A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate.

A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate.

An apparatus and system, including a chip including a photodetector, wherein the photodetector includes a semiconductor photodiode and a heater proximate to the photodiode; wherein the heater is enabled to increase a temperature of the photodiode and a temperature sensing device to determine the temperature of the photodiode.

An apparatus and system, including a chip including a photodetector, wherein the photodetector includes a semiconductor photodiode and a heater proximate to the photodiode; wherein the heater is enabled to increase a temperature of the photodiode and a temperature sensing device to determine the temperature of the photodiode.

A light detecting device includes: a light detector; a heat exchanger thermally connected to the light detector; a coolant flow channel configured to be connected to the heat exchanger and allow a coolant for cooling the light detector to flow; a pump configured to cause the coolant to flow in the coolant flow channel; and a control unit that controls the pump. The control unit performs control such that a first drive power is supplied to the pump during a detection period in which the light detector performs light detection, and a second drive power is supplied to the pump during a standby period in which the light detector stands by without performing light detection, and the first drive power is smaller than the second drive power.

A light detecting device includes: a light detector; a heat exchanger thermally connected to the light detector; a coolant flow channel configured to be connected to the heat exchanger and allow a coolant for cooling the light detector to flow; a pump configured to cause the coolant to flow in the coolant flow channel; and a control unit that controls the pump. The control unit performs control such that a first drive power is supplied to the pump during a detection period in which the light detector performs light detection, and a second drive power is supplied to the pump during a standby period in which the light detector stands by without performing light detection, and the first drive power is smaller than the second drive power.

The present application provides an optical module. The optical module comprises: a housing assembly; an optical assembly, disposed in the housing assembly; and a heat dissipation elastic sheet, sandwiched between the optical assembly and the housing assembly. The heat dissipation elastic sheet comprises a heat dissipation portion, and the heat dissipation portion is in contact with the optical assembly. The heat dissipation elastic sheet further comprises a deformation portion, the deformation portion is connected to the heat dissipation portion, and the deformation portion is bent relative to the heat dissipation portion. The deformation portion is provided with a hollow area, so that the deformation portion can be bent and deformed. In this way, the heat dissipation elastic sheet of the present application is convenient for secondary disassembly and assembly, and can be in elastic contact with an element to be cooled, thereby avoiding adverse effects as much as possible on performance of the element to be cooled due to excessive stress of the element to be cooled.

The present application provides an optical module. The optical module comprises: a housing assembly; an optical assembly, disposed in the housing assembly; and a heat dissipation elastic sheet, sandwiched between the optical assembly and the housing assembly. The heat dissipation elastic sheet comprises a heat dissipation portion, and the heat dissipation portion is in contact with the optical assembly. The heat dissipation elastic sheet further comprises a deformation portion, the deformation portion is connected to the heat dissipation portion, and the deformation portion is bent relative to the heat dissipation portion. The deformation portion is provided with a hollow area, so that the deformation portion can be bent and deformed. In this way, the heat dissipation elastic sheet of the present application is convenient for secondary disassembly and assembly, and can be in elastic contact with an element to be cooled, thereby avoiding adverse effects as much as possible on performance of the element to be cooled due to excessive stress of the element to be cooled.

The present invention provides a photodiode for a wearable sensor system, the photodiode having a rectangular active area sensitive to wavelengths within the spectral range of 1200 nm to 2400 nm. The present invention also provides a wearable sensor system comprising the photodiode.

The present invention provides a photodiode for a wearable sensor system, the photodiode having a rectangular active area sensitive to wavelengths within the spectral range of 1200 nm to 2400 nm. The present invention also provides a wearable sensor system comprising the photodiode.