A light emitting device includes a metal support structure comprising Cu; an adhesion structure on the metal support structure and comprising Au; a reflective conductive contact on the adhesion structure; a GaN-based semiconductor structure on the reflective conductive contact, the GaN-based semiconductor structure comprising a first-type GaN layer, an active layer, and a second-type GaN layer; a top interface layer on the GaN-based semiconductor structure and comprising Ti; and a contact pad on the top interface layer and comprising Au, wherein the GaN-based semiconductor structure is less than 1/20 thick of a thickness of the metal support structure.

A lamp that is mounted on a vehicle has a light-emitting element having a light-emitting portion, a first terminal, and a second terminal, a circuit board having a first surface on which the light-emitting element mounted is mounted, and a reflector that reflects light emitted from the light-emitting portion to a front of the light-emitting element. The first terminal supplies power to the light-emitting portion. The second terminal supports the light-emitting portion. The first terminal and the second terminal are arranged in a longitudinal direction. The second terminal is placed rearward of the first terminal.

An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.

A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.

A light source module includes at least one light source emitting light, and a body supporting the light source, wherein the body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer contacted with the insulating layer, the conductive layer being at least provided in a path region in which electric current is applied to the light source, the conductive layer being contacted with the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

A light source module includes at least one light source and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof for absorbing heat from the light source and dissipating the heat to the outside, an electrically insulating layer provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer, the conductive layer being at least provided in a path region through which electric current is applied to the light source. The conductive layer includes light source connection parts supplying the electric current to the light source, and a light source mounting part disposed between the light source connection parts. One portion of the light source connection part is divided into at least two portions to be connected to each other. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and optimization of a conductive material.

Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; and a protective insulation layer covering a sidewall of the semiconductor stack.

Disclosed herein are a light emitting module and a lighting device that may be used for a display application or a lighting application. The light emitting module includes an electrode layer including a plurality of blocks that are insulated from each other by an electrode separating line; and one or more light emitting elements mounted on the electrode layer so as to be electrically connected to any one block of the blocks of the electrode layer and a neighboring block, respectively, wherein the blocks have another neighboring block disposed in a first direction and still another neighboring block disposed in a second direction, based on any one block of the blocks while having the electrode separating line formed to be bent more than once at a predetermined interval therebetween so that heat generated from the light emitting elements is emitted through the blocks.

An optical device substrate includes metal plates and insulating layers formed between the metal plates. Each insulating layer includes a cured insulating layer formed by curing insulating material and an anodized layer merged with each metal plate, the anodized layer formed by anodizing a first metal and a second metal of each metal plate. The first metal and the second metal include a first anodized layer and a second anodized layer, respectively, and are electrically insulated by interfaces including a first interface formed between the first metal and the first anodized layer, a second interface formed between the first anodized layer and the cured insulating layer, a third interface formed between the cured insulating layer and the second metal and a fourth interface formed between the second anodized layer and the second metal.