To generate a value unique to a device in a more preferable mode.

A solid-state image sensor includes a plurality of unit pixels disposed in a two-dimensional array, and a drive control unit that controls a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, in which the first unit pixel group and the second unit pixel group have different structures from each other.

A TDI scanner including a dynamically programmable focal plane array including a two-dimensional array of detectors arranged in a plurality of columns and a plurality of rows, the array being divided into a plurality of banks separated from one another by gap regions, each bank including a plurality of sub-banks, and each sub-bank including at least one row of detectors, a ROIC coupled to the focal plane array and configured to combine in a TDI process outputs from detectors in each column of detectors in each sub-bank, and a controller configured to program the focal plane array to selectively and dynamically set characteristics of the focal plane array, the characteristics including a size and a location within the two-dimensional array of each of the plurality of sub-banks and the gap regions, the size corresponding to a number of rows of detectors included in the respective sub-bank or gap region.

Systems and methods in accordance with embodiments of the invention implement TDI imaging techniques in conjunction with monolithic CCD image sensors having multiple distinct imaging regions, where TDI imaging techniques can be separately implemented with respect to each distinct imaging region. In many embodiments, the distinct imaging regions are defined by color filters or color filter patterns (e.g. a Bayer filter pattern); and data from the distinct imaging regions can be read out concurrently (or else sequentially and/or nearly concurrently). A camera system can include: a CCD image sensor including a plurality of pixels that define at least two distinct imaging regions, where pixels within each imaging region operate in unison to image a scene differently than at least one other distinct imaging region. In addition, the camera system is operable in a time-delay integration mode whereby time delay-integration imaging techniques are imposed with respect to each distinct imaging region.

In a solid-state imaging device, a photoelectric conversion unit, a transfer transistor, and at least a part of electric charge holding unit, among pixel constituent elements, are disposed on a first semiconductor substrate. An amplifying transistor, a signal processing circuit other than a reset transistor, and a plurality of common output lines, to which signals are read out from a plurality of pixels, are disposed on a second semiconductor substrate.

A back-illuminated solid-state imaging device includes a semiconductor substrate, a shift register, and a light-shielding film. The semiconductor substrate includes a light incident surface on the back side and a light receiving portion generating a charge in accordance with light incidence. The shift register is disposed on the side of a light-detective surface opposite to the light incident surface of the semiconductor substrate. The light-shielding film is disposed on the side of the light-detective surface of the semiconductor substrate. The light-shielding film includes an uneven surface opposing the light-detective surface.

While realizing a broad dynamic range, the present technology relates to a solid-state image pickup device and control method therefor, and electronic apparatus aiming at enabling an influence of PLS to be suppressed. The solid-state image pickup device includes a pixel array unit in which a plurality of pixels are arrayed. A portion of pixels in the pixel array unit are a unit pixel at least having one photoelectric conversion element and over flow integration capacitor. Further, the solid-state image pickup device includes one AD converter for one or more unit pixels in the pixel array unit. The present technology is applicable to, for example, the solid-state image pickup.

A Raman spectrum inspection apparatus and a sample security inspecting method for Raman spectrum inspection are provided. The Raman spectrum inspection apparatus includes: an exciting light source configured to emit an exciting light to a sample; an optical device having a spectrum inspection optical path and a sample imaging optical path, wherein the spectrum inspection optical path is configured to collect a light signal from a location where the sample is irradiated by the exciting light, and the sample imaging optical path is configured to take an image of the sample; a spectrometer configured to receive a light signal from the spectrum inspection optical path, and to generate a Raman spectrum of the sample from the light signal; and a sample security decision device configured to determine security of the sample based on the image of the sample that is taken by the sample imaging optical path.

Disclosed are improved methods, systems and devices for color night vision that reduce the number of intensifiers and/or decrease noise. In some embodiments, color night vision is provided in system in which multiple spectral bands are maintained, filtered separately, and then recombined in a unique three-lens-filtering setup. An illustrative four-camera night vision system is unique in that its first three cameras separately filter different bands using a subtractive Cyan, Magenta and Yellow (CMY) color filtering-process, while its fourth camera is used to sense either additional IR illuminators or a luminance channel to increase brightness. In some embodiments, the color night vision is implemented to distinguish details of an image in low light. The unique application of the three-lens subtractive CMY filtering allows for better photon scavenging and preservation of important color information.

A time delay integration image sensor may include a number of charge coupled devices (CCDs) that transfer charge in synchronization with the movement of an object being imaged. To increase the dynamic range of the image sensor, the image sensor may include circuitry configured to non-destructively sample the charge as it is transferred through the charge coupled devices. Floating gates may be included in the image sensor and may have a voltage that is proportional to the charge accumulated under the floating gates. Each floating gate may be coupled to a respective readout circuit in an additional substrate by a metal interconnect layer.

A system for inspecting an ophthalmic lens comprising an optical connection: an illumination source 60, wherein the light source is arranged to project the light to wards the ophthalmic lens held in the holder; an optical lens 83, wherein the lens is arranged to condition and project the light beam to illuminate the lens; a swivel glass plate 40, which is arranged to move in and out of the optical axis 110; a bright field imaging unit, wherein the bright field imaging unit is arranged to capture an image projected by the illumination source 60; a dark field imaging unit, wherein the dark field imaging unit is arranged to capture an image projected by the illumination source 60; and at least one camera sensor operatively coupled with the swivel glass plate, wherein the at least one camera sensor is arranged to capture an image of the light penetrating through the optical lens 83 contained at the bottom of the container 50 and the optical module 20 positioned in line with the optical axis 110.