Provided is a light-emitting apparatus including a board, a resin frame fixed on the board, sets of light-emitting elements mounted in a region on the board surrounded by the resin frame, wherein the light-emitting elements configuring each set are connected in series to each other. The light-emitting apparatus further includes connection electrodes provided on the board and electrically connected to the light-emitting elements and capable of supplying a drive current selectively to the sets of light-emitting elements, and a sealing resin which includes a phosphor mixed therein and excited by light from the light-emitting elements, and is filled so as to bury the region on the board, to seal integrally the light-emitting elements. The thickness of the sealing resin immediately above the light-emitting elements differs for the respective sets, and thereby, a chromaticity of light emitted from the sealing resin differs when each set of light-emitting elements emits the light singly.

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 m to 50 m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

A light emitting diode (LED) package includes a package body; an LED chip above the package body; a first wavelength conversion layer containing a first wavelength conversion material, and an upper surface portion covering a part of an upper surface of the LED chip and a lateral portion covering side surfaces of the LED chip; and a second wavelength conversion layer containing a second wavelength conversion material different from the first wavelength conversion material, and covering the first wavelength conversion layer and a remaining part of the upper surface of the LED chip.

A light emitting device package having enhanced light extraction efficiency includes a body having a mounting region, a light emitting device disposed above the mounting region, and a spacer disposed between the light emitting device and the mounting region to secure a space between the light emitting device and the mounting region. The spacer has a reflective surface reflecting light emitted by the light emitting device to the mounting region in a lateral direction.

A light-emitting device in which a resin forming a reflective layer is reduced from creeping up a portion covering the upper surface of a light-emitting element, and a method for manufacturing the same, is disclosed. The light-emitting device includes a substrate, a light-emitting element on the substrate, the light-emitting element having at least one side surface and the upper surface, a fluorescent material layer on the side surface and the upper surface, a light-transmissive layer on the side surface and the upper surface with the fluorescent material layer sandwiched therebetween, and a reflective layer covering the side surface with the fluorescent material layer and the light-transmissive layer sandwiched therebetween, the reflective layer being not disposed on at least the upper surface.

System for wafer-level phosphor deposition. A method for phosphor deposition on a semiconductor wafer that has a plurality of LED dies includes the operations of covering the semiconductor wafer with a selected thickness of photo resist material, removing portions of the photo resist material to expose portions of the semiconductor wafer so that electrical contacts associated with the plurality of LED dies remain unexposed, and depositing phosphor on the exposed portions of the semiconductor wafer.

A method for making a grating includes the following steps. A first photoresist film is formed on a substrate. A second photoresist film is applied on the first photoresist film. A number of first cavities are formed in the second photoresist film, wherein part of the first photoresist film is exposed to form a first exposed part. A number of second cavities are formed, wherein part of the surface of the substrate is exposed to form an exposed surface. A mask layer is deposited on the second photoresist film and the exposed surface of the substrate. A patterned mask layer is formed, and part of the substrate is exposed to form a second exposed part. The second exposed part of the substrate is etched through the patterned mask layer. The patterned mask layer is removed.

The light-emitting device includes a substrate and a plurality of light-emitting sections. A first light-emitting section is made up of LED chips and a first fluorescent-substance-containing resin layer, and a second light-emitting section is made up of LED chips and a second fluorescent-substance-containing resin layer. The first fluorescent-substance-containing resin layer and the second fluorescent-substance-containing resin layer are provided in a plurality of locations such that the fluorescent-substance-containing resin layers for the different light-emitting sections are adjacently arranged.

A light source using a wavelength conversion member is increased in brightness. A wavelength conversion element 11 includes a plurality of wavelength conversion members 12 bundled together, each containing a dispersion medium and phosphor powder dispersed in the dispersion medium.

A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.