layer covering at least part of a tip end portion of the second finger portion, which tip end portion is located on a second side in the first direction.

A photovoltaic device includes a crystalline substrate having a first dopant conductivity, an interdigitated back contact and a front surface field structure. The front surface field structure includes a crystalline layer formed on the substrate and a noncrystalline layer formed on the crystalline layer. The crystalline layer and the noncrystalline layer are doped with dopants having a same dopant conductivity as the substrate. Methods are also disclosed.

The manufacturing method of a solar cell includes forming a photoelectric conversion unit and forming an electrode connected to the photoelectric conversion unit. The step of forming the electrode includes forming a seed formation layer connected to the photoelectric conversion unit, forming an anti-oxidation layer on the seed formation layer, performing a thermal process such that a material of the seed formation layer and a material of the photoelectric conversion unit react with each other to form a chemical bonding layer at a portion at which the seed formation layer and the photoelectric conversion unit are adjacent to each other, forming a conductive layer and a capping layer on the seed formation layer in a state in which a mask is used on the seed formation layer, and patterning the seed formation layer using either the conductive layer or the capping layer as a mask.

An apparatus and method pertaining to a perpetual energy harvester. The harvester absorbs ambient infrared radiation and provides continual power regardless of the environment. The device seeks to harvest the largely overlooked blackbody radiation through use of a semiconductor thermal harvester.

The present invention concerns a method for the manufacture of the first layer of a back contact layer for thin-layer solar cells in superstrate configuration. In the prior art, this layer is deposited as a compound, for example as a layer of Sb.sub.2Te.sub.3. In accordance with the invention, however, a tellurium-rich surface layer of the cadmium telluride layer is produced, on which a first material is deposited which is capable of forming an electrically conductive second material with tellurium and of producing the second material by reaction of the first material and tellurium in the surface layer. The second material forms the first layer of the back contact layer.

A hybrid all-back-contact (ABC) solar cell and method of fabricating the same. The method comprises: forming one or more patterned insulating passivation layers over at least a portion of an absorber of the solar cell; forming one or more hetero junction layers over at least a portion of the one or more patterned insulating passivation layers to provide one or more heterojunction point or line-like contacts between the one or more heterojunction layers and the absorber of the solar cell; forming one or more first metal regions over at least a portion of the one or more heterojunction layers; forming a doped region within the absorber of the solar cell; and forming one or more second metal regions over at least a portion of the doped region and contacting the doped region to provide one or more homojunction contacts.

In accordance with embodiments disclosed herein, there are provided methods and systems for implementing damage-and-resist-free laser patterning of dielectric films on textured silicon. For example, in one embodiment, such means include means for depositing a Silicon nitride (SiNx) or SiOx (silicon oxide) layer onto a crystalline silicon (c-Si) substrate by a Plasma Enhanced Chemical Vapor Deposition (PECVD) processing; depositing an amorphous silicon (a-Si) film on top of the SiNx or SiOx layer; patterning the a-Si film to define an etch mask for the SiNx or SiOx layer; removing the SiNx or SiOx layer via a Buffered Oxide Etch (BOE) chemical etch to expose the c-Si surface; removing the a-Si mask with a hydrogen plasma etch in a PECVD tool to prevent current loss from the mask; and plating the exposed c-Si surface with metal contacts. Other related embodiments are disclosed.