A light-emitting device includes: a light-transmissive layer having a first surface; and a photoluminescent layer located on the first surface. The photoluminescent layer has a second surface facing the light-transmissive layer and a third surface opposite the second surface, and emits light containing first light having a wavelength X, in air from the third surface. The photoluminescent layer has a first surface structure located on the third surface, the first surface structure having an array of projections. The light-transmissive layer has a second surface structure located on the first surface, the second surface structure having projections corresponding to the projections of the first surface structure. The first surface structure and the second surface structure limit a directional angle of the first light emitted from the third surface. The projections of the first surface structure include a first projection, and the first projection has a base width greater than a top width.

An LED module includes a circuit substrate, a light source and a lens. The light source includes first and second LEDs that differ in chromaticity. The circuit substrate is provided with conductors for driving the first and second LEDs independently. The lens includes a hollow, on a side of the circuit substrate, inside which the light source is present. An inside of the hollow is a light entrance surface. An opening of the hollow has a circular shape. The first and second LEDs of the light source are arranged to have point symmetry.

A nanorod light-emitting device includes an n-type semiconductor layer, an active layer on the n-type semiconductor layer, and a p-type semiconductor layer on the active layer, and the n-type semiconductor layer includes a core rod, a plurality of nano pores opened in an outward direction from the core rod, and a plurality of quantum dots dispersed in the plurality of nano pores.

A light emitting device may include a substrate. A light emitting element layer may be disposed on the substrate and may include light emitting elements having a rod shape. A color conversion layer may be disposed on the light emitting element layer and may include color conversion elements having a rod shape. A first alignment direction of the light emitting elements and a second alignment direction of the color conversion elements may be substantially parallel to each other or intersect at a predetermined angle.

Multiple colors of light emitted by an assembled light emitting diode (LED) based illumination device is automatically tuned to within a predefined tolerance of multiple target color points by modifying portions of wavelength converting materials associated with each color. A first color of light emitted from the assembled LED based illumination device in response to a first current is measured and a second color of light emitted from the assembled LED based illumination device in response to a second current is measured. A material modification plan to modify wavelength converting materials is determined based at least in part on the measured colors of light and desired colors of light to be emitted. The wavelength converting materials may be selectively modified in accordance with the material modification plan so that the assembled LED based illumination device emits colors of light that are within a predetermined tolerance of target color points.

The disclosure relates to a light emitting device. The light emitting device includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer and a second electrode. The first electrode is electrically connected to the first semiconductor layer. The second electrode is electrically connected to the second semiconductor layer. At least one of the first electrode and the second electrode comprises a metal metamaterial layer. The metal metamaterial layer comprises a number of metamaterial units arranged to form a periodic array. A distance between the metal metamaterial layer and the active layer is less than or equal to 100 nanometers. The display device using the light emitting device is also provided.

The present invention relates to a light-emitting diode (LED) structure, which comprises an LED unit. The LED unit is doped with a plurality of fluorescent powders in at least an arbitrary layer on one side of a light-emitting layer. Alternatively, the LED unit includes a plurality of fluorescent powder particles arranged on at least a light-emitting surface of the LED unit. No gel is adopted for disposing or packaging fluorescent powders. Thereby, gel yellowing caused by long-term high-temperature heating of the LED structure will not occur. The yellowing phenomenon will affect the light-emitting efficiency of LED and induce color deviation.

A light-emitting device includes; a photoluminescent layer that emits light; and a light-transmissive layer on which the emitted light is to be incident. At least one of the photoluminescent layer and the light-transmissive layer defines a surface structure. The surface structure has projections and/or recesses to limit a directional angle of the emitted light. The photoluminescent layer and the light-transmissive layer are curved.

The light emitting device includes a light emitting element, a wavelength converter, and a light guider. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter includes first and second wavelength converter parts. The first wavelength converter part faces the element upper surface and has a first thickness. The second wavelength converter part does not face the element upper surface and has a second thickness thinner than the first thickness.

In one embodiment, the transparent growth substrate of an LED die is formed to have light scattering areas, such as voids formed by a laser. In another embodiment, the growth substrate is removed and replaced by another substrate that is formed with light scattering areas. In one embodiment, the light scattering areas are formed over the light absorbing areas of the LED die, to reduce the amount of incident light on those absorbing areas, and over the sides of the substrate to reduce light guiding. The replacement substrate may be formed to include reflective particles in selected areas. A 3D structure may be formed by stacking substrate layers containing the reflective areas. The substrate may be a transparent substrate or a phosphor tile that is affixed to the top of the LED.