According to one embodiment of the present invention, the light emitting device includes an LED element, a side wall which surrounds the LED element, a phosphor layer which is fixed to the side wall with an adhesive layer therebetween, and is positioned above the LED element, and a metal pad as a heat dissipating member. The side wall includes an insulating base which surrounds the LED element and a metal layer which is formed on a side surface at the LED element side of the base, and is in contact with the metal pad and the adhesive layer. The adhesive layer includes a resin layer that includes a resin containing particles which have higher thermal conductivity than the resin or a layer that includes solder.

An optoelectronic semiconductor component includes an optoelectronic thin-film chip; and a thermally conductive and electrically insulating element, wherein both the thin-film chip and the element are embedded in a molded body, a top surface of the thin-film chip and a bottom surface of the element are not covered by the molded body, the top surface of the thin-film chip is approximately flush with a top surface of the molded body, the bottom surface of the element is approximately flush with a bottom surface of the molded body, the molded body includes a first embedded conductor structure and a second embedded conductor structure, and the first conductor structure and the second conductor structure extends to the bottom surface of the molded body.

Flexible LED assemblies that have coplanar integrated conductive features upon which an LED can be mounted, and methods of making such LED assemblies are described. The flexible LED assembly includes a flexible polymer substrate, a first conductive feature, a second conductive feature and an LED. The first conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The second conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The first and second conductive features are separated by a gap therebetween. The LED is mounted on both the first and second conductive features, and the first and second conductive features are substantially coplanar with one another.

A method of manufacturing a light emitting device includes: providing an undivided base having a first main surface and a second main surface on the opposite side from the first main surface, the undivided base having conductive patterns disposed on the first main surface and conductive patterns disposed on the second main surface; mounting a plurality of light emitting elements on the conductive patterns on the first main surface; forming a light reflecting member that integrally covers side surfaces of the light emitting elements and the first main surface of the undivided base; and, after the forming of the light reflecting member, forming at least one groove on the second main surface of the undivided base at a position corresponding to a space between the light emitting elements so that the groove reaches the first main surface and the undivided base is divided into a plurality of base members.

One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

A light source module includes a light source for emitting light, and a heat sink for absorbing heat from the light source and dissipating the heat to the outside. The heat sink includes a mounting part for attaching the light source, and a heat dissipation fin for absorbing heat generated by the light source and dissipating the heat to the outside. An electrical insulating layer is provided on at least one surface of the heat sink, and an electrically conductive layer is provided in the insulating layer. The electrically conductive layer provides a path through which electric current is applied to the light source. A lens cover is provided over the light source.

A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.

A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.