The present invention relates to a method for manufacturing a decorative laminate panel, comprising an outermost decor layer, at least one photovoltaic element for converting the energy of light into electricity by the photovoltaic effect and a core construction, wherein the at least one photovoltaic element is located between the outermost decor layer and the core construction.

An object of the present invention is to provide a method for manufacturing a decorative laminate panel that is provided with a photovoltaic function where the photovoltaic function is seamlessly integrated into the decorative laminate panel and cannot be seen from the outside.

A system includes first, second and third photovoltaic modules on a rood. Each module includes an upper edge, a lower edge and at least one solar cell. Lower edges of the cells of the first and second modules are offset from lower edges of the first and second modules. Upper edge of the cell of the second module is offset from the upper edge of the second module. The upper edge of the cell of the third module is offset from the upper edge of the third module. The first module overlays the second module. The lower edge of the cell of the first module is substantially aligned with the upper edge of the cell of the second module. The second module overlays the third module. The lower edge of the cell of the second module is substantially aligned with the upper edge of the cell of the third module.

The invention relates to a method of producing a solar panel curved in two directions. A problem occurs when solar cells are laminated (attached) to a curved surface (such as thetransparentroof of a car) that is, at least locally, curved in two directions. Solar cells can bend in one direction (following a cylindrical surface), but to a much smaller degree in two directions. The invention solves this problem by subdividing the multitude of solar cells (100) in subgroups (302L, 302R, 304L, 304R, 306L, 306R, 308L, 308R), each subgroup associated with an area of the curved surface (202). By choosing these subgroups such, that almost no curvature occurs in one direction, the solar cells can be bend in the perpendicular direction. To optimize the efficiency further solar cells are used where anode and cathode are positioned at one side (the side opposite to the photosensitive side), enabling flexible foil to be used for the interconnection of the solar cells in a subgroup.

A solar cell module manufacturing method includes: preparing a front-side transparent protective member and a back-side protective sheet member, the front-side transparent protective member including a first principal surface and a second principal surface, a surface area of at least the first principal surface being larger than a projected area of the first principal surface, the back-side protective sheet member including a third principal surface and a fourth principal surface; and disposing a solar cell between the second principal surface of the front-side transparent protective member and the third principal surface of the back-side protective sheet member, and sealing the solar cell with a bonding layer therebetween. A breaking elongation of the back-side protective sheet member is 300% or more.

Embodiments include an exemplary method for manufacturing a solar cell module that includes: a front surface-side transparent protective member having a curved shape; a back surface-side protective member having a curved shape corresponding to the curved shape of the front surface-side transparent protective member; and a filler layer disposed between the front surface-side transparent protective member and the back surface-side protective member, and seals a solar cell inside. The exemplary method may comprise: preparing the front surface-side transparent protective member having the curved shape and the back surface-side protective member having the curved shape; and manufacturing the solar cell module by disposing the solar cell and the filler layer between the front surface-side transparent protective member and the back surface-side protective member, and by pressing the front surface-side transparent protective member, the back surface-side protective member, the solar cell, and the filler layer.

This invention relates to a solar-cell module backing layer obtained by co-extruding obtained by melt co-extruding (i) a first polymer composition comprising (a) a polyamide, (b) an elastomer and (c) an elastomer that contains groups that bond chemically and/or interact physically with the polyamide, and wherein the first polymer composition comprises from 10 to 90 wt. % of the polyamide (a) and from 10 to 90 wt. % of the elastomer (b) and (c) (of the total weight of polyamide (a) and elastomer (b) and (c) present in the first polymer composition) and (ii) a second polymer composition comprising from 50-98 wt. % of elastomer and from 0.15-5 wt. % of groups (based on the total weight of the second polymer composition) that bond chemically and/or interact physically with the solar cell and optionally with the first polymer composition.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.