An image sensing device includes a first test block, a second test block, and a readout block. The first test block includes a plurality of first image sensing pixels structured to convert incident light carrying an image into a first pixel signal indicative of the image, and a first heating element structured to transmit heat to the first image sensing pixels. The second test block includes a plurality of second image sensing pixels that each include a light blocking structure to be shielded from receiving incident light to generate a second pixel signal without being directly exposed to the incident light, and a second heating element structured to transmit heat to the second image sensing pixels. The readout block processes the first pixel signal output from the first test block and the second pixel signal output from the second test block.

An image sensor includes a first voltage source that supplies a first voltage and a plurality of pixels supplied with the first voltage. The pixel includes a photoelectric conversion unit that photoelectrically converts incident light, an accumulation unit to which an electric charge resulting from photoelectric conversion by the photoelectric conversion unit is transferred and accumulated, a transfer unit that transfers the electric charge from the photoelectric conversion unit to the accumulation unit; a second voltage source that supplies a second voltage, and a supply unit that supplies the transfer unit with a transfer signal based on either the first voltage supplied by the first voltage source or the second voltage supplied by the second voltage source.

A portable apparatus for analyzing a plant specimen. A housing assembly defines a sensing volume and controls entry of ambient light into the sensing volume when the housing is closed. A specimen support positions a plant specimen within the sensing volume whereby light emitted from at least one light emitter is incident upon the plant specimen. An image sensor senses light from the at least one light emitter that has been incident on the plant specimen. A processor analyzes data obtained from the light sensor to assess one or more properties of the plant specimen. There may be more than one light emitter, e.g., a halogen lamp and LED array, and the apparatus may acquire images under more than one lighting condition. The apparatus may include a mechanism for moving the plant specimen relative to the optical path to take images at multiple regions of interest on the specimen.

A unit pixel circuit includes a first photodiode, a second photodiode different from the first photodiode, a first floating diffusion node in which charges generated in the first photodiode are accumulated, a second floating diffusion node in which charges generated in the second photodiode are accumulated, a capacitor connected to the first floating diffusion node and a first voltage node, and accumulating overflowed charges of the first photodiode, a first switch transistor connecting the first floating diffusion node to a third floating diffusion node, a reset transistor connecting the third floating diffusion node to a second voltage node, a gain control transistor connecting the second floating diffusion node to the third floating diffusion node, and a second switch transistor connected to the first voltage node and the second voltage node.

Provided is a photoelectric conversion device including a pixel array that includes pixels forming columns and is arranged in a substrate, first signal lines each transmitting a signal output from a pixel of a corresponding column, an analog circuit arranged in the substrate and configured to process signals from the pixels, second signal lines transmitting signals from the pixels to the analog circuit on a column basis, a switch configured to change a combination of connections between the first signal lines and the second signal lines, and a shift register arranged in the substrate, including a flip-flop, and configured to control the switch. In a plan view with respect to the substrate, the shift register is arranged between the pixel array and the analog circuit. In the plan view, the switch and the flip-flop are arranged in a direction different from a direction in which the first signal lines extend.

To control an excess bias to an appropriate value in a light detection device. A solid-state image sensor includes a photodiode, a resistor, and a control circuit. In this solid-state image sensor, the photodiode photoelectrically converts incident light and outputs a photocurrent. Furthermore, in the solid-state image sensor, the resistor is connected to a cathode of the photodiode. Furthermore, in the solid-state image sensor, the control circuit supplies a lower potential to an anode of the photodiode as a potential of the cathode of when the photocurrent flows through the resistor is higher.

An image sensor may include: a pixel array including a plurality of pixels; and a timing controller configured to control the pixel array according to an operation mode of the pixel array. The operation mode may be any one of a first mode in which the plurality of pixels operate according to a global shutter method and a second mode in which the plurality of pixels operate according to a dual conversion gain method.

A semiconductor apparatus includes a stack of first and second chips each having a plurality of pixel circuits arranged in a matrix form. The pixel circuit of the a-th row and the e1-th column is connected to the electric circuit of the p-th row and the v-th column. The pixel circuit of the a-th row and the f1-th column is connected to the electric circuit of the q-th row and the v-th column. The pixel circuit of the a-th row and the g1-th column is connected to the electric circuit of the r-th row and the v-th column. The pixel circuit of the a-th row and the h1-th column is connected to the electric circuit of the s-th row and the v-th column.

The present technology relates to an imaging device of global shutter type, and relates to an imaging device and electronic equipment capable of inhibiting interference between a photoelectric conversion unit and an element that holds charge that has been transferred from the photoelectric conversion unit. An imaging device includes, in a pixel: a photoelectric conversion unit; a charge transfer unit; an electrode that is used to transfer charge from the photoelectric conversion unit to the charge transfer unit; a charge-voltage conversion unit; and a charge drain unit. Here, the charge transfer unit is allowed to transfer charge in a first transfer direction to the charge-voltage conversion unit and a second transfer direction to the charge drain unit. The present technology can be applied to, for example, a CMOS image sensor of global shutter type.

An imaging device 100 includes a pixel array PA. A first period, a third period, and a second period appear in this order in one frame. During the first period, pixel signal readout is performed on at least one first row in the pixel array PA. During the second period, pixel signal readout is performed on at least one second row in the pixel array PA. At least one of the at least one first row or the at least one second row includes two rows in the pixel array PA. During the third period, no pixel signal readout is performed on the rows in the pixel array PA. Each of the first period and the second period is one of the high-sensitivity exposure period and the low-sensitivity exposure period. The third period is the other of the high-sensitivity exposure period and the low-sensitivity exposure period.