This disclosure provides back contact cell and solar cell module. The back contact cell comprises a semiconductor substrate, the semiconductor substrate is provided with a front surface and a back surface opposite to each other, the back surface includes a plurality of adjacent and alternately arranged segment units, a segment space is formed between segment unit and the backlight surface; the segment space further includes a first space, a second space, a third space and a fourth space; a first passivation layer, located only in the first space in each segment space; a first doped semiconductor layer, located only in the first space in each segment space, and being adjacent to a side of the first passivation layer away from the semiconductor substrate; a second passivation layer, located only in the second spacethe fourth space in each segment space; and a second doped semiconductor layer located only in the second spacethe fourth space in each segment space, and being adjacent to a side of the second passivation layer away from the semiconductor substrate.

A solar cell and a method for preparation the solar cell are provided. The solar cell includes a semiconductor substrate, a hole transport layer and an electronic transport layer, a first passivation layer and a second passivation layer. The semiconductor substrate includes a first surface and a second surface opposite to each other. The hole transport layer and the electronic transport layer are disposed on the first surface at interval. A material of the hole transport layer includes vanadium oxide, and a material of the electronic transport layer includes titanium oxide. The first passivation layer is located on a surface of the hole transport layer away from the semiconductor substrate. A surface of the first passivation layer away from the semiconductor substrate, a surface of the electronic transport layer away from the semiconductor substrate, and the first surface are all covered by the second passivation layer.

A solar cell can include a silicon semiconductor substrate; an oxide layer on a first surface of the silicon semiconductor substrate; a polysilicon layer on the oxide layer; a diffusion region at a second surface of the silicon semiconductor substrate; a dielectric film on the polysilicon layer; a first electrode connected to the polysilicon layer through the dielectric film; a passivation film on the diffusion region; and a second electrode connected to the diffusion region through the passivation film.

A solar cell module includes: solar cells each having a first main surface and a second main surface; a front-side transparent protective member disposed on a first main surface-side of the solar cells; a front-side transparent encapsulant layer disposed between the front-side transparent protective member and the solar cells; a back-side protective member disposed on a second main surface-side of the solar cells; a back-side white encapsulant layer disposed between the back-side protective member and the solar cells; and a back-side transparent encapsulant layer disposed between the back-side white encapsulant layer and the solar cells, wherein a thickness of the back-side transparent encapsulant layer in a vicinity of an edge portion of the second main surface of the solar cells is less than a thickness of the back-side transparent encapsulant layer in a region between the solar cells that are neighboring to each other.

A first insulating layer is layered on first surfaces of solar cells. Herein, the first insulating layer is formed of polyolefin or ethylene-vinyl acetate copolymer (EVA). A second insulating layer is layered on the first insulating layer. Herein, the second insulating layer is formed of polyester resin. A first inter-cell wire rod and second inter-cell wire rod provided to the first surfaces of the solar cells are partially brought into contact with the second insulating layer.

A solar cell is disclosed. The solar cell includes a crystalline semiconductor substrate containing impurities of a first conductivity type, a front doped layer located on a front surface of the semiconductor substrate, a back doped layer located on a back surface of the semiconductor substrate, a front transparent conductive layer located on the front doped layer and having a first thickness, a front collector electrode located on the front transparent conductive layer, a back transparent conductive layer located under the back doped layer and having a second thickness, and a back collector electrode located under the back transparent conductive layer. The first thickness of the front transparent conductive layer and the second thickness of the back transparent conductive layer are different from each other, and a sheet resistance of the front transparent conductive layer is less than a sheet resistance of the back transparent conductive layer.

A photovoltaic device is provided that includes a semiconductor substrate including a p-n junction with a p-type semiconductor portion and an n-type semiconductor portion one lying on top of the other, wherein an upper exposed surface of the semiconductor substrate represents a front side surface of the semiconductor substrate. A plurality of patterned antireflective coatings is located on the front side surface to provide a grid pattern including a busbar region and finger regions. The busbar region includes at least a real line interposed between at least two dummy lines. A material stack including at least one metal layer located on the semiconductor substrate in the busbar region and the finger regions.

A method of fabricating an optoelectronic device includes the steps of providing a semiconductor unit and forming a plurality of metal contacts on a surface of the semiconductor unit for electrical conduction. The method further includes the step of forming a plurality of color coating regions on top of the plurality of metal contacts, the plurality of color coating regions imparting a color different than a color of the plurality of metal contacts.

Disclosed is a solar cell including a semiconductor substrate, a protective-film layer formed over one surface of the semiconductor substrate, a first conductive area disposed over the protective-film layer, the first conductive area being of a first conductive type and including a crystalline semiconductor, and a first electrode electrically connected to the first conductive area. The first conductive area includes a first portion disposed over the protective-film layer and having a first crystal grain size, and a second portion disposed over the first portion and having a second crystal grain size, which is greater than the first crystal grain size.

The invention relates to a passivated emitter rear solar cell, comprising a silicon substrate having a front and back surface, a rear passivation layer on the back surface of the silicon substrate having a plurality of open holes formed therein, an aluminum back contact layer formed in the open holes of the rear passivation layer, and at least one backside soldering tab on the back surface of the silicon substrate. The backside soldering tab is formed from an electroconductive paste composition comprising conductive metallic particles, at least one lead-free glass frit, and an organic vehicle comprising at least one silicone oil.