An imaging device of the present disclosure includes: a pixel array section in which pixels including light receiving elements are arranged; a first pixel control section that performs control to read out signals of all the pixels in the pixel array section at a first frame rate; a second pixel control section that performs control to read out signals of the pixels in a specific region in the pixel array section at a second frame rate higher than the first frame rate; and an analog-to-digital conversion section that performs an analog-to-digital conversion on a pixel signal read out by the control performed by the first pixel control section or the second pixel control section.

A time-of-flight (TOF) camera device including an optical transmitter configured to transmit light to a subject, an optical receiver configured to receive light reflected from the subject, and an actuator configured to adjust either one or both of an optical scanning direction and field of luminance (FOL) of the optical transmitter.

There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

The present disclosure relates to a solid-state imaging device, a manufacturing method thereof, and an electronic apparatus, in which both oblique light characteristics and sensitivity can be improved. The solid-state imaging device includes pixel array unit in which a plurality of pixels is two-dimensionally arranged in a matrix and multi-stage light shielding walls are provided between the pixels. The present disclosure is applicable to, for example, a back-illuminated type solid-state imaging device and the like.

In an imaging apparatus, each of a plurality of pixels has a first semiconductor area having a first conductivity type, a floating diffusion area, and a transfer gate positioned between the first semiconductor area and the floating diffusion area. In a part of the plurality of pixels, a partial area of the first semiconductor area receives a potential supplied from a contact. The part of the plurality of pixels further has a second semiconductor area having a second conductivity type positioned between the partial area and the transfer gate in a planar view.

An imaging device that smoothly transfers electric charges from a photoelectric converter to a transfer destination is provided. This imaging device includes: a semiconductor layer; a photoelectric converter that generates electric charges corresponding to a received light amount; and a transfer section that includes a first trench gate and a second trench gate and transfers the electric charges from the photoelectric converter to a single transfer destination via the first trench gate and the second trench gate, the first trench gate and the second trench gate each extending from the front surface to the back surface of the semiconductor layer into the photoelectric converter. The first trench gate has a first length from the front surface to the photoelectric converter, and the second trench gate has a second length from the front surface to the photoelectric converter, the second length being shorter than the first length.

An imaging device includes a pixel array including pixel circuits arranged into rows and columns. Each bitline of a plurality of bitlines is coupled to a respective column of pixel circuits of the pixel array. The plurality of bitlines is grouped into pairs of bitlines. A plurality of binning circuits is coupled to the plurality of bitlines. Each binning circuit is coupled to a respective pair of bitlines and is responsive to a multi-mode select signal. Each binning circuit is configured to output a binned signal responsive to the first and second bitlines of the respective bitline pair in a first mode. Each binning circuit is configured to output a first signal from a first bitline of the respective bitline pair in a second mode. Each binning circuit is configured to output a second signal from the second bitline of the respective bitline pair in a third mode.

In an example embodiment, an image processing device includes a pixel array including pixels two-dimensionally arranged and configured to capture an image, each of the pixels including a plurality of photoelectric conversion elements and an image data processing circuit configured to generate image data from pixel signals output from the pixels. The image processing device further includes a color data processing circuit configured to extract color data from the image data and output extracted color data. The image processing device further includes a depth data extraction circuit configured to extract depth data from the image data and output extracted depth data. The image processing device further includes an output control circuit configured to control the output of the color data and the depth data.

The present technology relates to a signal processing device and method, and a program that enable easier and more accurate failure detection. The signal processing device includes: an addition unit that adds test data for failure detection to valid data on which predetermined processing is to be performed, two or more samples processed in parallel in different paths having a same sample value in the test data; and a signal processing unit that performs the predetermined processing on the valid data and the test data that has been added to the valid data by a plurality of the paths. The present technology can be applied to in-car cameras.

To improve the correction accuracy in a solid-state image sensor that performs dark current correction. A solid-state image sensor includes a bias voltage supply unit and a signal processing unit. The bias voltage supply unit supplies a bias voltage of a predetermined value to a light-shielded pixel impervious to light in a period in which a light-shielded pixel signal is output from the light-shielded pixel, and supplies a bias voltage of a value different from the predetermined value to a photosensitive pixel not impervious to light in a period in which a photosensitive pixel signal is output from the photosensitive pixel. The signal processing unit executes processing of removing dark current noise from the photosensitive pixel signal using the light-shielded pixel signal.